Vertical type semiconductor devices and methods of manufacturing the same
A vertical type semiconductor device includes a substrate that has a plurality of trenches, a support pattern that fills the plurality of trenches and protrudes from a top surface of the substrate, a semiconductor layer disposed on the substrate that fills a space between the support patterns, a stacked structure disposed on the support pattern and the semiconductor layer that includes a plurality of insulation layers and a plurality of first conducive patterns that are alternately and repeatedly stacked, and a plurality of channel structures that penetrate through the structure and the semiconductor layer and that extend into the support pattern. Each channel structure includes a channel layer. At least a portion of the channel layer makes contact with the semiconductor layer.
1. A vertical type semiconductor device, comprising:
a substrate that has a plurality of first trenches extending in a first direction parallel to a top surface of the substrate;
support patterns that fill the plurality of first trenches and protrude from the top surface of the substrate;
a semiconductor layer disposed between the support patterns on the substrate;
a stacked structure disposed on the support pattern and the semiconductor layer that includes a plurality of insulation layers and a plurality of first conducive patterns that are alternately and repeatedly stacked; and
a plurality of channel structures that penetrate through the stacked structure and that extend into the support pattern, wherein each channel structure includes a channel layer,
wherein at least a portion of the channel layer makes direct contact with the semiconductor layer.
2. The vertical type semiconductor device of claim 1 , wherein the semiconductor layer comprises polysilicon.
3. The vertical type semiconductor device of claim 1 , wherein the support pattern connects lower sidewalls of adjacent channel structures.
4. The vertical type semiconductor device of claim 1 , wherein the support pattern extends to have a linear shape.
5. The vertical type semiconductor device of claim 1 , wherein the support pattern has a pillar shape.
6. The vertical type semiconductor device of claim 5 , wherein a plurality of adjacent channel structures are disposed on one of the support patterns.
7. The vertical type semiconductor device of claim 6 , wherein the stacked structure has a linear shape that extends in a second direction, the support pattern is positioned in a cell block region and the support pattern extends in a diagonal direction that forms an acute angle with respect to the second direction.
8. The vertical type semiconductor device of claim 1 , wherein a width of the portion of the support pattern that protrudes from the top surface of the substrate is less than a width of a portion of the support pattern in the first trenches.
9. The vertical type semiconductor device of claim 1 , wherein each channel structure is disposed in a channel hole, and each channel structure comprises a blocking layer, a charge storage layer, a tunnel insulation layer and the channel layer sequentially stacked on a surface of the channel hole.
10. The vertical type semiconductor device of claim 9 , wherein the blocking layer, the charge storage layer and the tunnel insulation layer expose a portion of the channel layer at a level of the semiconductor layer, and the exposed portion of the channel layer makes direct contact with the semiconductor layer.
11. The vertical type semiconductor device of claim 1 , further comprising:
a plurality of stacked structures disposed on the support pattern that are spaced apart from each other, wherein each of the plurality of stacked structures has a linear shape that extends in a second direction,
wherein a second trench is provided between adjacent stacked structures.
12. The vertical type semiconductor device of claim 11 , wherein a width of the second trench is greater than a thickness of the semiconductor layer.
13. The vertical type semiconductor device of claim 11 ,
further comprising a second conductive pattern in the second trench, wherein the second conductive pattern contacts the semiconductor layer and extends in the second direction.
14. A vertical type semiconductor device, comprising:
a substrate that has a plurality of trenches extending in a first direction parallel to a top surface of the substrate;
support patterns that fill the plurality of trenches and protrude from the top surface of the substrate;
a polysilicon layer disposed between the support patterns on the substrate;
a stacked structure disposed on the support pattern and the polysilicon layer that includes a plurality of insulation layers and a plurality of first conducive patterns that are alternately and repeatedly stacked; and
a plurality of channel structures that penetrate through the stacked structure and that extend into the support pattern,
wherein the support pattern connects lower sidewalls of adjacent channel structures,
wherein a width of the support pattern that protrudes from the top surface of the substrate is less than a width the support pattern in the trenches.
15. The vertical type semiconductor device of claim 14 , wherein the width of the support pattern that protrudes from the top surface of the substrate is less than a maximum width of the support pattern in the trenches.
16. The vertical type semiconductor device of claim 14 , wherein each channel structure is disposed in a channel hole, and each channel structure comprises a blocking layer, a charge storage layer, a tunnel insulation layer and a channel layer sequentially stacked on a surface of the channel hole, wherein the channel layer makes contact with the polysilicon layer, and
wherein the blocking layer the charge storage layer and the tunnel insulation layer expose a portion of the channel layer at a level of the polysilicon layer, and the exposed portion of the channel layer makes direct contact with the polysilicon layer.
17. A vertical type semiconductor device, comprising:
a substrate that has a plurality of first trenches extending in a first direction parallel to a top surface of the substrate;
support patterns that fill the plurality of first trenches and that protrude from the top surface of the substrate;
a polysilicon layer disposed between the support patterns on the substrate;
a stacked structure on the support pattern and the polysilicon layer that includes a plurality of insulation layers and a plurality of first conducive patterns that are alternately and repeatedly stacked;
a plurality of first channel structures that penetrate through the stacked structure and that extend into the substrate, wherein each of the first channel structure includes a first channel layer; and
a plurality of second channel structures that penetrate through the stacked structure and that extend into the support pattern, wherein each of the second channel structures includes a second channel layer,
wherein at least a portion of each of the first channel layer and the second channel layer makes direct contact with the polysilicon layer.
18. The vertical type semiconductor device of claim 17 , further comprising:
a plurality of stacked structures disposed on the support pattern that are spaced apart from each other, wherein each of the plurality of stacked structures has a linear shape that extends in a second direction,
wherein a second trench is provided between adjacent stacked structures.
19. The vertical type semiconductor device of claim 17 , wherein the stacked structure has a linear shape that extends in a second direction, the support pattern is positioned in a cell block region and the support pattern extends in a diagonal direction that forms an acute angle with respect to the second direction.
20. The vertical type semiconductor device of claim 14 , wherein a plurality of adjacent channel structures are disposed on one of the support patterns.