Apparatus and method for multi-die interconnection
A semiconductor and a method of fabricating the semiconductor having multiple, interconnected die including: providing a semiconductor substrate having a plurality of disparate die formed within the semiconductor substrate, and a plurality of scribe lines formed between pairs of adjacent die of the plurality of disparate die; and fabricating, by a lithography system, a plurality of inter-die connections that extend between adjacent pair of die of the plurality of die.
1. A semiconductor having multiple, interconnected die, the semiconductor comprising:
a semiconductor substrate;
a plurality of die fabricated within the semiconductor substrate by one or more lithography processes applied to the semiconductor substrate;
a circuit layer formed at each of the plurality of die;
a plurality of inter-die connections that communicatively connect disparate die of the plurality of die formed within the semiconductor substrate, wherein each of the plurality of inter-die connections extends between pairs of disparate die of the plurality of die, wherein the plurality of die include a subset of peripheral die defining a periphery of the semiconductor substrate, wherein at least one side of each of a second subset of peripheral die are formed without inter-die connections.
2. The semiconductor according to claim 1 , wherein:
each of the plurality of die is fabricated from a material from the semiconductor substrate.
3. The semiconductor according to claim 1 , wherein:
the semiconductor substrate comprises a singular, integrally continuous form, and
by the one or more lithography processes applied to the semiconductor substrate, the plurality of die are formed integrally and continuously with the singular, integrally continuous form of the semiconductor wafer.
4. The semiconductor according to claim 1 , further comprising:
a plurality of scribe lines formed within a material of the semiconductor substrate, wherein each scribe line of the plurality of scribe lines is positioned at the substrate between each pair of adjacent die of the plurality of die,
wherein each of the plurality of inter-die connections extends over one scribe line of the plurality of scribe lines positioned between each pair of adjacent die of the plurality of die.
5. The semiconductor according to claim 1 , wherein:
each of the plurality of die fabricated by the one or more lithography processes applied to the semiconductor substrate remain integral within the semiconductor substrate and are not cut from the semiconductor substrate.
6. The semiconductor according to claim 1 , wherein:
each of the plurality of inter-die connections comprises a single trace or a single wire that connects only two die of the plurality of die along the semiconductor substrate.
7. The semiconductor according to claim 1 , wherein:
each of the plurality of die comprises a protective barrier comprising a seal ring that encompasses a periphery of each of the plurality of die.
8. The semiconductor according to claim 1 , wherein:
each of the plurality of inter-die connections comprises a conductive material that enables a transmission of signals thereon between circuit layers of pairs of die of the plurality of die.
9. The semiconductor according to claim 1 , wherein:
a seal ring extends between the circuit layer of each of the plurality of die and intersecting edges of side faces and a top surface of each of the plurality of die.
10. The semiconductor according to claim 1 , wherein
the plurality of die include:
(i) a subset of interior die defining an interior of the semiconductor substrate, wherein first subset of interior die have inter-die connections with adjacent die along all sides of the first subset of interior die.
11. An integrated circuit comprising:
an integrated circuit substrate;
a plurality of die fabricated within the integrated circuit substrate by one or more lithography processes applied to the integrated circuit substrate;
a circuit layer formed at each of the plurality of die;
a plurality of inter-die connections that communicatively connect distinct pairs of die of the plurality of die, wherein:
each of the plurality of inter-die connections extends between the distinct pairs of disparate die of the plurality of die, and
the plurality of die include a subset of peripheral die defining a periphery of the integrated circuit substrate, wherein at least one side of each of a second subset of peripheral die are formed without inter-die connections.