Embedded network on chip accessible to programmable logic fabric of programmable logic device in multi-dimensional die systems

1. An integrated circuit device comprising:

programmable logic fabric disposed on a first integrated circuit die, wherein the programmable logic fabric comprises a first region of programmable logic fabric, wherein the first region of programmable logic fabric is configured to be programmed with a circuit design that operates on a first set of data; and

network on chip (NOC) circuitry disposed on a second integrated circuit die, wherein the NOC circuitry is configured to communicate data between the first integrated circuit die and the second integrated circuit die while at least one powered-down region of programmable logic fabric is disposed between the first region of programmable logic fabric and a second region of programmable logic fabric on the first integrated circuit die.

2. The integrated circuit device of claim 1 , wherein the NOC circuitry is directly accessible by the first region of programmable logic fabric.

3. The integrated circuit device of claim 1 , wherein the NOC circuitry is configured to communicate a second set of data to peripheral circuitry configured to couple to the second integrated circuit die.

4. The integrated circuit device of claim 1 , wherein the at least one powered-down region is one of a plurality of powered down regions disposed between the first region of programmable logic fabric and the second region of programmable logic fabric on the first integrated circuit die.

5. The integrated circuit device of claim 1 , comprising a region-aligned memory disposed on the second integrated circuit die, wherein the region-aligned memory comprises a first region of region-aligned memory directly accessible by the first region of programmable logic fabric and a second region of region-aligned memory directly accessible by a second region of programmable logic fabric.

6. The integrated circuit device of claim 5 , wherein the first region of region-aligned memory is configured to store the first set of data; and wherein the NOC circuitry is disposed between the first region of the region-aligned memory and the second region of the region-aligned memory.

7. The integrated circuit device of claim 1 , wherein the programmable logic fabric comprises a third region comprising a region controller configured to coordinate transfer of the data between configuration memory of the programmable logic fabric and the NOC circuitry.

8. The integrated circuit device of claim 7 , wherein the configuration memory comprises configuration random access memory configured to define one or more operations of a plurality of regions of the programmable logic fabric.

9. The integrated circuit device of claim 1 , wherein the programmable logic fabric comprises a third region comprising a region controller configured to coordinate transfer of the data between configuration memory of the programmable logic fabric and the NOC circuitry by delegating the transfer of the data to a manager component configured to control one or more data transfers between a data register of the programmable logic fabric and the NOC circuitry via a data pathway.

10. The integrated circuit device of claim 1 , wherein the programmable logic fabric comprises a third region comprising a region controller configured to coordinate transfer of the data between in-fabric memory of the programmable logic fabric and the NOC circuitry.

11. An integrated circuit device comprising:

programmable logic fabric disposed on a first integrated circuit die, wherein the programmable logic fabric comprises a first region of programmable logic fabric, wherein the first region of programmable logic fabric is configured to be programmed with a circuit design that operates on a first set of data; and

network on chip (NOC) circuitry disposed on a second integrated circuit die, wherein the NOC circuitry is configured to communicate data between the first integrated circuit die and the second integrated circuit die, wherein the programmable logic fabric comprises a third region comprising a region controller configured to coordinate transfer of the data between in-fabric memory of the programmable logic fabric and the NOC circuitry, and wherein the region controller is configured to coordinate the transfer of the data via a data register of the programmable logic fabric.

12. The integrated circuit device of claim 1 , wherein the programmable logic fabric is configured to directly transfer the data between at least two of a plurality of regions of the programmable logic fabric via the NOC circuitry.

13. A programmable logic device comprising:

a plurality of regions of programmable logic fabric disposed in a first integrated circuit die, wherein the plurality of regions comprises a first set of programmable logic elements controlled by a respective set of configuration memory cells; and

network on chip (NOC) circuitry disposed in a second integrated circuit die, wherein the NOC circuitry is connected to at least one of the plurality of regions of programmable logic fabric via a physical connection, wherein the NOC circuitry is configurable to communicate data between the first integrated circuit die and the second integrated circuit die via the physical connection,

wherein at least one of the plurality of regions comprises a region controller configurable to coordinate transfer of the data between the set of configuration memory cells or in-fabric memory and the NOC circuitry by delegating the transfer of the data to a memory manager component configured to control one or more data transfers between a data register of the programmable logic fabric and the NOC circuitry via the physical connection.

14. The programmable logic device of claim 13 , comprising:

a first region of a region-aligned memory disposed in the second integrated circuit die, wherein the first region of the region-aligned memory is connected to a first region of the plurality of regions of programmable logic fabric via the physical connection; and

a second region of the region-aligned memory disposed in the second integrated circuit die, wherein the second region of the region-aligned memory is connected to a second region of the plurality of regions of programmable logic fabric via an additional physical connection distinct from the physical connection, and wherein the first integrated circuit die and the second integrated circuit die are vertically stacked, such that the first region is aligned with the first region of the region-aligned memory and the second region is aligned with the second region of the region-aligned memory.

15. The programmable logic device of claim 14 , wherein the NOC circuitry is disposed between the first region of the region-aligned memory and the second region of the region-aligned memory.

16. The programmable logic device of claim 13 , wherein one of the plurality of regions comprises a section controller configured to coordinate transfer of the data between configuration memory of the programmable logic fabric and the NOC circuitry.

17. The programmable logic device of claim 13 , wherein one of the plurality of regions comprises a section controller configured to coordinate transfer of the data between the set of configuration memory cells and the NOC circuitry.

18. The programmable logic device of claim 13 , wherein one of the plurality of regions comprises a region controller configured to coordinate transfer of the data between in-fabric memory of the programmable logic fabric and the NOC circuitry.

19. The programmable logic device of claim 18 , wherein the region controller is configured to coordinate the transfer of the data via a data register of the programmable logic fabric.

20. The programmable logic device of claim 13 , wherein the programmable logic fabric is configured to directly transfer the data between a first set of regions of the plurality of regions of the programmable logic fabric and the NOC circuitry.

21. A method for operating a programmable logic device, the method comprising:

requesting, by a circuit design implemented in a first region of programmable logic fabric on a first integrated circuit die, a data transfer from the first region of programmable logic fabric to network on chip (NOC) circuitry disposed on a second integrated circuit die; and

in response to the request, using region control circuitry disposed in the first integrated circuit die, carrying out the data transfer from the first region of programmable logic fabric to the NOC circuitry disposed on the second integrated circuit die via a data path.

22. The method of claim 21 , wherein the data path comprises a direct connection between the first region of the programmable logic fabric and the NOC circuitry.

23. The method of claim 21 , comprising transferring the data from the NOC circuitry to peripheral circuitry on the second integrated circuit die.

24. The method of claim 21 , comprising transferring the data from the NOC circuitry to region-aligned memory on the second integrated circuit die.