Cationically curable resin composition

1. A cationically curable resin composition comprising:

component (A): a cationically polymerizable compound;

component (B): a photo-cationic polymerization initiator;

component (C): a thermal cationic polymerization initiator; and

component (D): a compound having an isocyanuric ring,

wherein a content of the component (D) is 0.01 to 5 parts by mass per 100 parts by mass of the component (A).

2. The cationically curable resin composition according to claim 1 , wherein the component (D) is at least one member selected from the group consisting of a compound containing a (meth)acryloyl group and an isocyanuric ring, a compound containing an allyl group and an isocyanuric ring, a compound containing a glycidyl group and an isocyanuric ring, and a compound containing a mercapto group and an isocyanuric ring.

3. The cationically curable resin composition according to claim 1 , wherein the component (C) is an aromatic sulfonium-based thermal cationic polymerization initiator or an aromatic iodonium-based thermal cationic polymerization initiator.

4. The cationically curable resin composition according to claim 1 , further comprising:

component (E): a pigment.

5. The cationically curable resin composition according to claim 1 , wherein the component (A) is a hydrogenated epoxy resin or an alicyclic epoxy compound.

6. The cationically curable resin composition according to claim 1 , wherein the component (A) comprises a hydrogenated epoxy resin.

7. The cationically curable resin composition according to claim 1 , wherein an amount of the component (B) is 0.1 to 30 parts by mass per 100 parts by mass of the component (A).

8. The cationically curable resin composition according to claim 1 , wherein an amount of the component (C) is 0.1 to 30 parts by mass per 100 parts by mass of the component (A).

9. The cationically curable resin composition according to claim 1 , wherein the component (A) is at least one selected from a group consisting of a hydrogenated bisphenol A epoxy resin, a hydrogenated bisphenol F epoxy resin, a hydrogenated bisphenol E epoxy resin, a diglycidyl ether of an alkylene oxide adduct of a hydrogenated bisphenol A, a diglycidyl ether of an alkylene oxide adduct of a hydrogenated bisphenol F, a hydrogenated phenol novolac epoxy resin, and a hydrogenated cresol novolac epoxy resin.

10. The cationically curable resin composition according to claim 1 , wherein the cationically curable resin composition can be cured by active energy ray irradiation and a low temperature.

11. The cationically curable resin composition according to claim 1 , wherein the component (B) is at least one selected from a group consisting of triphenylsulfonium hexafluoroantimonate, triphenylsulfonium tetrakis(pentafluorophenyl)borate, 4,4′-bis[di(β-hydroxyethoxy)phenylsulfonio]diphenylsulfide-bishexafluoroantimonate, 7-[di(p-toluyl)sulfonio]-2-isopropylthioxanthone hexafluoroantimonate, 7-[di(p-toluyl)sulfonio]-2-isopropylthioxanthone tetrakis(pentafluorophenyl)borate, 4-(p-ter-butylphenylcarbonyl)-4′-diphenylsulfonio-diphenylsulfide-hexafluoroantimonate, 4-(p-ter-butylphenylcarbonyl)-4′-di(p-tolyl)sulfoniodiphenylsulfide-tetrakis(pentafluorophenyl)borate, diphenyliodonium tetrakis(pentafluorophenyl)borate, diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroantimonate, di(4-nonylphenyl)iodonium hexafluorophosphate, and 4-methylphenyl-4-(1-methylethyl)phenyliodonium tetrakis(pentafluorophenyl)borate.

12. The cationically curable resin composition according to claim 1 , wherein the component (A) comprises a hydrogenated bisphenol A epoxy resin in an amount of more than 80 mass % based on the entire component (A).