Air-cooled heat exchanger and thermal arrangement for stacked electronics
A stacked electronic arrangement provides independent upgradability of active component boards and radiator boards, enabling quick changes in chip set and alternate polarizations, and includes: an active tile circuit card assembly (CCA); a passive radiator CCA; a tile frame; and a heat exchanger. The active tile CCA includes transmit/receive modules that accept, amply and transmit radar signals. The passive radiator CCA includes patch radiator plugins that receive and then radiate the amplified signal from the modules. The tile frame separates the active tile and the passive radiator CCAs. An elongated casing of the heat exchanger creates an accommodating space for air flow, and forms a first inlet, a second inlet, and a central exhaust plenum between the first and second inlets. High density tins are positioned within the accommodating space between the first and second inlets, and which have openings to the exhaust outlet.
1. An air-cooled heat exchanger comprising:
a casing, said casing having a first end and a second end and being elongated in an axial direction between said first end and said second end, said casing comprising an accommodating space with a first air inlet into said accommodating space, a second air inlet into said accommodating space, and an air outlet positioned on a first side of said casing between said first air inlet and said second air inlet;
wherein said first air inlet is positioned at said first end of said casing, and said second air inlet is positioned at said second end of said casing;
wherein said air outlet is centrally positioned on said first side of said casing, being substantially midway between said first air inlet and said second air inlet;
a first plurality of high density fins, said first plurality of high density fins positioned within the accommodating space between said first air inlet and said air outlet to define a first flow path;
a second plurality of high density fins, said second plurality of high density fins positioned within the accommodating space between said second air inlet and said air outlet to define a second flow path; wherein said second flow path is separated from said first flow path;
wherein a direction of said first flow path in said first plurality of fins between said first air inlet and said air outlet is opposite to a direction of said second flow path in said second plurality of fins between said second air inlet and said air outlet, to exchange heat away from an entire length in the axial direction of a second side and from at least a majority of a length of said first side of said elongated casing; and
a fan positioned to drive air into each of said first air inlet and said second air inlet.
2. The air-cooled heat exchanger according to claim 1 , wherein each of said first and second plurality of high density fins comprise a sheet of material formed into a rectangular-shaped step pattern; and wherein each of said fins comprises an opening configured to permit air flow into said centrally positioned air outlet.
3. The air-cooled heat exchanger according to claim 2 , wherein a spacing for each step of said rectangular-shaped step pattern is between 0.76 mm and 3.30 mm (0.03 inches and 0.13 inches).
4. The air-cooled heat exchanger according to claim 2 , wherein a spacing for each step of said rectangular-shaped step pattern is between 1.52 mm and 2.54 mm (0.06 inches and 0.10 inches).
5. The air-cooled heat exchanger according to claim 2 , wherein a spacing for each step of said rectangular-shaped step pattern is between 2.03 mm and 2.159 mm (0.080 inches and 0.085 inches).
6. The air-cooled heat exchanger according to claim 2 , wherein said air outlet is oriented to provide an exit flow path that is substantially perpendicular to each of said first flow path and said second flow path.