IP Library › Granted Patent US 10,923,323
Granted Patent B2
US 10,923,323 · App. 16/021,444 · Granted Feb 16, 2021

Plasma generating unit and plasma processing apparatus

Inventors: Takashi Suzuki (Miyagi, JP); Yoshikazu Azumaya (Miyagi, JP)
Assignee: TOKYO ELECTRON LIMITED
H01J37/32238H01J37/3222H01J37/32229H01J37/32449H01J37/32458H01J2237/332
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Quick Facts
Patent No.
US 10,923,323
App. No.
16/021,444
Granted
Feb 16, 2021
Kind
B2
Abstract

A plasma generating unit capable of improving in-surface uniformity of plasma and a plasma processing apparatus using the same are provided. The plasma generating unit provided in the plasma processing apparatus includes a dielectric window 16 ; a slot plate 20 provided on the dielectric window 16 ; and a coaxial waveguide electrically connected to the slot plate 20 and configured to transmit a microwave. The coaxial waveguide includes an inner conductor 31 ; and an outer conductor 32 configured to surround the inner conductor 31 . The plasma generating unit further includes a pressing component PM configured to elastically press the inner conductor 31 toward the slot plate.

Claims (22)

1. A plasma generating unit provided in a plasma processing apparatus, comprising:

a dielectric window;

a slot plate provided on the dielectric window; and

a coaxial waveguide electrically connected to the slot plate and configured to transmit a microwave, wherein the coaxial waveguide is connected to a microwave generator via a mode converter,

wherein the coaxial waveguide comprises:

an inner conductor; and

an outer conductor configured to surround the inner conductor,

wherein the plasma generating unit further comprises a pressing component configured to elastically press the inner conductor toward the slot plate such that a bottom surface of the inner conductor is in direct contact with a top surface of the slot plate, and

wherein the inner conductor is fixed to a supporting body and the pressing component is provided between the supporting body and the mode converter.

2. The plasma generating unit of claim 1 , further comprising:

a spring provided between the inner conductor and the slot plate.

3. The plasma generating unit of claim 1 , further comprising:

a wavelength shortening plate guide ring provided on the slot plate;

a wavelength shortening plate placed at an inner side of the wavelength shortening plate guide ring such that a position thereof is restricted; and

a temperature control jacket provided on the wavelength shortening plate.

4. The plasma generating unit of claim 3 , further comprising:

a first position fixing pin provided between the dielectric window and the wavelength shortening plate guide ring to be inserted through a positioning hole provided at the slot plate; and

a second position fixing pin provided between the temperature control jacket and the wavelength shortening plate guide ring.

5. The plasma generating unit of claim 3 , further comprising:

a flange component fixed to the outer conductor,

wherein the flange component is engaged with an inner side surface of a through hole provided in the temperature control jacket, and the outer conductor is located within the through hole.

6. A plasma processing apparatus comprising a plasma generating unit, provided at a processing vessel, as claimed in claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2018
From: SUZUKI, TAKASHI; AZUMAYA, YOSHIKAZU
To: TOKYO ELECTRON LIMITED
Reel/Frame 046228/0430 →
Priority Claims (1)
JP 2017-129418 · Jun 30, 2017 · national
Continuity (1)
Related Publication 20190006152A1 · Jan 3, 2019