Semiconductor device and method for manufacturing same

1. A semiconductor device, comprising:

a source layer including a semiconductor layer including an impurity;

a stacked body provided above the source layer, the stacked body including a plurality of electrode layers stacked with an insulator interposed;

a gate layer provided between the source layer and the stacked body, the gate layer being thicker than a thickness of one layer of the electrode layers;

a semiconductor body extending in a stacking direction of the stacked body through the stacked body and the gate layer, the semiconductor body further extending in the semiconductor layer where a side wall portion of the semiconductor body contacts the semiconductor layer, the semiconductor body not contacting the electrode layers and the gate layer; and

a charge storage portion provided between the semiconductor body and one of the electrode layers,

wherein an impurity concentration of the side wall portion of the semiconductor body is higher than an impurity concentration of a portion of the semiconductor body opposing the stacked body.

2. The device according to claim 1 , wherein a distance between the side wall portion and a portion of the semiconductor body opposing the gate layer is less than a thickness of the gate layer.

3. The device according to claim 1 , wherein an impurity concentration of a portion of the semiconductor body opposing the gate layer is higher than an impurity concentration of a portion of the semiconductor body opposing the stacked body.

4. The device according to claim 1 , wherein

the electrode layers include:

a drain-side selection gate thinner than the gate layer, the drain-side selection gate being at least one layer;

a source-side selection gate provided between the drain-side selection gate and the gate layer, the source-side selection gate being at least one layer and being thinner than the gate layer; and

a plurality of cell gates opposing the charge storage portion and being provided between the drain-side selection gate and the source-side selection gate, the plurality of cell gates each being thinner than the gate layer.

5. The device according to claim 1 , wherein the gate layer is a silicon layer including phosphorus.

6. The device according to claim 1 , wherein the semiconductor layer is a silicon layer including phosphorus.

7. The device according to claim 1 , wherein

the source layer further includes a layer including a metal, and

the semiconductor layer is provided between the gate layer and the layer including the metal.

8. The device according to claim 1 , wherein the charge storage portion is continuous in the stacking direction between the stacked body and the semiconductor body.

9. The device according to claim 8 , wherein an insulating film is provided between the gate layer and the semiconductor body, the insulating film including the same type of film as the charge storage portion.

10. The device according to claim 8 , wherein an insulating film is provided under a bottom surface of the semiconductor body, the insulating film including the same type of film as the charge storage portion.

11. The device according to claim 1 , wherein

the semiconductor layer includes:

a first semiconductor layer;

a second semiconductor layer provided between the first semiconductor layer and the gate layer; and

a third semiconductor layer provided along an upper surface of the first semiconductor layer, a lower surface of the second semiconductor layer, and the side wall portion of the semiconductor body, and

an air gap is provided between the third semiconductor layer provided on the upper surface of the first semiconductor layer and the third semiconductor layer provided on the lower surface of the second semiconductor layer.

12. The device according to claim 11 , wherein

the electrode layers include:

a drain-side selection gate thinner than the gate layer, the drain-side selection gate being at least one layer;

a source-side selection gate provided between the drain-side selection gate and the gate layer, the source-side selection gate being at least one layer and being thinner than the gate layer; and

a plurality of cell gates opposing the charge storage portion and being provided between the drain-side selection gate and the source-side selection gate, the plurality of cell gates each being thinner than the gate layer.

13. A method for manufacturing a semiconductor device, comprising:

forming a sacrificial layer above a first semiconductor layer;

forming a second semiconductor layer above the sacrificial layer;

forming an insulating layer above the second semiconductor layer;

forming a gate layer above the insulating layer, the gate layer being thicker than the second semiconductor layer;

forming a stacked body above the gate layer, the stacked body including a plurality of first layers and a plurality of second layers, the first layers and the second layers including a first layer and a second layer stacked alternately;

forming a semiconductor body inside a hole, the hole piercing the stacked body, the gate layer, the insulating layer, the second semiconductor layer, and the sacrificial layer;

forming a slit after the forming of the semiconductor body, the slit piercing the stacked body, the gate layer, the insulating layer, and the second semiconductor layer and reaching the sacrificial layer;

forming an air gap between the first semiconductor layer and the second semiconductor layer by removing the sacrificial layer through the slit;

exposing a portion of the semiconductor body in the air gap; and

forming a third semiconductor layer inside the air gap, the third semiconductor layer including an impurity and contacting the portion of the semiconductor body.

