Semiconductor device
A semiconductor device with a novel structure is provided. The semiconductor device includes a silicon substrate including a first circuit, a first element layer including a second circuit, and a second element layer including a third circuit. The first circuit includes a first transistor. The second circuit includes a second transistor. The third circuit includes a memory cell. The memory cell includes a third transistor and a capacitor. The first element layer and the second element layer constitute a stacked block stacked and provided in a direction perpendicular or substantially perpendicular to a surface of the silicon substrate. A plurality of stacked blocks are stacked and provided in the direction perpendicular or substantially perpendicular to the surface of the silicon substrate. Each of the plurality of stacked blocks includes a first wiring provided in the direction perpendicular or substantially perpendicular to the surface of the silicon substrate. The plurality of stacked blocks are electrically connected to each other through the wiring.
1. A semiconductor device comprising:
a silicon substrate including a first circuit;
a first element layer over the silicon substrate; and
a second element layer over the first element layer,
wherein the first element layer includes a second circuit,
wherein the second element layer includes a third circuit,
wherein the first circuit includes a driver circuit comprising a first transistor,
wherein the second circuit includes a second transistor,
wherein the third circuit includes a memory cell,
wherein the memory cell includes a third transistor and a first capacitor,
wherein a plurality of stacked blocks are stacked and provided in a direction perpendicular or substantially perpendicular to a surface of the silicon substrate, the stacked blocks each being constituted by the first element layer and the second element layer, and
wherein the first circuit, the second circuit and the third circuit are electrically connected to each other through a first wiring provided in a hole penetrating the first element layer and the second element layer.
2. The semiconductor device according to claim 1 , wherein the first circuit is configured to output a signal for driving the memory cell and data to be written to the memory cell to the first wiring and is configured to amplify data read from the memory cell into the first wiring.
3. The semiconductor device according to claim 1 , wherein the second circuit is configured to amplify a potential of a second wiring electrically connected to the memory cell and transmit the amplified potential to the first wiring and is configured to transmit a potential of the first wiring to the second wiring.
4. The semiconductor device according to claim 1 , wherein the second transistor and the third transistor each include a semiconductor layer including a metal oxide in a channel formation region.
5. The semiconductor device according to claim 4 , wherein the metal oxide contains In, Ga, and Zn.
6. The semiconductor device according to claim 1 , wherein a first layer including the first capacitor is provided above a layer including the third transistor.
7. The semiconductor device according to claim 6 , wherein a second layer including a second capacitor is stacked and provided on top of the first layer.
8. The semiconductor device according to claim 1 , wherein the plurality of the stacked blocks are attached to the silicon substrate.
9. A semiconductor device comprising:
a silicon substrate including a first circuit;
a first element layer over the silicon substrate; and
a second element layer over the first element layer,
wherein the first element layer includes a second circuit,
wherein the second element layer includes a third circuit,
wherein the first circuit includes a driver circuit comprising a first transistor,
wherein the second circuit includes a second transistor,
wherein the third circuit includes a memory cell,
wherein the memory cell includes a third transistor and a first capacitor,
wherein a plurality of stacked blocks are stacked and provided in a direction perpendicular or substantially perpendicular to a surface of the silicon substrate, the stacked blocks each being constituted by the first element layer and a plurality of the second element layers, and
wherein the first circuit, the second circuit and a plurality of the third circuits are electrically connected to each other through a first wiring provided in a hole penetrating the first element layer and the plurality of the second element layers.
10. The semiconductor device according to claim 9 , wherein the first circuit is configured to output a signal for driving the memory cell and data to be written to the memory cell to the first wiring and is configured to amplify data read from the memory cell into the first wiring.
11. The semiconductor device according to claim 9 , wherein the second circuit is configured to amplify a potential of a second wiring electrically connected to the memory cell and transmit the amplified potential to the first wiring and is configured to transmit a potential of the first wiring to the second wiring.
12. The semiconductor device according to claim 9 , wherein the second transistor and the third transistor each include a semiconductor layer including a metal oxide in a channel formation region.
13. The semiconductor device according to claim 12 , wherein the metal oxide contains In, Ga, and Zn.
14. The semiconductor device according to claim 9 , wherein a first layer including the first capacitor is provided above a layer including the third transistor.
15. The semiconductor device according to claim 14 , wherein a second layer including a second capacitor is stacked and provided on top of the first layer.
16. The semiconductor device according to claim 9 , wherein the plurality of the stacked blocks are attached to the silicon substrate.