Multi-RDL structure packages and methods of fabricating the same

1. An apparatus, comprising:

a first redistribution layer structure;

a second redistribution layer structure mounted on the first redistribution layer structure, the first redistribution layer structure and the second redistribution layer structure being separated by a gap;

a first semiconductor chip mounted on the second redistribution layer structure and electrically connected to both the second redistribution layer structure and the first redistribution layer structure; and

plural surface components mounted on the first redistribution layer structure in spaced-apart relation to the first semiconductor chip.

2. The apparatus of claim 1 , wherein the first redistribution layer structure comprises a first plurality of I/Os to electrically interface with a circuit board.

3. The apparatus of claim 1 , comprising a second plurality of I/Os to electrically interface the second redistribution layer structure and the first redistribution layer structure.

4. The apparatus of claim 1 , comprising plural bumpless interconnects to electrically connect the first semiconductor chip to the second redistribution layer structure.

5. The apparatus of claim 1 , comprising a first molding material encasing the plural surface components.

6. The apparatus of claim 1 , comprising a first molding material at least partially encasing the first semiconductor chip.

7. The apparatus of claim 1 , comprising a second semiconductor chip mounted on the second redistribution layer structure in spaced-apart relation to the first semiconductor chip, the second redistribution layer structure electrically connecting the first semiconductor chip to the second semiconductor chip.

8. The apparatus of claim 1 , wherein the first redistribution layer structure includes plural conductor structures of a first design rule and the second redistribution layer structure includes plural conductor structures of a second design rule with finer line width and spacing than the first design rule.

9. An apparatus, comprising:

a first redistribution layer structure having plural conductor structures of a first design rule and a first plurality of I/Os to connect the first redistribution layer structure to another circuit board;

a second redistribution layer structure mounted on the first redistribution layer structure, the first redistribution layer structure and the second redistribution layer structure being separated by a gap, the second redistribution layer structure having plural conductor structures of a second design rule with finer line width and spacing than the first design rule; and

a first semiconductor chip mounted on the second redistribution layer structure and electrically connected to both the second redistribution layer structure and the first redistribution layer structure.

10. The apparatus of claim 9 , comprising a second plurality of I/Os to electrically interface the second redistribution layer structure and the first redistribution layer structure.

11. The apparatus of claim 9 , comprising plural bumpless interconnects to electrically connect the first semiconductor chip to the second redistribution layer structure.

12. The apparatus of claim 9 , comprising a first molding material at least partially encasing the first semiconductor chip.

13. The apparatus of claim 9 , comprising a second semiconductor chip mounted on the second redistribution layer structure in spaced-apart relation to the first semiconductor chip, the second redistribution layer structure electrically connecting the first semiconductor chip to the second semiconductor chip.

14. The apparatus of claim 9 , comprising plural surface components mounted on the first redistribution layer structure in spaced-apart relation to the first semiconductor chip.

15. An apparatus, comprising:

a first redistribution layer structure;

a second redistribution layer structure mounted on the first redistribution layer structure, the first redistribution layer structure and the second redistribution layer structure being separated by a gap;

a first semiconductor chip mounted on the second redistribution layer structure and electrically connected to both the second redistribution layer structure and the first redistribution layer structure;

a first molding material at least partially encasing the first semiconductor chip; and

a second molding material on the first redistribution layer structure at least partially encasing the second redistribution layer structure.

16. The apparatus of claim 15 , wherein the first redistribution layer structure comprises a first plurality of I/Os to electrically interface with a circuit board.

17. The apparatus of claim 15 , comprising a second plurality of I/Os to electrically interface the second redistribution layer structure and the first redistribution layer structure.

18. The apparatus of claim 15 , comprising plural bumpless interconnects to electrically connect the first semiconductor chip to the second redistribution layer structure.

19. The apparatus of claim 15 , comprising plural surface components mounted on the first redistribution layer structure in spaced-apart relation to the first semiconductor chip.

20. The apparatus of claim 15 , comprising a second semiconductor chip mounted on the second redistribution layer structure in spaced-apart relation to the first semiconductor chip, the second redistribution layer structure electrically connecting the first semiconductor chip to the second semiconductor chip.

21. The apparatus of claim 15 , wherein the first redistribution layer structure includes plural conductor structures of a first design rule and the second redistribution layer structure includes plural conductor structures of a second design rule with finer line width and spacing than the first design rule.