IP Library Granted Patent US 10,629,411
Granted Patent B2
US 10,629,411 · App. 16/192,723 · Granted Apr 21, 2020

Charged particle beam apparatus

Inventors: Satoshi Tomimatsu (Tokyo, JP); Tatsuya Asahata (Tokyo, JP); Makoto Sato (Tokyo, JP); Masato Suzuki (Tokyo, JP)
Assignee: HITACHI HIGH-TECH SCIENCE CORPORATION
H01J37/28G01N23/225G02B27/0955H01J37/20H01J37/3056H01J2237/208H01J2237/20285H01J2237/31749
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,629,411
App. No.
16/192,723
Granted
Apr 21, 2020
Kind
B2
Abstract

(Task) To repeatedly perform an operation of extracting a sample piece formed by processing a sample with an ion beam and of transferring the extracted sample piece to a sample piece holder. (Problem Solving Means) A charged particle beam apparatus includes a computer that sets a shaping processing region including a bottom portion of sample piece in a thickness direction of the sample piece corresponding to a depth direction at the time of processing a sample after a needle holds the sample piece, and controls a focused ion beam irradiation optical system to irradiate the shaping processing region with a focused ion beam to thereby shape the sample piece.

Claims (27)

1. A charged particle beam apparatus automatically preparing a sample piece from a sample, the charged particle beam apparatus comprising:

a charged particle beam irradiation optical system configured to emit a charged particle beam;

a sample stage configured to move a sample mounted thereon;

a sample piece transferring means configured to retain and transport a sample piece separated and extracted from the sample;

a holder fixing base configured to retain a sample piece holder to which the sample piece is transferred; and

a computer configured to control the sample piece transferring means and the charged particle beam irradiation optical system so as to demarcate a shaping processing region, which includes an end portion of the sample piece in a thickness direction of the sample piece corresponding to a depth direction when processing the sample, on an image obtained by irradiating the sample piece with the charged particle beam while retaining the sample piece by the sample piece transferring means and to irradiate the shaping processing region with the charged particle beam, in order to shape the sample piece.

2. The charged particle beam apparatus according to claim 1 , wherein the computer controls the charged particle beam irradiation optical system such that a scanning direction of the charged particle beam when obtaining the image is rotated by a rotation angle according to a positioning of the sample piece retained by the sample piece transferring means.

3. The charged particle beam apparatus according to claim 2 , wherein the computer recognizes an edge of the end portion of the sample piece in the image obtained by rotating the scanning direction of the charged particle beam by the rotation angle and sets the shaping processing region based on the edge.

4. The charged particle beam apparatus according to claim 2 , wherein the sample piece transferring means includes a needle configured to retain and transport the sample piece separated and extracted from the sample and a needle driving mechanism configured to drive the needle, and

the computer controls the needle driving mechanism to control positioning of the sample piece with respect to the sample piece holder by axially rotating the needle retaining the sample piece.

5. The charged particle beam apparatus according to claim 3 , wherein the sample piece transferring means includes a needle configured to retain and transport the sample piece separated and extracted from the sample and a needle driving mechanism configured to drive the needle, and

the computer controls the needle driving mechanism to control positioning of the sample piece with respect to the sample piece holder by axially rotating the needle retaining the sample piece.

6. The charged particle beam apparatus according to claim 1 , wherein the computer controls the charged particle beam irradiation optical system so that the charged particle beam is emitted to the shaping processing region to shape the sample piece and then the charged particle beam is emitted to an observation surface of the sample piece to process the observation surface.

7. The charged particle beam apparatus according to claim 2 , wherein the computer controls the charged particle beam irradiation optical system so that the charged particle beam is emitted to the shaping processing region to shape the sample piece and then the charged particle beam is emitted to an observation surface of the sample piece to process the observation surface.

8. The charged particle beam apparatus according to claim 3 , wherein the computer controls the charged particle beam irradiation optical system so that the charged particle beam is emitted to the shaping processing region to shape the sample piece and then the charged particle beam is emitted to an observation surface of the sample piece to process the observation surface.

9. The charged particle beam apparatus according to claim 4 , wherein the computer controls the charged particle beam irradiation optical system so that the charged particle beam is emitted to the shaping processing region to shape the sample piece and then the charged particle beam is emitted to an observation surface of the sample piece to process the observation surface.

10. The charged particle beam apparatus according to claim 5 , wherein the computer controls the charged particle beam irradiation optical system so that the charged particle beam is emitted to the shaping processing region to shape the sample piece and then the charged particle beam is emitted to an observation surface of the sample piece to process the observation surface.

11. The charged particle beam apparatus according to claim 1 , wherein the computer recognizes a pattern exposed on a surface of the sample piece retained by sample piece transferring means and sets the shaping processing region so as not to interfere with the pattern.

12. The charged particle beam apparatus according to claim 2 , wherein the computer recognizes a pattern exposed on a surface of the sample piece retained by sample piece transferring means and sets the shaping processing region so as not to interfere with the pattern.

13. The charged particle beam apparatus according to claim 3 , wherein the computer recognizes a pattern exposed on a surface of the sample piece retained by sample piece transferring means and sets the shaping processing region so as not to interfere with the pattern.

14. The charged particle beam apparatus according to claim 4 , wherein the computer recognizes a pattern exposed on a surface of the sample piece retained by sample piece transferring means and sets the shaping processing region so as not to interfere with the pattern.

15. The charged particle beam apparatus according to claim 5 , wherein the computer recognizes a pattern exposed on a surface of the sample piece retained by sample piece transferring means and sets the shaping processing region so as not to interfere with the pattern.

16. The charged particle beam apparatus according to claim 6 , wherein the computer recognizes a pattern exposed on a surface of the sample piece retained by sample piece transferring means and sets the shaping processing region so as not to interfere with the pattern.

17. The charged particle beam apparatus according to claim 7 , wherein the computer recognizes a pattern exposed on a surface of the sample piece retained by sample piece transferring means and sets the shaping processing region so as not to interfere with the pattern.

18. The charged particle beam apparatus according to claim 8 , wherein the computer recognizes a pattern exposed on a surface of the sample piece retained by sample piece transferring means and sets the shaping processing region so as not to interfere with the pattern.

19. The charged particle beam apparatus according to claim 9 , wherein the computer recognizes a pattern exposed on a surface of the sample piece retained by sample piece transferring means and sets the shaping processing region so as not to interfere with the pattern.

20. The charged particle beam apparatus according to claim 10 , wherein the computer recognizes a pattern exposed on a surface of the sample piece retained by sample piece transferring means and sets the shaping processing region so as not to interfere with the pattern.

Assignments (3)
CHANGE OF NAME Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH ANALYSIS CORPORATION
Reel/Frame 072905/0225 →
CHNAGE OF ADDRESS Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 072909/0725 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2018
From: TOMIMATSU, SATOSHI; ASAHATA, TATSUYA; SATO, MAKOTO; SUZUKI, MASATO
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 047525/0001 →
Priority Claims (1)
JP 2017-222228 · Nov 17, 2017 · national
Continuity (1)
Related Publication 20190157037A1 · May 23, 2019