Data and clock synchronization and variation compensation apparatus and method
An apparatus is provided for mitigating uncertainties in process, voltage, random, and systematic variations between first and second dies. The first die comprises a clock compensator to adjust one or more signal characteristics of an input clock, and to provide first and second clocks; a data transmitter to sample data with a version of the first clock and to transmit the sampled data to a data receiver of the second die, wherein the data receiver is to receive the sampled data and generate a received data; and a clock transmitter to transmit the second clock to a clock receiver of the second die, wherein the clock receiver is to generate a third clock, wherein a phase of the third clock is adjusted to generate a fourth clock, wherein a delayed version of the fourth clock is received by a sampler coupled to the data receiver to sample the received data.
1. An apparatus comprising:
a clock compensation circuit to adjust one or more signal characteristics of an input clock, and to provide first and second clocks;
a data transmitter to sample data, for transmission, with a version of the first clock and to transmit the sampled data to a data receiver, wherein the data receiver is to receive the sampled data and to generate a received data; and
a clock transmitter to transmit the second clock to a clock receiver, wherein the clock receiver is to receive the second clock and generate a third clock, wherein a phase of the third clock is adjusted by a pulse width generator to generate a fourth clock, and wherein a delayed version of the fourth clock is received by a sampler coupled to the data receiver to sample the received data.
2. The apparatus of claim 1 , wherein the pulse width generator is to adjust a falling edge of the third clock to generate the fourth clock.
3. The apparatus of claim 1 , wherein the clock compensation circuit has programmable delay such that the first and second clocks can be delayed independently.
4. The apparatus of claim 1 comprises a phase locked loop to generate the input clock.
5. The apparatus of claim 1 comprises a clock distribution network to receive the first clock and to generate the version of the first clock as an output of the clock distribution network.
6. The apparatus of claim 1 , wherein the data receiver and the clock receiver are in a different die than a die comprising the data transmitter and the clock transmitter.
7. The apparatus of claim 6 , wherein the die is a first die, wherein the different die is a second die, and wherein the second die comprises a clock distribution circuit to receive the fourth clock and to generate the delayed version of the fourth clock.
8. The apparatus of claim 7 , wherein the first and second dies are coupled to one another via a silicon interposer or a through silicon via (TSV).
9. The apparatus of claim 7 , wherein the first and second dies are positioned in a package along a same plane.
10. The apparatus of claim 7 , wherein the first and second dies are positioned in a package in different planes.
11. The apparatus of claim 1 , wherein the pulse width generator is to adjust an edge of the fourth clock at a training mode.
12. A system comprising:
a memory;
a first die coupled to the memory;
a second die coupled to the first die, wherein the first die includes:
a clock compensation circuit to adjust one or more signal characteristics of an input clock, and to provide first and second clocks;
a data transmitter to sample data, for transmission, with a version of the first clock and to transmit the sampled data to a data receiver in the second die, wherein the data receiver is to receive the sampled data and generate a received data; and
a clock transmitter to transmit the second clock to a clock receiver in the second die, wherein the clock receiver is to receive the second clock and generate a third clock, wherein a phase of the third clock is adjusted by a pulse width generator to generate a fourth clock, and wherein a delayed version of the fourth clock is received by a sampler coupled to the data receiver to sample the received data; and
a communication interface to allow the first or second dies to communicate with another device.
13. The system of claim 12 , wherein the first and second dies are coupled to one another via a silicon interposer or a through silicon via.
14. The system of claim 12 , wherein the first and second dies are positioned in a package along a same plane, or wherein the first and second dies are positioned in a package in different planes.