Split-gate semiconductor device with L-shaped gate
A semiconductor device having a substrate, a dielectric layer over the substrate, a first gate conductor, an inter-gate dielectric structure and a second gate conductor is disclosed. A gate dielectric structure is disposed between the first gate conductor and the dielectric layer, and may include two or more dielectric films disposed in an alternating manner. The inter-gate dielectric structure may be disposed between the first gate conductor and the second gate conductor, and may include two or more dielectric films disposed in an alternating manner. The second gate conductor is formed in an L shape such that the second gate has a relatively low aspect ratio, which allows for a reduction in spacing between adjacent gates, while maintaining the required electrical isolation between the gates and contacts that may subsequently be formed.
1. A semiconductor device, comprising:
a first gate conductor disposed over a first gate dielectric structure on a substrate, wherein the gate dielectric structure comprises a dielectric charge-trapping layer;
a second gate conductor disposed over a second gate dielectric structure on the substrate, the second gate conductor comprising an L shape including a vertical portion adjacent to the first gate conductor and a horizontal portion on an opposite side of the vertical portion from the first gate conductor; and
an inter-gate dielectric structure disposed between the first gate conductor and the second gate conductor,
wherein the first gate conductor is configured to be a memory gate and the second gate conductor is configured to be a select gate of a memory cell.
2. The semiconductor device of claim 1 , wherein one of the first gate dielectric structure or the second gate dielectric structure comprises alternating layers of oxide and nitride dielectric films.
3. The semiconductor device of claim 1 , wherein the first gate conductor comprises polysilicon.
4. The semiconductor device of claim 1 , wherein the inter-gate dielectric structure comprises two or more dielectric films disposed in alternating layers.
5. The semiconductor device of claim 1 , wherein the second gate conductor comprises polysilicon.
6. The semiconductor device of claim 1 , further comprising a first doped region in the substrate adjacent to the horizontal portion of the second gate conductor and a second doped region in the substrate adjacent to the opposite side of the first gate conductor from the second gate conductor.
7. The semiconductor device of claim 1 , further comprising a first spacer disposed on a sidewall of the horizontal portion of the second gate conductor and a second spacer disposed on a sidewall of an opposite side of the first gate conductor from the second gate conductor.
8. The semiconductor device of claim 7 , further comprising a contact electrically coupled to the first doped region.
9. The semiconductor device of claim 8 , further comprising an insulating material disposed over the substrate and between the second gate conductor and the contact, wherein the insulating material comprises no voids.
10. The semiconductor device of claim 9 , wherein the insulating material comprises oxide.
11. A memory array, comprising:
a substrate; and
at least two memory devices, each comprising:
a first gate conductor disposed over a first gate dielectric structure on the substrate, wherein the first gate dielectric structure comprises a dielectric charge-trapping layer;
a second gate conductor disposed over a second gate dielectric structure on the substrate, the second gate conductor comprising an L shape including a vertical portion adjacent to the first gate conductor and a horizontal portion on an opposite side of the vertical portion from the first gate conductor; and
an inter-gate dielectric structure disposed between the first gate conductor and the second gate conductor;
a spacer disposed on a sidewall of the horizontal portion of the second gate conductor and on a sidewall of an opposite side of the first gate conductor from the second gate conductor;
a doped region in the substrate adjacent to the opposite side of the first gate conductor from the second gate conductor;
a contact electrically coupled to the doped region; and
an insulating material disposed over the substrate between the contact and the spacer on the sidewall of the first gate conductor,
wherein the insulating material comprises no voids,
wherein a first memory device and a second memory device are disposed such that the horizontal portion of the second gate conductor of the first memory device is adjacent to the horizontal portion of the second gate conductor of the second memory device.
12. The memory array of claim 11 , wherein the first gate dielectric structure comprises alternating layers of oxide and nitride dielectric films.
13. The memory array of claim 11 , wherein the second gate dielectric structure comprises alternating layers of oxide and nitride dielectric films.
14. The memory array of claim 11 , wherein the first gate conductor comprises polysilicon.
15. The memory array of claim 11 , wherein the inter-gate dielectric structure comprises two or more dielectric films disposed in alternating layers.
16. The memory array of claim 11 , wherein the second gate conductor comprises polysilicon.
17. The memory array of claim 11 , wherein the insulating material comprises oxide.
18. The memory array of claim 11 , wherein the first gate conductor comprises a symmetric profile about an axis perpendicular to a surface of the substrate over which it is disposed.
19. A split gate memory cell, comprising:
a first gate disposed over a first gate dielectric structure on a substrate, wherein the first gate dielectric structure comprises a dielectric charge-trapping layer;
a second gate disposed over a second gate dielectric structure on the substrate, the second gate comprising an L shape including a vertical portion adjacent to the first gate and a horizontal portion on an opposite side of the vertical portion from the first gate;
an inter-gate dielectric structure disposed between first gate and the second gate;
a spacer disposed on a sidewall of the horizontal portion of the second gate and on a sidewall of an opposite side of the first gate from the second gate; and
a doped region in the substrate adjacent to the opposite side of the first gate from the second gate;
a contact electrically coupled to the doped region; and
an insulating material disposed over the substrate between the contact and the spacer on the sidewall of the first gate, wherein the insulating material comprises no voids.
20. The split gate memory cell of claim 19 , wherein one of the first gate dielectric structure or the second gate dielectric structure comprises alternating layers of oxide and nitride dielectric films.
21. The semiconductor device of claim 1 , wherein the first gate conductor comprises a symmetric profile about an axis perpendicular to a surface of the substrate over which it is disposed.