Semiconductor device and manufacturing method thereof
View Patent ↗Provided are a transistor which has electrical characteristics requisite for its purpose and uses an oxide semiconductor layer and a semiconductor device including the transistor. In the bottom-gate transistor in which at least a gate electrode layer, a gate insulating film, and the semiconductor layer are stacked in this order, an oxide semiconductor stacked layer including at least two oxide semiconductor layers whose energy gaps are different from each other is used as the semiconductor layer. Oxygen and/or a dopant may be added to the oxide semiconductor stacked layer.
1. A semiconductor device comprising:
an oxide semiconductor stacked layer comprising a first oxide semiconductor layer, a second oxide semiconductor layer over the first oxide semiconductor layer, and a third oxide semiconductor layer over the second oxide semiconductor layer;
a gate electrode layer; and
a gate insulating film between the gate electrode layer and the oxide semiconductor stacked layer,
wherein the gate electrode layer and the oxide semiconductor stacked layer overlap each other,
wherein the third oxide semiconductor layer is in direct contact with a side surface of the first oxide semiconductor layer and a side surface of the second oxide semiconductor layer, and
wherein each of the first oxide semiconductor layer, the second oxide semiconductor layer and the third oxide semiconductor layer comprise indium and zinc.
2. The semiconductor device according to claim 1 ,
wherein each of the first oxide semiconductor layer and the third oxide semiconductor layer further comprise gallium.
3. The semiconductor device according to claim 2 ,
wherein a proportion of gallium with respect to indium in the third oxide semiconductor layer is greater than a proportion of gallium with respect to indium in the second oxide semiconductor layer.
4. The semiconductor device according to claim 1 ,
wherein the second oxide semiconductor layer further comprises Sn.
5. The semiconductor device according to claim 1 , further comprising a first insulating film on and in direct contact with the third oxide semiconductor layer,
wherein the first insulating film comprises aluminum and oxygen.
6. The semiconductor device according to claim 1 ,
wherein an energy gap of the second oxide semiconductor layer is smaller than an energy gap of the third oxide semiconductor layer, and
wherein an energy gap of the second oxide semiconductor layer is smaller than an energy gap of the first oxide semiconductor layer.
7. The semiconductor device according to claim 1 ,
wherein the second oxide semiconductor layer comprises a crystal including a c-axis alignment.
8. A semiconductor device comprising:
an oxide semiconductor stacked layer comprising a first oxide semiconductor layer, a second oxide semiconductor layer over the first oxide semiconductor layer, and a third oxide semiconductor layer over the second oxide semiconductor layer;
a gate electrode layer;
a gate insulating film between the gate electrode layer and the oxide semiconductor stacked layer; and
a first insulating film on and in direct contact with the third oxide semiconductor layer,
wherein the gate electrode layer and the oxide semiconductor stacked layer overlap each other,
wherein the third oxide semiconductor layer is in direct contact with a side surface of the first oxide semiconductor layer and a side surface of the second oxide semiconductor layer, and
wherein each of the first oxide semiconductor layer, the second oxide semiconductor layer and the third oxide semiconductor layer comprise indium and zinc.
9. The semiconductor device according to claim 8 ,
wherein each of the first oxide semiconductor layer and the third oxide semiconductor layer further comprise gallium.
10. The semiconductor device according to claim 9 ,
wherein a proportion of gallium with respect to indium in the third oxide semiconductor layer is greater than a proportion of gallium with respect to indium in the second oxide semiconductor layer.
11. The semiconductor device according to claim 8 ,
wherein the second oxide semiconductor layer further comprises Sn.
12. The semiconductor device according to claim 8 ,
wherein the first insulating film comprises aluminum and oxygen.
13. The semiconductor device according to claim 8 ,
wherein the first insulating film comprises silicon and oxygen.