Self-aligned contact process enabled by low temperature

1. A semiconductor device comprising at least:

a substrate;

a semiconductor layer formed on the substrate;

a metal gate structure formed on a portion of the semiconductor layer, wherein a top surface of the semiconductor layer extends higher than a bottom surface of the metal gate structure;

a first epitaxial layer formed on and in contact with source/drain regions of the semiconductor layer and, wherein a bottom surface of the first epitaxial layer is laterally above a bottom surface of the metal gate structure;

a second epitaxial layer formed on a top surface of the first epitaxial layer; and

a dielectric layer formed between and in contact with at least an inner sidewall of the second epitaxial layer, wherein the dielectric layer is further formed above and in contact with the metal gate structure.

2. The semiconductor device of claim 1 , further comprising at least one metal contact in contact with at least a sidewall and a portion of a top surface of the dielectric layer.

3. The semiconductor device of claim 1 , further comprising:

a gate spacer formed on the metal gate structure.

4. The semiconductor device of claim 3 , wherein the first epitaxial layer is formed adjacent to the gate spacer.

5. The semiconductor device of claim 1 , further comprising:

an additional dielectric layer formed on a top surface of the second epitaxial layer.

6. The semiconductor device of claim 5 , further comprising:

at least one metal contact in contact with least a sidewall and a portion of a top surface of the dielectric layer, and at least a sidewall of the additional dielectric layer.

7. The semiconductor device of claim 1 , further comprising:

an additional dielectric layer formed between and in contact with an inner sidewall of the first epitaxial layer and an outer sidewall of a gate spacer formed on the metal gate structure.

8. The semiconductor device of claim 1 , further comprising:

a silicide area formed on and in contact with at least a portion of the at least one of the source/drain regions.

9. The semiconductor device of claim 8 , further comprising at least one metal contact formed on and in contact with the silicide area.

10. The semiconductor device of claim 9 , wherein the at least one metal contact further contacts at least a sidewall and a portion of a top surface of the dielectric layer.

11. The semiconductor device of claim 10 , wherein the at least one metal contact further contacts the second epitaxial layer.

12. A method of forming self-aligned contacts for a semiconductor device, the method comprising:

forming a metal gate structure on a portion of a semiconductor layer of a substrate and contacting inner sidewalls of a gate spacer, the metal gate structure being formed with a bottom surface being lower than a top surface of the semiconductor layer;

forming a first sacrificial epitaxial layer formed on and in contact with source/drain regions of the semiconductor layer, the first sacrificial epitaxial layer being formed with a bottom surface being laterally above a bottom surface of the metal gate structure; and

forming a second sacrificial epitaxial layer on a first sacrificial epitaxial layer.

13. The method of claim 12 , further comprising:

recessing the first and second sacrificial epitaxial layers, the recessing exposing at least a portion of the source/drain regions; and

forming a dielectric layer on the exposed portions of the source/drain regions, and over the gate spacer and metal gate structure.

14. The method of claim 13 , further comprising:

forming at least one cavity within the dielectric layer above at least a portion of one or more of the source/drain regions; and

forming at least one metal contact within the at least one cavity.

15. The method of claim 12 , wherein prior to forming the metal gate structure the method comprises:

forming a replacement gate structure on the portion of the semiconductor layer;

forming the gate spacer on the replacement gate structure;

forming the first sacrificial epitaxial layer on the source/drain regions, wherein forming the first sacrificial epitaxial layer creates a cavity between the first sacrificial epitaxial layer and an outer sidewall of the gate spacer; and

forming a dielectric layer within the cavity between the first sacrificial epitaxial layer and the outer sidewall of the gate spacer.

16. The method of claim 15 , wherein forming the metal gate structure comprises:

removing the replacement gate structure, the removing exposing the portion of the semiconductor layer; and

forming a dielectric spacer on the exposed portion of the semiconductor layer; and

forming a gate conductor within the cavity in contact with the dielectric spacer.

17. The method of claim 12 , wherein the portion of the semiconductor layer comprises a fin structure.

18. The method of claim 12 , further comprising:

forming the first sacrificial epitaxial layer at a first temperature; and

forming the second sacrificial epitaxial layer at a second temperature, wherein the first temperature is higher than the second temperature.

19. The method of claim 14 , wherein prior to recessing the first and second sacrificial epitaxial layers:

forming an additional dielectric layer between and in contact with a first inner sidewall of the second sacrificial epitaxial layer and a second inner sidewall of the second sacrificial epitaxial layer, wherein the dielectric layer is further formed above and in contact with the metal gate structure.

20. The method of claim 19 , wherein the at least one cavity exposes at least a portion of the additional dielectric layer, and wherein the at least one metal contact is further formed on the portion of the additional dielectric layer.