Curable resin composition, cured product thereof, and semiconductor device
An object of the present invention is to provide a curable resin composition for forming a less tacky cured product, having excellent gas barrier properties and heat and light resistance. This curable resin composition comprises the following components (A), (B), and (C): (A): a polyorganosiloxane represented by the following average unit formula: (SiO 4/2 ) a1 (R 1 SiO 3/2 ) a2 (R 1 2 SiO 2/2 ) a3 (R 1 3 SiO 1/2 ) a4 wherein each R 1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R 1 , and a1>0, a2>0, a3≥0, a4>0, 0.5≤a1/a2≤10, and a1+a2+a3+a4=1; (B) a polyorganosiloxane represented by the following average composition formula: R 2 m H n SiO [(4−m−n)/2] wherein R 2 is alkyl or aryl, and 0.7≤m≤2.1, 0.001≤n≤1.0, and 0.8≤m+n≤3; and (C): a hydrosilylation catalyst.
1. A curable resin composition comprising the following components (A), (B), and (C):
(A): a polyorganosiloxane represented by the following average unit formula (I):
(SiO 4/2 ) a1 (R 1 SiO 3/2 ) a2 (R 1 2 SiO 2/2 ) a3 (R 1 3 SiO 1/2 ) a4 (I)
wherein each R 1 is the same or different and is an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 14 carbon atoms, an alkenyl group having 2 to 8 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, or a hydroxyl group,
when a percentage of the alkyl group is X mol %, a percentage of the aryl group is Y mol %, and a percentage of the alkenyl group is Z mol % based on the total amount (100 mol %) of R 1 , X is 50 to 98 mol %, Y is 1 to 50 mol %, and Z is 1 to 35 mol %, and
a1, a2, a3, and a4 are numbers satisfying a1>0, a2>0, a3≥0, a4>0, 0.5≤a1/a2≤10, and a1+a2+a3+a4=1;
(B): a polyorganosiloxane represented by the following average composition formula (II):
R 2 m H n SiO [(4−m−n)/2] (II)
wherein each R 2 is the same or different and is an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 14 carbon atoms and at least one of R 2 is an aryl group, at least 2 hydrogen atoms are bonded to one or more silicon atoms, and m and n are numbers satisfying 0.7<m≤2.1, 0.001≤n≤1, and 0.8≤m+n≤3; and
(C): a hydrosilylation catalyst,
wherein the component (B) comprises a component (B1) at a content of not less than 1 wt % and not more than 99 wt %,
the component (B1) being represented by the following formula (II-1):
wherein each R 21 is the same or different and represents an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 14 carbon atoms, at least one of R 21 is an aryl group, and x represents an integer of 0 to 1000, and
the component (B1) being a liquid having a viscosity at 25° C. of 10000 mPa·s or less.
2. The curable resin composition according to claim 1 , wherein the component (A) is a polyorganosiloxane that has a weight-average molecular weight of not less than 500 and not more than 50000 in terms of polystyrene, has a molecular weight distribution of not less than 1 and not more than 4, and is a liquid or solid having a viscosity at 25° C. of 10 mPa·s or more.
3. The curable resin composition according to claim 1 , wherein a ratio of X to Y (X/Y) in the component (A) is 0.5 to 25.
4. The curable resin composition according to claim 1 , further comprising the following component (D):
(D): a polyorganosiloxysilalkylene having a group containing one or more aliphatic carbon-carbon unsaturated bonds in a molecule.
5. The curable resin composition according to claim 1 , further comprising the following component (E):
(E): at least one zinc compound selected from the group consisting of zinc carboxylates and zinc-β-diketone complexes.
6. The curable resin composition according to claim 5 , wherein a content of the component (E) is 0.01 to 1 wt %, based on the total amount (100 wt %) of the curable resin composition.
7. The curable resin composition according to claim 1 , further comprising an isocyanurate compound (F) represented by the following formula (2):
wherein R f , R g , and R h are the same or different and each represent a group represented by formula (2a) or a group represented by formula (2b), provided that at least one of R f , R g , and R h is a group represented by formula (2b):
wherein R′ is a hydrogen atom, or a straight-chain or branched-chain C 1-8 alkyl group; and
wherein R j is a hydrogen atom or a straight-chain or branched-chain C 1-8 alkyl group.
8. The curable resin composition according to claim 1 , further comprising a silane coupling agent (G).
9. A cured product of the curable resin composition according to claim 1 .
10. The cured product according to claim 9 , wherein a refractive index at 589 nm thereof is not less than 1.46 and not more than 1.54.
11. The curable resin composition according to claim 1 , wherein the curable resin composition is an encapsulating agent.
12. The curable resin composition according to claim 1 , wherein the curable resin composition is a lens-forming resin composition.
13. A semiconductor device comprising a semiconductor element and an encapsulant that encapsulates the semiconductor element, wherein the encapsulant is a cured product of the curable resin composition according to claim 11 .
14. A semiconductor device comprising a semiconductor element and a lens, wherein the lens is a cured product of the curable resin composition according to claim 12 .
15. A semiconductor device comprising a semiconductor element, an encapsulant that encapsulates the semiconductor element, and a lens, wherein the encapsulant is a cured product of the curable resin composition according to claim 11 and the lens is a cured product of the curable resin composition, wherein said curable composition in the lens is a lens forming resin composition.
16. The semiconductor device according to claim 13 , wherein a refractive index at 589 nm of the cured product is not less than 1.46 and not more than 1.54.
17. The semiconductor device according to claim 13 , wherein the semiconductor device is an optical semiconductor device.