IP Library Granted Patent US 10,763,088
Granted Patent B2
US 10,763,088 · App. 16/111,752 · Granted Sep 1, 2020

Vacuum processing apparatus

Inventors: Takashi Uemura (Tokyo, JP); Takamasa Ichino (Tokyo, JP); Kazunori Nakamoto (Tokyo, JP); Kohei Sato (Tokyo, JP)
Assignee: HITACHI HIGH-TECH CORPORATION
H01J37/32715H01J37/3288H01J37/32834H01J2237/3341
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Quick Facts
Patent No.
US 10,763,088
App. No.
16/111,752
Granted
Sep 1, 2020
Kind
B2
Abstract

Provided is a vacuum processing apparatus that improves an operation rate or efficiency of processing. The vacuum processing apparatus includes: a cylindrical pedestal which is disposed below a base plate that constitutes a specimen stage and is made of a metal, whose internal space is under an atmospheric pressure, and which is connected to the base plate in a state in which the base plate, and a base member and an insulating member fastened to the base plate are placed; a plate-shaped beam part which is disposed in the space of the pedestal with a gap from a lower surface of the base plate, and extends outward from the center of the space in a T or Y shape; a plurality of pins that pass through the beam part, the base plate, the insulating member, and the base member, support the specimen on tips thereof on an upper side of the specimen stage, and vertically move the specimen; a pin drive unit that is mounted on a lower surface of the center of the beam part; and a seal that is disposed around a through-hole through which each of the plurality of pins passes, and airtightly seals the inside and the outside.

Claims (13)

1. A vacuum processing apparatus comprising:

a processing chamber which is disposed inside a vacuum vessel, and whose inner portion is exhausted and depressurized;

a specimen stage which is disposed in the processing chamber where a specimen to be processed is placed on an upper surface of the specimen stage; and

an opening which is disposed below the specimen stage, and communicates with an exhaust pump for exhausting the inner portion of the processing chamber,

wherein the specimen is processed using plasma formed above the specimen stage and in the processing chamber, and

the specimen stage includes: a base member that includes a dielectric film, where the specimen is placed on an upper surface of the dielectric film, and the base member is made of metal; a base plate that is disposed below the base member, is interposed and insulated between the base member and an insulating member, and is made of metal; a connector that is inserted into a center of the base member from below the base plate, is mounted on a lower surface of the base plate, and supplies high-frequency power to the base member; a cylindrical pedestal which is disposed below the base plate, whose internal space is under an atmospheric pressure, and which is connected to the base plate in a state in which the base plate, and the base member and the insulating member fastened to the base plate are placed on an upper side of the internal space; a plate-shaped beam part which is disposed in the internal space of the cylindrical pedestal with a gap from the lower surface of the base plate, and extends outward from the center of the internal space in a T or Y shape, and whose end is connected to an inner circumferential wall surface of the cylindrical pedestal; a plurality of pins that pass through the beam part, the base plate, the insulating member, and the base member, support the specimen on tips thereof on an upper side of the specimen stage, and vertically move the specimen; a drive unit of the plurality of pins that is mounted on a lower surface of the center of the beam part; and a seal that is disposed at the beam part, is disposed around a through-hole through which each of the plurality of pins passes, and forms an airtight seal between a periphery of each of the pins and the internal space in the cylindrical pedestal under the atmospheric pressure.

2. The vacuum processing apparatus according to claim 1 , wherein the seal on an upper surface of the beam part performs sealing in a state in which the base member is mounted on the cylindrical pedestal.

3. The vacuum processing apparatus according to claim 2 , wherein, in a state in which the connector is mounted on the base plate, and the base member and the insulating member fastened to the base plate are constituted to be demountable from the cylindrical pedestal.

4. The vacuum processing apparatus according to claim 2 , wherein the gap between the upper surface of the beam part and the lower surface of the base plate and a high-frequency power supply that supplies the high-frequency power through the internal space are connected as to be mounted and demounted.

5. The vacuum processing apparatus according to claim 2 , wherein cables for supplying power to the base member or pipes for supplying a gas or a fluid are connected to the base plate through the space between a plurality of T-shaped or Y-shaped beams of the beam part.

6. The vacuum processing apparatus according to claim 1 , wherein, in a state in which the connector is mounted on the base plate, and the base member and the insulating member fastened to the base plate are constituted to be demountable from the cylindrical pedestal.

7. The vacuum processing apparatus according to claim 1 , wherein the gap between an upper surface of the beam part and the lower surface of the base plate and a high-frequency power supply that supplies the high-frequency power through the internal space are connected as to be mounted and demounted.

8. The vacuum processing apparatus according to claim 1 , wherein cables for supplying power to the base member or pipes for supplying a gas or a fluid are connected to the base plate through the internal space between a plurality of T-shaped or Y-shaped beams of the beam part.

Assignments (2)
CHANGE OF NAME Recorded Mar 25, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052225/0894 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2018
From: UEMURA, TAKASHI; ICHINO, TAKAMASA; NAKAMOTO, KAZUNORI; SATO, KOHEI
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 047235/0402 →
Priority Claims (1)
JP 2018-030295 · Feb 23, 2018 · national
Continuity (1)
Related Publication 20190267219A1 · Aug 29, 2019
Cited By (1)
US 12,642,054