Granted Patent B2

US 12,600,888 · App. 17/951,798 · Granted Apr 14, 2026

Inventors: Shingo Tsuno (Kanagawa, JP); Takayuki Kanno (Kanagawa, JP)

Assignee: Henkel AG & Co. KGaA

C09J163/00C08K3/36C08K7/18

Abstract

Claims (29)

1 . A dual-curable adhesive composition comprising:

(a1) an oxetane compound,

(a2) an alicyclic epoxy compound,

(a3) an aromatic glycidyl ether-based epoxy compound,

(b) a photocationic polymerization initiator, and

(c) a thermal cationic polymerization initiator comprising a tetrakis(pentafluorophenyl) borate compound, wherein

the amount of the component (a1) is 30 to 60 parts by mass,

the amount of the component (a2) is 7 to 45 parts by mass, and

the amount of the component (a3) is 5 to 27 parts by mass,

each based on 100 parts by mass of the total amount of the components (a1), (a2) and (a3).

2 . The dual-curable adhesive composition according to claim 1 , wherein the component (c) is an ammonium salt of tetrakis(pentafluorophenyl) boric acid.

3 . The dual-curable adhesive composition according to claim 1 , further comprising (d) an inorganic filler.

4 . The dual-curable adhesive composition according to claim 1 , which is used for assembling a camera module to bond a lens holder and a base plate on which an image capturing sensor is fixed.

5 . A cured product obtained by curing the dual-curable adhesive composition according to claim 1 .

6 . A camera module comprising the cured product according to claim 5 .

7 . A dual-curable adhesive composition comprising:

(a1) 50 parts by mass of an oxetane compound,

(a2) 25 parts by mass of an alicyclic epoxy compound,

(a3) 25 parts by mass of an aromatic glycidyl ether-based epoxy compound,

each based on 100 parts by mass of the total amount of the components (a1), (a2) and (a3),

(b) a photocationic polymerization initiator,

(c) a thermal cationic polymerization initiator comprising a tetrakis(pentafluorophenyl) borate compound, and

(d) an inorganic filler comprising silica.

8 . The dual curable adhesive composition according to claim 7 , wherein

the amount of the component (b) is 2 parts by mass,

the amount of the component (c) is 1 part by mass, and

the amount of component (d) is 100 parts by mass,

each based on 100 parts by mass of the total amount of the components (a1), (a2) and (a3).

9 . The dual curable adhesive composition according to claim 8 , further comprising (e) 4 parts by mass of a thixo-imparting agent and 1 part by mass of a silane coupling agent, each based on 100 parts by mass of the total amount of the components (a1), (a2) and (a3).

Assignments (3)

Priority Claims (1)

Continuity (2)

References Cited (32)