14. The method according to claim 13 , wherein

the first semiconductor layer, the second semiconductor layer, the sacrificial layer, and the gate layer are silicon layers,

a protective film is formed between the first semiconductor layer and the sacrificial layer, and between the sacrificial layer and the second semiconductor layer, the protective film being of a material different from the silicon layers, and

the sacrificial layer is removed in a state in which a side surface of the slit is covered with a liner film of a material different from the silicon layers.

15. The method according to claim 13 , wherein

the first semiconductor layer, the second semiconductor layer, and the gate layer are silicon layers, and

the sacrificial layer is a silicon nitride layer.

16. The method according to claim 13 , wherein

an insulating film is formed on a side surface of the hole prior to the forming of the semiconductor body, and

the portion of the semiconductor body is exposed in the air gap by removing a portion of the insulating film exposed in the air gap after the removing of the sacrificial layer.

17. The method according to claim 13 , wherein thermal diffusion of the impurity into the portion of the semiconductor body and into a portion of the semiconductor body opposing the insulating layer is performed in the forming of the third semiconductor layer or after the forming of the third semiconductor layer.

18. The method according to claim 17 , wherein the impurity is diffused also into a portion of the semiconductor body opposing the gate layer.

19. The method according to claim 13 , further comprising replacing the first layers with electrode layers through the slit.

20. A semiconductor device, comprising:

a source layer including a semiconductor layer including an impurity;

a stacked body provided above the source layer, the stacked body including a plurality of electrode layers stacked with an insulator interposed;

a gate layer provided between the source layer and the stacked body, the gate layer being thicker than a thickness of one layer of the electrode layers;

a semiconductor body extending in a stacking direction of the stacked body through the stacked body and the gate layer, the semiconductor body further extending in the semiconductor layer where a side wall portion of the semiconductor body contacts the semiconductor layer, the semiconductor body not contacting the electrode layers and the gate layer; and

a charge storage portion provided between the semiconductor body and one of the electrode layers; and

a substrate, the source layer being provided between the substrate and the gate layer, the semiconductor layer of the source layer contacting the substrate,

wherein

the substrate includes

an n-type semiconductor region contacting the semiconductor layer of the source layer, and

a p-type semiconductor region, the n-type semiconductor region and the p-type semiconductor region forming a p-n junction.

21. The device according to claim 20 , further comprising

a conductive plug provided between the source layer and a peripheral portion of the gate layer, the plug connecting the source layer and the peripheral portion of the gate layer, and

a separation portion separating the gate layer into the peripheral portion and a cell portion.

22. A semiconductor device, comprising:

a source layer including a semiconductor layer including an impurity;

a stacked body provided above the source layer, the stacked body including a plurality of electrode layers stacked with an insulator interposed;

a gate layer provided between the source layer and the stacked body, the gate layer being thicker than a thickness of one layer of the electrode layers;

a semiconductor body extending in a stacking direction of the stacked body through the stacked body and the gate layer, the semiconductor body further extending in the semiconductor layer where a side wall portion of the semiconductor body contacts the semiconductor layer, the semiconductor body not contacting the electrode layers and the gate layer; and

a charge storage portion provided between the semiconductor body and one of the electrode layers; and

a substrate, the source layer being provided between the substrate and the gate layer, the semiconductor layer of the source layer contacting the substrate,

wherein the semiconductor body pierces the source layer, and a lower end portion of the semiconductor body reaches the substrate.

23. The device according to claim 22 , further comprising

a conductive plug provided between the source layer and a peripheral portion of the gate layer, the plug connecting the source layer and the peripheral portion of the gate layer, and

a separation portion separating the gate layer into the peripheral portion and a cell portion.