IP Library Granted Patent US 11,002,687
Granted Patent B2
US 11,002,687 · App. 16/084,155 · Granted May 11, 2021

Defect inspection method and defect inspection device

Inventors: Masaki Hasegawa (Tokyo, JP); Katsunori Onuki (Tokyo, JP); Noriyuki Kaneoka (Tokyo, JP); Hisaya Murakoshi (Tokyo, JP); Tomohiko Ogata (Tokyo, JP)
Assignee: Hitachi High-Tech Corporation
G01N21/94G01N23/2251H01J37/28H01J2237/2813
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Quick Facts
Patent No.
US 11,002,687
App. No.
16/084,155
Granted
May 11, 2021
Kind
B2
Abstract

A defect inspection device includes a sample support member, a negative voltage, an imaging element, an ultraviolet light source, a movement stage, and a control device. The control device controls the movement stage such that a portion of a linear part included in the image or a location on an extensional line of the linear part is positioned at a specific location in an irradiated region of the electron beam. The control device also repeats the control of the movement stage until an end of the linear part is positioned within the irradiated region of the electron beam.

Claims (27)

1. A defect inspection device comprising:

a sample support member that supports a sample irradiated with an electron beam emitted from an electron source;

a negative voltage applying power source for forming a retarding electric field with respect to the electron beam emitted toward the sample;

an imaging element at which an image of electrons reflected without reaching the sample is formed via the retarding electric field;

an ultraviolet light source that emits an ultraviolet light toward the sample;

a movement stage that moves the sample support member; and

a control device that controls the movement stage, wherein

the control device controls the movement stage such that a next image is taken from a portion of a linear part included in the image imaged by the imaging element or a location on an extensional line of the linear part, and repeats the control of the movement stage until an end of the linear part is positioned within the irradiated region of the electron beam.

2. The defect inspection device according to claim 1 , wherein

the control device moves the movement stage such that the linear part positioned outside the image is included in an irradiated region of the electron beam in a case where it is possible to determine that the linear part is positioned outside the image.

3. The defect inspection device according to claim 1 , wherein

the control device determines whether or not tracking of the linear part is performed based on two or more images obtained by changing the irradiation conditions of the ultraviolet light.

4. The defect inspection device according to claim 3 , wherein

as a result of a predetermined change in linear location included in the two or more images, the control device controls the movement stage so as to perform the tracking of the linear part.

5. The defect inspection device according to claim 1 , wherein

the control device moves the movement stage such that the end of the linear part is positioned at a predetermined position in the image.

6. The defect inspection device according to claim 1 , wherein

the control device moves the movement stage in accordance with the position of the end of the linear part.

7. The defect inspection device according to claim 6 , wherein

the control device moves the movement stage in a direction of a side of the image in which the linear end is positioned.

8. The defect inspection device according to claim 1 , further comprising:

a display device that displays the image, wherein

on the display device, a search trajectory on the sample due to the movement of the movement stage and design data of a circuit formed on the sample overlap and are displayed.

9. The defect inspection device according to claim 1 , wherein

the control device calculates a length of the linear part based on a plurality of images obtained based on repetition of movement of the movement stage.

10. A defect inspection method for generating an image of a sample and performing defect inspection using the image by emitting an electron beam toward the sample placed on a movement stage in a state where a retarding electric field for retarding the electron beam, and by detecting an electron reflected without reaching the sample by the retarding electric field,

wherein, in a state where the sample is irradiated with an ultraviolet light, the electron beam is emitted, a linear part included in the image obtained by the irradiation is specified, a next image is taken from a portion of the linear part included in the image imaged by the imaging element or a location on an extensional line of the linear part, the movement stage is moved, and the movement using the movement stage is repeated until an end of the linear part is positioned within the irradiated region of the electron beam so as to be positioned at a specific location in an irradiated region of the electron beam.

Assignments (2)
CHANGE OF NAME Recorded Apr 14, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052398/0249 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 12, 2018
From: HASEGAWA, MASAKI; ONUKI, KATSUNORI; KANEOKA, NORIYUKI; MURAKOSHI, HISAYA; OGATA, TOMOHIKO
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 046855/0412 →
Continuity (1)
Related Publication 20200292466A1 · Sep 17, 2020
Cited By (1)
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