Integrated circuit filler and method thereof
Provided is a method for inserting a pre-designed filler cell, as a replacement to a standard filler cell, including identifying at least one gap among a plurality of functional cells. In some embodiments, a pre-designed filler cell is inserted within the at least one gap. By way of example, the pre-designed filler cell includes a layout design having a pattern associated with a particular failure mode. In various embodiments, a layer is patterned on a semiconductor substrate such that the pattern of the layout design is transferred to the layer on the semiconductor substrate. Thereafter, the patterned layer is inspected using an electron beam (e-beam) inspection process.
1. An integrated circuit, comprising:
a plurality of functional cells including at least one gap disposed adjacent to at least one functional cell of the plurality of functional cells;
a pre-designed filler cell disposed within the at least one gap, wherein the pre-designed filler cell is associated with a particular failure mode, and wherein the particular failure mode includes a potential failure mode of the at least one functional cell; and
a standard filler cell disposed within the at least one gap.
2. The integrated circuit of claim 1 , wherein the pre-designed filler cell includes a repeated pattern array.
3. The integrated circuit of claim 1 , further comprising:
a plurality of gaps disposed among the plurality of functional cells; and
a plurality of pre-designed filler cells, wherein at least one pre-designed filler cell of the plurality of pre-designed filler cells is disposed within each of the plurality of gaps and is adjacent to a particular functional cell, and wherein the at least one pre-designed filler cell is associated with a potential failure mode of the adjacent particular functional cell.
4. The integrated circuit of claim 1 , wherein the plurality of functional cells define at least part of a static random access memory (SRAM).
5. The integrated circuit of claim 1 , wherein the standard filler cell includes an irregular pattern.
6. The integrated circuit of claim 1 , wherein the pre-designed filler cell is configured to enhance electron beam (e-beam) inspection sensitivity for the particular failure mode.
7. The integrated circuit of claim 1 , wherein the particular failure mode includes at least one of an electrical short failure mode, a metal extrusion failure mode, an under-etch failure mode, an over-etch failure mode, a cut-poly failure mode, a cut-metal failure mode, a line spacing failure mode, a line pattern failure mode, and a threshold voltage failure mode.
8. The integrated circuit of claim 1 , wherein the pre-designed filler cell provides well continuity between at least some of the plurality of functional cells.
9. The integrated circuit of claim 1 , further comprising a dummy cell spaced at least 0.2 microns from the plurality of functional cells.
10. The integrated circuit of claim 1 , wherein the plurality of functional cells and the pre-designed filler cell are disposed within a semiconductor substrate.
11. A semiconductor device, comprising:
a substrate having a patterned layer disposed thereon;
wherein the patterned layer includes a first patterned region defining at least one functional cell;
wherein the patterned layer includes a second patterned region adjacent to the first patterned region, wherein the second patterned region defines a pre-designed filler cell including a repeated pattern array, and wherein the pre-designed filler cell is associated with a failure mode of the at least one functional cell; and
wherein the patterned layer further includes a third patterned region adjacent to the second patterned region, and wherein the third patterned region defines a standard filler cell.
12. The semiconductor device of claim 11 , wherein the standard filler cell includes an irregular pattern.
13. The semiconductor device of claim 11 , wherein the semiconductor device includes a static random access memory (SRAM).
14. The semiconductor device of claim 11 , wherein the pre-designed filler cell provides well continuity between the at least one functional cell and another functional cell.
15. The semiconductor device of claim 11 , wherein the pre-designed filler cell provides at least one of a power signal and a ground signal to the at least one functional cell.
16. An SRAM circuit, comprising:
a patterned region including a plurality of functional cells, wherein the plurality of functional cells occupy a first portion of the patterned region; and
a plurality of filler cells that occupy a second portion of the patterned region different than the first portion, wherein each of the plurality of filler cells include a repeated pattern array;
at least one standard filler cell within the second portion of the patterned region; and
wherein each of the plurality of filler cells is associated with a particular failure mode, and wherein the particular failure mode of a given filler cell includes a potential failure mode of a functional cell adjacent to the given filler cell.
17. The SRAM circuit of claim 16 , wherein the at least one standard filler cell includes an irregular pattern.
18. The SRAM circuit of claim 16 , wherein the plurality of filler cells includes a plurality of pre-designed filler cells.
19. The SRAM circuit of claim 16 , wherein the particular failure mode includes at least one of an electrical short failure mode, a metal extrusion failure mode, an under-etch failure mode, an over-etch failure mode, a cut-poly failure mode, a cut-metal failure mode, a line spacing failure mode, a line pattern failure mode, and a threshold voltage failure mode.
20. The SRAM circuit of claim 16 , further comprising a dummy cell spaced at least 0.2 microns from the plurality of functional cells.