Oxide semiconductor based memory device
A memory device with reduced power consumption is provided. The memory device includes a plurality of memory cells, a precharge circuit, a latch circuit, a bit line pair, and a local bit line pair. The precharge circuit has a function of supplying precharge voltage to the local bit line pair. The plurality of memory cells are connected to the local bit line pair. The latch circuit is connected to the local bit line pair. The latch circuit in a standby state is preferably supplied with the precharge voltage and one of low power supply voltage and high power supply voltage.
1. A memory device comprising:
a plurality of memory cells;
a precharge circuit;
a latch circuit electrically connected to a first wiring and a second wiring;
a bit line pair comprising a first bit line and a second bit line;
a local bit line pair comprising a first local bit line and a second local bit line;
a third transistor between the first bit line and the first local bit line; and
a fourth transistor between the second bit line and the second local bit line,
wherein each of the plurality of memory cells comprises a first transistor between the first local bit line and a first capacitor, and a second transistor between the second local bit line and a second capacitor,
wherein the precharge circuit is configured to supply a precharge voltage to the local bit line pair,
wherein the first wiring is configured to supply a high power supply voltage,
wherein the second wiring is configured to a low power supply voltage, and
wherein, in a period when the first transistor, the second transistor, the third transistor, and the fourth transistor are off, a potential of one of the first wiring and the second wiring is the precharge voltage, and, at the same time, a potential of the other of the first wiring and the second wiring is one of the high power supply voltage and the low power supply voltage.
2. The memory device according to claim 1 ,
wherein each of the first transistor and the second transistor comprises an oxide semiconductor in a channel formation region.
3. The memory device according to claim 1 ,
wherein the plurality of memory cells are positioned over the precharge circuit.
4. The memory device according to claim 1 , wherein the plurality of memory cells are positioned over the latch circuit.
5. The memory device according to claim 1 , wherein the latch circuit comprises an SRAM cell.
6. A semiconductor wafer comprising the memory device according to claim 1 .
7. An electronic device comprising the memory device according to claim 1 .
8. A memory device comprising:
a memory cell comprising a first transistor, a first capacitor, a second transistor, and a second capacitor; and
a latch circuit electrically connected to a first local bit line, a second local bit line, a first wiring, and a second wiring,
wherein one of a source and a drain of the first transistor is electrically connected to the first local bit line,
wherein the other of the source and the drain of the first transistor is electrically connected to the first capacitor,
wherein one of a source and a drain of the second transistor is electrically connected to the second local bit line,
wherein the other of the source and the drain of the second transistor is electrically connected to the second capacitor,
wherein the first wiring is configured to supply a high power supply voltage,
wherein the second wiring is configured to a low power supply voltage, and
wherein, in a period when the first transistor and the second transistor are off, a potential of one of the first wiring and the second wiring is a precharge voltage, and, at the same time, a potential of the other of the first wiring and the second wiring is one of the high power supply voltage and the low power supply voltage.
9. The memory device according to claim 8 , wherein each of the first transistor and the second transistor comprises an oxide semiconductor in a channel formation region.
10. The memory device according to claim 8 , wherein the memory cell is positioned over the latch circuit.
11. The memory device according to claim 8 , wherein the latch circuit comprises an SRAM cell.
12. A semiconductor wafer comprising the memory device according to claim 8 .
13. An electronic device comprising the memory device according to claim 8 .
14. The memory device according to claim 1 ,
wherein each of the first transistor and the second transistor comprises a first gate and a second gate,
wherein the first gate of the first transistor and the first gate of the second transistor are electrically connected a row driver through a third wiring, and
wherein the second gate of the first transistor is electrically connected to the second gate of the second transistor.
15. The memory device according to claim 1 ,
wherein each of the first transistor and the second transistor comprises a first gate and a second gate, and
wherein the first gate and the second gate of each of the first transistor and the second transistor are electrically connected a row driver through a third wiring.
16. The memory device according to claim 8 ,
wherein each of the first transistor and the second transistor comprises a first gate and a second gate,
wherein the first gate of the first transistor and the first gate of the second transistor are electrically connected a row driver through a third wiring, and
wherein the second gate of the first transistor is electrically connected to the second gate of the second transistor.
17. The memory device according to claim 8 ,
wherein each of the first transistor and the second transistor comprises a first gate and a second gate, and
wherein the first gate and the second gate of each of the first transistor and the second transistor are electrically connected a row driver through a third wiring.