RFID transponder chip modules, elements thereof, and methods
A planar antenna (PA) of a transponder chip module (TCM) may have a planar antenna (PA) etched from a foil to have a track width of approximately 100 μm or less; and a spacing between adjacent turns of the track of approximately 25 μm or less. The track may subsequently be plated to reduce the spacing. A module tape (MT 2 ) may have contact pads (CP) on one side thereof and a connection bridge (CBR) on another side thereof, and may be joined with a module tape (MT 1 ) having a planar antenna (PA).
1. A transponder chip module (TCM) comprising a module tape (MT) and an antenna (PA) in the form of a track having a number of turns, characterized in that:
the track has a width of approximately 100 μm or less; and
a spacing between adjacent turns of the track is approximately 25 μm or less.
2. The transponder chip module of claim 1 , wherein:
the antenna is disposed in a peripheral portion of the module tape.
3. The transponder chip module of claim 1 , wherein:
the antenna is etched from a copper layer, cladding or foil.
4. The transponder chip module of claim 3 , wherein:
the copper layer, cladding or foil has a thickness of approximately 12 μm.
5. The transponder chip module of claim 3 , wherein:
the etched antenna is subsequently plated.
6. The transponder chip module of claim 3 , wherein:
the copper layer, cladding or foil has a thickness of approximately 18 μm-35 μm.
7. The transponder chip module (TCM) of claim 1 , further comprising:
an RFID chip.
8. A method of making a planar antenna (PA) for a transponder chip module (TCM), the planar antenna (PA) having the form of a conductive track having several turns, comprising:
etching the planar antenna from a copper layer, cladding or foil;
wherein:
the track has a width of approximately 100 μm or less; and
a spacing between adjacent turns of the track is approximately 25 μm or less.
9. The method of claim 8 , wherein:
the etching comprises laser ablation.
10. The method of claim 8 , further comprising:
subsequent to etching, plating the antenna structure to reduce the spacing.
11. The method of claim 8 , further comprising:
connecting the planar antenna to an RFID chip.
12. A transponder chip module (TCM) comprising:
a module tape (MT 2 ) comprising a substrate having contact pads (CP) disposed on a top surface thereof and a connection bridge (CBR) disposed on a bottom surface thereof.
13. The transponder chip module of claim 12 , further comprising:
an additional module tape (MT 1 ) comprising another substrate having an antenna structure (AS) disposed on a bottom surface thereof;
wherein the module tape is joined to the additional module tape.
14. The transponder chip module of claim 13 , wherein:
the top of the additional module tape is joined to the bottom of the module tape.
15. The transponder chip module of claim 13 , further comprising:
an RFID chip (IC) disposed through an opening (OP) extending through the additional module tape, thereby allowing mounting of an RFID chip (IC) on the module tape.
16. The transponder chip module of claim 12 , further comprising:
conductive elements extending through the module tape and aligned with at least some of the contact pads.
17. The transponder chip module of claim 16 , further comprising:
through holes (TH) extending through the additional module tape and aligned with the conductive elements extending through the second module tape.