Alternative target design for metrology using modulation techniques
A target structure, wherein the target structure is configured to be measured with a metrology tool that has a diffraction threshold; the target structure including: one or more patterns supported on a substrate, the one or more patterns being periodic with a first period in a first direction and periodic with a second period in a second direction, wherein the first direction and second direction are different and parallel to the substrate, and the first period is equal to or greater than the diffraction threshold and the second period is less than the diffraction threshold.
1. A target structure, wherein the target structure is configured to be measured with a metrology tool that has a diffraction threshold, the target structure comprising:
one or more patterns supported on a substrate, the one or more patterns being periodic with a first period in a first direction and periodic with a second period in a second direction, the first direction and second direction being different and parallel to the substrate,
wherein the first period is equal to or greater than the diffraction threshold and the second period is less than the diffraction threshold such that radiation from the target has fewer one or more orders of radiation in the second direction than one or more orders of radiation in the first direction, and
wherein the one or more patterns are configured to enhance a first order of the diffraction from the target structure in the first direction at the expense of an order of the diffraction higher than the first order.
2. The target structure of claim 1 , wherein the one or more patterns are configured such that diffraction from the target structure in the second direction has only a zero-th order.
3. The target structure of claim 1 , wherein the one or more patterns are configured such that the metrology tool is able to measure alignment or overlay from the one or more patterns.
4. The target structure of claim 1 , wherein the one or more patterns are formed with a photoresist, and/or wherein the one or more patterns are etched into the substrate.
5. The target structure of claim 1 , wherein the one or more patterns have a different height in a direction perpendicular to the substrate than one or more objects surrounding the one or more patterns.
6. The target structure of claim 1 , wherein the one or more patterns have a different optical property than one or more objects surrounding the one or more patterns.
7. The target structure of claim 1 , wherein the first direction is perpendicular to the second direction.
8. The target structure of claim 1 , wherein the first period is a period of a dimension of the one or more patterns in a direction other than the first direction.
9. The target structure of claim 1 , wherein a dimension of the one or more patterns in a direction other than the first direction is a sine function of a location of the one or more patterns in the first direction.
10. The target structure of claim 1 , wherein the one or more patterns comprise lines in the second direction.
11. The target structure of claim 10 , wherein the lines have an equal size in the first direction, or wherein each of the lines has a uniform size in the first direction.
12. A substrate, comprising the target structure of claim 1 , and one or more patterns representing a structure of an electronic device.
13. A method of measuring overlay between structures of two different layers of an electronic device, where each of the two layers comprises a target structure and at least one of the target structures of the two layers is the target structure of claim 1 , the method comprising:
measuring diffraction orders from the target structures; and
determining an overlay error from the diffraction orders.
14. A method of aligning to an existing structure on a substrate, wherein the substrate comprises the target structure of claim 1 , the method comprising:
measuring diffraction orders from the target structure; and
determining an alignment error from the diffraction orders.
15. A method of measuring alignment or overlay using a target structure on a substrate, the method comprising:
measuring orders of diffraction in a first direction from the target structure,
wherein the target structure is configured to enhance a first order of the diffraction in the first direction at the expense of an order of the diffraction higher than the first order, and
wherein diffraction from the target structure in a second direction has only a zero-th order such that radiation from the target has fewer one or more orders of radiation in the second direction than the orders in the first direction, the first direction and the second direction being different and parallel to the substrate; and
determining an alignment error or an overlay error from the orders of the diffraction in the first direction.
16. The method of claim 15 , wherein orders of the diffraction in the first direction higher than the first order are not enhanced by the target structure.
17. The method of claim 15 , wherein the first direction is perpendicular to the second direction.
18. The method of claim 15 , wherein the target structure comprises one or more patterns, the one or more patterns being periodic with a first period in the first direction and periodic with a second period in the second direction.
19. The method of claim 18 , wherein the first period is a period of a dimension of the one or more patterns in a direction other than the first direction.
20. The method of claim 15 , wherein the target structure comprises lines in the second direction, wherein the lines have an equal size in the first direction and/or each of the lines has a uniform size in the first direction.