IP Library Granted Patent US 11,283,010
Granted Patent B2
US 11,283,010 · App. 16/124,655 · Granted Mar 22, 2022

Precessional spin current structure for magnetic random access memory with novel capping materials

Inventors: Jorge Vasquez (San Jose, CA); Bartlomiej Adam Kardasz (Pleasanton, CA); Cheng Wei Chiu (Dublin, CA); Mustafa Pinarbasi (Morgan Hill, CA)
Assignee: Integrated Silicon Solution, (Cayman) Inc.
H01L43/10G11C11/161H01F10/329H01F10/3254H01L27/222H01L43/02H01L43/08
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Quick Facts
Patent No.
US 11,283,010
App. No.
16/124,655
Granted
Mar 22, 2022
Kind
B2
Abstract

A magnetic memory element having a magnetic free layer and a magnetic reference layer with a non-magnetic barrier layer between the magnetic reference layer and the magnetic free layer. A spin current layer (which may be a precessional spin current layer) is located adjacent to the magnetic free layer and is separated from the magnetic free layer by a non-magnetic coupling layer. A material layer adjacent to and in contact with the spin current layer, has a material composition and thickness that are chosen to provide a desired effective magnetization in the spin current layer. The material layer, which may be a capping layer or a seed layer, can be constructed of a material other than tantalum which may include one or more of Zr, Mo, Ru, Rh, Pd, Hf, W, Ir, Pt and/or alloys and/or nitrides of these elements.

Claims (29)

1. A magnetic memory element for use in a magnetic memory array, the magnetic memory element comprising:

a magnetic tunnel junction structure including a magnetic free layer, a magnetic reference layer and a non-magnetic barrier layer located between the magnetic free layer and the magnetic reference layer;

a precessional magnetic spin current layer located adjacent to the magnetic free layer;

a coupling layer located between the precessional magnetic spin current layer and the magnetic free layer; and

a material layer in contact with the precessional magnetic spin current layer, the material layer comprising one or more of Zr, Mo, Rh, Pd, Hf, W, Ir, Pt and/or alloys and/or nitrides of these elements and containing no Ta;

wherein the coupling layer comprises Magnesium Oxide.

2. The magnetic memory element as in claim 1 , wherein the magnetic free layer and the magnetic reference layer each have a perpendicular magnetic anisotropy and the precessional magnetic spin current layer has a substantially parallel magnetic anisotropy.

3. The magnetic memory element as in claim 1 , wherein the coupling layer has a thickness of 0.3-1.5 nm.

4. A magnetic memory element for use in a magnetic memory array, the magnetic memory element comprising:

a magnetic reference layer;

a magnetic free layer;

a non-magnetic barrier layer located between the magnetic reference layer and the magnetic free layer;

a precessional magnetic spin current layer;

a coupling layer located between the precessional magnetic spin current layer and the magnetic free layer; and

a capping layer formed over and contacting the precessional magnetic spin current layer, the capping layer comprising one or more of Zr, Mo, Rh, Pd, Hf, W, Ir, Pt and/or alloys and/or nitrides of these elements and containing no Ta;

wherein the coupling layer comprises Magnesium Oxide.

5. The magnetic memory element as in claim 4 , wherein the magnetic reference layer and the magnetic free layer each have a perpendicular magnetic anisotropy and the precessional magnetic spin current layer has a substantially parallel magnetic anisotropy.

6. The magnetic memory element as in claim 4 , wherein the coupling layer has a thickness of 0.3-1.5 nm.

7. A magnetic memory element for use in a magnetic memory array, the magnetic memory element comprising:

a seed layer;

a precessional magnetic spin current layer formed on and in contact with the seed layer;

a magnetic free layer;

a non-magnetic coupling layer located between the precessional magnetic spin current layer and the magnetic free layer;

a magnetic reference layer; and

a non-magnetic barrier layer located between the magnetic reference layer and the magnetic free layer;

wherein the seed layer comprises one or more of Zr, Rh, Pd, Hf, Ir, Pt and/or alloys and/or nitrides of these elements and contains no Ta;

wherein the coupling layer comprises Magnesium Oxide.

8. The magnetic memory element as in claim 7 , wherein the magnetic free layer and magnetic reference layer each have a perpendicular magnetic anisotropy and the precessional magnetic spin current layer has a magnetic anisotropy with a primary component in a direction parallel a major surface of the magnetic free layer with the magnetic spin current layer.

9. The magnetic memory element as in claim 7 , wherein the coupling layer has a thickness of 0.3-1.5 nm.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2021
From: SPIN (ASSIGNMENT FOR BENEFIT OF CREDITORS), LLC
To: INTEGRATED SILICON SOLUTION, (CAYMAN) INC.
Reel/Frame 057407/0829 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2021
From: SPIN MEMORY, INC.
To: SPIN (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 056927/0038 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 13, 2020
From: CHIU, CHENG WEI
To: SPIN MEMORY, INC.
Reel/Frame 051930/0600 →
CHANGE OF NAME Recorded Jan 9, 2019
From: SPIN TRANSFER TECHNOLOGIES, INC.
To: SPIN MEMORY, INC.
Reel/Frame 048040/0409 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 26, 2018
From: VASQUEZ, JORGE; KARDASZ, BARTLOMIEJ ADAM; CHEN, WEI; PINARBASI, MUSTAFA
To: SPIN TRANSFER TECHNOLOGIES, INC.
Reel/Frame 046977/0804 →
Continuity (1)
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