IP Library Granted Patent US 10,783,220
Granted Patent B2
US 10,783,220 · App. 16/053,158 · Granted Sep 22, 2020

Data processing method, data processing apparatus and processing apparatus

Inventors: Seiichi Watanabe (Tokyo, JP); Satomi Inoue (Tokyo, JP); Shigeru Nakamoto (Tokyo, JP); Kousuke Fukuchi (Tokyo, JP)
Assignee: HITACHI HIGH-TECH CORPORATION
G06F17/18H01J37/32963H01L22/26
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Quick Facts
Patent No.
US 10,783,220
App. No.
16/053,158
Granted
Sep 22, 2020
Kind
B2
Abstract

The present invention is a data processing apparatus including a data input/output device for receiving data, a storage for storing the data received by the data input/output device, a data processing program storage for storing a data processing program that includes the steps of calculating, using a double exponential smoothing method, a first predicted value that is a predicted value of smoothed data and a second predicted value that is a predicted value of the gradient of the smoothed data, and calculating, using a double exponential smoothing method in which the second predicted value is set as input data, a third predicted value that is a predicted value of smoothed data and a fourth predicted value that is a predicted value of the gradient of the smoothed data, and a data calculation processing apparatus for performing the data processing under the data processing program.

Claims (31)

1. A data processing method for processing data for controlling a plasma processing apparatus, using a double exponential smoothing method, the method comprising the steps of:

obtaining, by a measuring device, data related to a plasma processing chamber in which a sample is subjected to a plasma process;

receiving, by a data input/output device, the obtained data;

storing the data in a storage;

calculating, by a calculation processing apparatus, using a double exponential smoothing method in which the data is set as input data, a first predicted value that is a predicted value of smoothed data and a second predicted value that is a predicted value of a gradient of the smoothed data, as output data;

calculating, by the calculation processing apparatus, using a double exponential smoothing method in which the second predicted value is set as input data, a third predicted value that is a predicted value of smoothed data and a fourth predicted value that is a predicted value of a gradient of the smoothed data, as output data;

detecting an end point of the plasma process based on the first predicted value, the second predicted value or the third predicted value, and the fourth predicted value; and

controlling the plasma processing apparatus based on the detected end point.

2. The data processing method according to claim 1 , further comprising the step of:

outputting, by the data input/output device, the first predicted value as a result of a data smoothing process, the second predicted value or the third predicted value as a result of a first differential process, and the fourth predicted value as a result of a second differential process, respectively.

3. The data processing method according to claim 1 , further comprising the steps of:

calculating, by the calculation processing apparatus, an approximate polynomial of an arbitrary number of pieces of data immediately following a start of data input; and

calculating, by the calculation processing apparatus, using the approximate polynomial, a fifth predicted value that is a predicted value of smoothed data preceding the start of data input, and a sixth predicted value that is a predicted value of a gradient of smoothed data preceding the start of data input,

wherein, in the step of calculating, using the double exponential smoothing method, the first predicted value that is the predicted value of smoothed data and the second predicted value that is the predicted value of the gradient of the smoothed data, the first predicted value and the second predicted value are calculated as the fifth predicted value and the sixth predicted value are set as initial values.

4. A data processing method for processing data for controlling a plasma processing apparatus, using a double exponential smoothing method, the method comprising the steps of:

obtaining, by a measuring device, data related to a plasma processing chamber in which a sample is subjected to a plasma process;

receiving, by a data input/output device, the obtained data;

storing the data in a storage;

calculating, by a calculation processing apparatus, an approximate polynomial of an arbitrary number of pieces of data following a start of data input;

calculating, by the calculation processing apparatus, using the approximate polynomial, a first predicted value that is a predicted value of smoothed data preceding a start of data input, and a second predicted value that is a predicted value of a gradient of smoothed data preceding a start of data input;

subjecting the data to a double exponential smoothing process as the first predicted value and the second predicted value are set as initial values;

detecting an end point of the plasma process based on a result of the double exponential smoothing process; and

controlling the plasma processing apparatus based on the detected end point.

5. The data processing method according to claim 4 , wherein smoothing parameters are varied in accordance with an error between input data and smoothed data, wherein the data is processed while making a lower limit value of a variable range of the smoothing parameters greater than zero.

6. The data processing method according to claim 4 , wherein when N denotes a natural number of 3 or more, the data is subjected to an N-tuple exponential smoothing process, and the N-tuple exponential smoothing process is a data process to successively perform a data smoothing process on the data and perform a first to (N−1)th smoothing processes to gradient of smoothed data.

7. The data processing method according to claim 6 , wherein

when the N is 3, a 3-tuple exponential smoothing process calculates a predicted value of the smoothed data, a predicted value of gradient of the smoothed data and a predicted value of gradient in gradient of the smoothed data.

8. A plasma processing method for subjecting a sample to a plasma process, the method comprising the steps of:

measuring light emission data in the plasma process of the sample;

processing, using a responsive double exponential smoothing method and smoothing parameters are varied in accordance with an error between the measured light emission data and a predicted value of smoothed light emission data, the light emission data while making a lower limit value of a variable range of the smoothing parameters greater than zero; and

controlling the plasma process of the sample according to a detected plasma processing state of the sample or a change in the detected plasma processing state of the sample on the basis of at least one of a result of a data smoothing process calculated by the responsive double exponential smoothing method, a result of a first differential process calculated by the responsive double exponential smoothing method, and a result of a second differential process calculated by the responsive double exponential smoothing method.

Assignments (1)
CHANGE OF NAME Recorded Mar 25, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052220/0045 →
Priority Claims (2)
JP 2013-246891 · Nov 29, 2013 · national
JP 2014-111875 · May 30, 2014 · national
Continuity (2)
Continuation 14447692 · Jul 31, 2014
Related Publication 20180341625A1 · Nov 29, 2018