Film-forming method and film-forming apparatus
There is provided a film-forming method, including: a pre-coating process of supplying a first gas containing silicon into a processing container in which a substrate is not loaded, and coating surfaces of members installed inside the processing container, including a mounting table configured to mount the substrate thereon, with a film made of silicon; subsequently, a mounting process of mounting the substrate on the mounting table so that a back surface of the substrate is in contact with the film made of silicon; and subsequently, a film-forming process of supplying a second gas containing an organometallic compound into the processing container, and forming a film made of a metal constituting the organometallic compound on the substrate.
1. A film-forming method, comprising:
a pre-coating process of supplying a pre-coating gas and a first gas containing silicon into a processing container in which a substrate is not loaded, and coating surfaces of members installed inside the processing container, including a mounting table configured to mount the substrate thereon, with a film made of silicon;
subsequently, a mounting process of mounting the substrate on the mounting table so that a back surface of the substrate is in contact with the film made of silicon; and
subsequently, a film-forming process of supplying a second gas containing an organometallic compound into the processing container, and forming a film made of a metal constituting the organometallic compound on the substrate,
wherein the pre-coating process includes:
a first pre-coating process of supplying the pre-coating gas, which is a compound different from the organometallic compound and contains the metal constituting the organometallic compound, into the processing container to form an underlying film containing the metal on the members installed inside the processing container; and
subsequently, a second pre-coating process of supplying the first gas into the processing container to form a film made of the silicon so as to be laminated on the underlying film.
2. The method of claim 1 , wherein the film-forming process further includes supplying the first gas into the processing container to form a film containing the metal and the silicon on the substrate.
3. The method of claim 2 , wherein the film-forming process further includes supplying a third gas as a compound containing nitrogen into the processing container to form a film containing the metal, the silicon, and the nitrogen on the substrate.
4. The method of claim 1 , wherein the first pre-coating process is performed in a state where an internal temperature of the processing container is set to a first temperature, and the second pre-coating process is performed in a state where the internal temperature of the processing container is set to a second temperature that is lower than the first temperature.
5. The method of claim 4 , wherein the first temperature is equal to or higher than 400 degrees C., and the second temperature is equal to or lower than 300 degrees C.
6. The method of claim 1 , wherein the pre-coating gas is composed of a chloride of the metal, and the second gas does not contain chlorine as a constituent.
7. The method of claim 1 , wherein the metal is titanium.
8. The method of claim 1 , wherein the film made of silicon is an amorphous silicon film.