Method for reviewing defects
A semiconductor structure includes a wafer comprising a plurality of viewing fields defined thereon, a plurality of dies defined by a scribe line formed in each viewing field, a plurality of mark patterns formed in the scribe line, and a plurality of anchor pattern respectively formed in the review fields, the anchor patterns being different from the mark patterns.
1. A method for reviewing defects, comprising:
receiving a semiconductor structure and sets of coordinates locating a plurality of defects formed thereon in a defect review apparatus;
identifying a plurality of viewing fields on the semiconductor structure and recognizing a plurality of origin points respectively in the viewing fields in the defect review apparatus, and each viewing field comprising a plurality of dies formed therein;
performing a first review step to review a plurality of anchor patterns in the viewing fields;
performing an offset correction after the first review step to re-locating the plurality of defects; and
performing a second review step to review the defects after the offset correction.
2. The method for reviewing the defects according to claim 1 , wherein the sets of the coordinates are derived from a defect inspection apparatus.
3. The method for reviewing the defects according to claim 1 , wherein the anchor patterns are formed at corners of the dies located at corners of the viewing fields.
4. The method for reviewing the defects according to claim 3 , wherein the offset correction is performed to calculate a deviation between the anchor pattern and the origin point in the viewing fields.
5. The method for reviewing the defects according to claim 1 , wherein the anchor patterns are formed at corners of the dies not located at corners of the viewing fields.
6. The method for reviewing the defects according to claim 5 , wherein the offset correction is performed to calculate a deviation between the sets of coordinates and the anchor patterns.
7. The method for reviewing the defects according to claim 1 , wherein the anchor patterns comprise a plurality of sub-patterns arranged within, and at least a programmed defect is formed in one of the sub-patterns.
8. The method for reviewing the defects according to claim 7 , wherein the programmed defect comprises a gap defect, a short-end defect, or a bridge defect.