Substrate processing apparatus, and operation method for substrate processing apparatus
A substrate processing apparatus includes a chamber main body, a stage, a cooling device and a local loop. The stage is provided in an internal space of the chamber main body and a coolant path is formed in the stage. The cooling device is provided at an outside of the chamber main body. The cooling device includes a cooling loop having a compressor, a condenser, an expansion valve and an evaporator. The local loop is provided at a position closer to the chamber main body than the cooling device is. The local loop includes a receiver, a flow velocity controller and an evaporator pressure regulating valve. The receiver stores therein the coolant supplied from the cooling device. In this substrate processing apparatus, the coolant stored in the receiver can be circulated within the local loop.
1. A substrate processing apparatus, comprising:
a chamber main body;
a stage, having a coolant path formed therein, provided in an internal space of the chamber main body and configured to support a substrate placed thereon;
a cooling device, provided at an outside of the chamber main body, comprising a cooling loop having a compressor, a condenser, a first expansion valve and an evaporator;
a local loop, provided at a position closer to the chamber main body than the cooling device is, comprising a receiver configured to store coolant therein, and an evaporator pressure regulating valve connected between the coolant path and the receiver;
a first valve connected between the condenser and the first expansion valve within the cooling loop;
a supply path having one end connected to the cooling loop between the first valve and the condenser and the other end connected to the receiver;
a second valve provided on the supply path;
a second expansion valve provided on the supply path between the second valve and the receiver; and
a discharge path having one end connected to the local loop at an output side of the evaporator pressure regulating valve and the other end connected to the cooling loop between the first expansion valve and the evaporator.
2. The substrate processing apparatus of claim 1 ,
wherein the substrate processing apparatus is configured as a plasma processing apparatus, and
the stage comprises a base in which the coolant path is formed and an electrostatic chuck provided on the base.
3. The substrate processing apparatus of claim 1 ,
wherein the stage has an inlet for the coolant into the coolant path and an outlet for the coolant from the coolant path,
the outlet is provided at a position closer to a periphery of the stage than the inlet is, and
the coolant path is inclined to approach a top surface of the stage as it goes from the inlet toward the outlet.
4. The substrate processing apparatus of claim 3 ,
wherein the outlet is provided within the coolant path, and disposed at a position higher than a lower wall surface confining the coolant path in a vertical direction.
5. A substrate processing apparatus, comprising:
a chamber main body;
a stage, having a coolant path formed therein, provided in an internal space of the chamber main body and configured to support a substrate placed thereon;
a cooling device, provided at an outside of the chamber main body, comprising a cooling loop having a compressor, a condenser, a first expansion valve and an evaporator;
a local loop, provided at a position closer to the chamber main body than the cooling device is, comprising a receiver configured to store coolant therein, and an evaporator pressure regulating valve connected between the coolant path and the receiver;
a supply path having one end connected to the cooling loop and the other end connected to the receiver;
a single three-way valve connected between the condenser, the first expansion valve and the supply path;
a second expansion valve provided on the supply path between the three-way valve and the receiver; and
a discharge path having one end connected to the local loop at an output side of the evaporator pressure regulating valve and the other end connected to the cooling loop between the first expansion valve and the evaporator.
6. The substrate processing apparatus of claim 5 ,
wherein the substrate processing apparatus is configured as a plasma processing apparatus, and
the stage comprises a base in which the coolant path is formed and an electrostatic chuck provided on the base.
7. The substrate processing apparatus of claim 5 ,
wherein the stage has an inlet for the coolant into the coolant path and an outlet for the coolant from the coolant path,
the outlet is provided at a position closer to a periphery of the stage than the inlet is, and
the coolant path is inclined to approach a top surface of the stage as it goes from the inlet toward the outlet.
8. The substrate processing apparatus of claim 7 ,
wherein the outlet is provided within the coolant path, and disposed at a position higher than a lower wall surface confining the coolant path in a vertical direction.