Vertical type semiconductor devices and methods of manufacturing the same
A vertical type semiconductor device includes a substrate that has a plurality of trenches, a support pattern that fills the plurality of trenches and protrudes from a top surface of the substrate, a semiconductor layer disposed on the substrate that fills a space between the support patterns, a stacked structure disposed on the support pattern and the semiconductor layer that includes a plurality of insulation layers and a plurality of first conducive patterns that are alternately and repeatedly stacked, and a plurality of channel structures that penetrate through the structure and the semiconductor layer and that extend into the support pattern. Each channel structure includes a channel layer. At least a portion of the channel layer makes contact with the semiconductor layer.
1. A method of manufacturing a vertical type semiconductor device, comprising:
forming a first pattern structure on a substrate;
forming a second pattern that passes through the first pattern structure and the substrate;
depositing alternately and repeatedly insulation layers and sacrificial layers on the first pattern structure and the second pattern so that a first stacked structure is formed;
forming a preliminary channel structure that includes a blocking layer, a charge storage layer, a tunnel insulation layer and a channel layer, wherein the preliminary channel structure passes through the first stacked structure and the first pattern structure and extends to an upper portion of the second pattern;
etching portions of the first stacked structure and the first pattern structure so that a trench that extends a first direction parallel to a surface of the substrate is formed;
removing the first pattern structure exposed by the trench so that a first gap is formed;
etching portions of the blocking layer, the charge storage layer, and the tunnel insulation layer exposed by the first gap so that a channel structure that has a cutting region is formed;
forming a semiconductor layer that fills the first gap and the cutting region, wherein the semiconductor layer contacts the channel layer in the cutting region; and
replacing the sacrificial layers with first conductive patterns.
2. The method of claim 1 , wherein the semiconductor layer includes polysilicon.
3. The method of claim 1 , wherein the second pattern has a linear shape.
4. The method of claim 1 , wherein the second pattern includes an insulating material.
5. The method of claim 1 , wherein the second pattern has a recessed upper portion, and the channel structure is formed on the recessed upper portion of the second pattern.
6. The method of claim 1 , wherein forming a preliminary channel structure comprises:
etching the first stacked structure, the first pattern structure and the upper portion of the second pattern so that a channel hole that exposes the second pattern is formed;
sequentially forming the blocking layer, the charge storage layer, the tunnel insulation layer and the channel layer on a sidewall of the channel hole; and
forming a buried insulation layer on the channel layer that fills the channel hole.
7. The method of claim 6 , wherein a bottom surface of the buried insulation layer is lower than a top surface of the substrate.
8. The method of claim 1 , wherein the trench has a width greater than a vertical thickness of the first pattern structure.
9. The method of claim 1 , further comprising forming a protection spacer on a sidewall of the trench that covers the insulation patterns and the sacrificial pattern, before forming the first gap.
10. The method of claim 1 , wherein a first vertical height of the cutting region is greater than a second vertical height of the first gap.
11. The method of claim 1 , wherein forming the semiconductor layer comprises:
forming a preliminary semiconductor layer on a surface of the trench and inner portions of the first gap and the cutting region; and
selectively removing the preliminary semiconductor layer from the surface of the trench so that the semiconductor layer is formed.
12. The method of claim 11 wherein the preliminary semiconductor layer is formed by a chemical vapor deposition process or an atomic layer deposition process.
13. The method of claim 1 , further comprising
forming an insulation spacer on a sidewall of the trench, after replacing the sacrificial layer with the conductive pattern.
14. The method of claim 13 , further comprising
forming a second conductive pattern on the insulation spacer that fills the trench.
15. A method of manufacturing a vertical type semiconductor device, comprising:
forming a first pattern structure on a substrate;
forming a second pattern that passes through the first pattern structure and the substrate, wherein the second pattern extends in a first direction;
depositing alternately and repeatedly insulation layers and sacrificial layers on the first pattern structure and the second pattern so that a first stacked structure is formed;
forming a preliminary channel structure that includes a blocking layer, a charge storage layer, a tunnel insulation layer, a channel layer and a buried insulation layer, wherein the preliminary channel structure passes through the first stacked structure and the first pattern structure and extends to an upper portion of the second pattern;
etching portions of the first stacked structure and the first pattern structure so that a trench that extends in a second direction and exposes an upper portion the first pattern structure is formed;
removing the sacrificial layers exposed by the trench so that a first gap is formed;
etching portions of the blocking layer, the charge storage layer, and the tunnel insulation layer exposed by the first gap so that a cutting region is formed;
depositing a preliminary semiconductor layer conformally on a surface of the trench and inner portions of the first gap and the cutting region so that the first gap and the cutting region are filled;
selectively removing the preliminary semiconductor layer from the surface of the trench so that a semiconductor layer that fills the first gap and the cutting region and contacts a sidewall of the channel layer is formed; and
replacing the sacrificial layers with conductive patterns.
16. The method of claim 15 , wherein forming the preliminary channel structure comprises:
etching the first stacked structure, the first pattern structure and the upper portion of the second pattern so that a channel hole that exposes the second pattern is formed;
sequentially and conformally forming the blocking layer, the charge storage layer, the tunnel insulation layer and the channel layer on sidewall of the channel hole; and
forming the buried insulation layer on the channel layers so that the channel hole is filled.
17. The method of claim 15 , wherein the preliminary semiconductor layer is formed by a chemical vapor deposition process or an atomic layer deposition process.
18. The method of claim 15 , wherein the trench has a width greater than a vertical thickness of the first pattern structure.
19. A method of manufacturing a vertical type semiconductor device, comprising:
forming a first pattern structure on a substrate;
depositing alternately and repeatedly insulation layers and sacrificial layers on the first pattern structure so that a first stacked structure is formed;
forming a preliminary channel structure that includes a blocking layer, a charge storage layer, a tunnel insulation layer and a channel layer, wherein the preliminary channel structure passes through the first stacked structure and the first pattern structure and extends to an upper inner portion of the substrate;
etching portions of the first stacked structure and the first pattern structure so that a trench that extends in a first direction parallel to a surface of the substrate is formed;
removing the sacrificial layers exposed by the trench so that a first gap is formed;
etching portions of the blocking layer, the charge storage layer, and the tunnel insulation layer exposed by the first gap so that a channel structure that has an upper portion, a lower portion and a cutting region between the upper portion and the lower portion is formed;
forming a polysilicon layer that fills the first gap and the cutting region; and
replacing the sacrificial layers with conductive patterns,
wherein a sidewall of the polysilicon layer contacts a sidewall of the channel layer in the cutting region, and a bottom of the polysilicon layer contacts an upper surface of the substrate.
20. The method of claim 19 , wherein the polysilicon layer is formed by a chemical vapor deposition process or an atomic layer deposition process.