IP Library Assignment 075845/0844
Patent Assignment
Reel/Frame 075845/0844

Security Interest

Recorded: 2026-06-18 Pages: 13
Assignor
CEREBRAS SYSTEMS INC.
Executed: 2026-06-17
Assignee
MORGAN STANLEY SENIOR FUNDING, INC., AS THE COLLATERAL AGENT
1300 THAMES STREET, 4TH FLOOR, THAMES STREET WHARF, BALTIMORE, MARYLAND, 21231
Covered Properties (59)
Task Synchronization for Accelerated Deep Learning
Application: 19/199,955 →
Publication: US US20250265225A1
Dynamic Routing for Accelerated Deep Learning
Application: 18/945,169 →
Publication: US US20250080477A1
Advanced Wavelet Filtering for Accelerated Deep Learning
Application: 19/001,087 →
Publication: US US20250131237A1
Placement of Compute and Memory for Accelerated Deep Learning
Application: 18/978,383 →
Publication: US US20250110808A1
Optimized Placement for Efficiency for Accelerated Deep Learning
Application: 17/771,606 →
Publication: US US20230125522A1
Distributed Placement of Linear Operators for Accelerated Deep Learning
Application: 17/771,686 →
Publication: US US20220374288A1
Methods and Systems of Depth-Wise Separable (Dwd) Convolution on a Multi-Dimensional Memory Fabric
Application: 18/141,991 →
Publication: US US20240370522A1
Apparatus and Method for Fabricating Multi-Die Interconnection Using Lithography Process
Application: 19/338,988 →
Publication: US US20260018522A1
Systems and Methods for Autoregressive Inference
Application: 19/307,690 →
Publication: US US20260057263A1
Apparatus and Method for Multi-Die Interconnection
Application: 16/019,882 →
Publication: US US20190027466A1
Apparatus and Method for Multi-Die Interconnection
Application: 16/169,227 →
Publication: US US20190057953A1
Apparatus and Method for Multi-Die Interconnection
Application: 16/174,019 →
Publication: US US20190074262A1
Apparatus and Method for Multi-Die Interconnection
Application: 16/251,522 →
Publication: US US20190157243A1
Apparatus and Method for Multi-Die Interconnection
Application: 16/743,485 →
Publication: US US20200152605A1
Apparatus and Method for Multi-Die Interconnection
Application: 16/994,169 →
Publication: US US20200381394A1
Apparatus and Method for Fabricating Multi-Die Interconnection Using Lithography Process
Application: 17/746,806 →
Publication: US US20220278043A1
Apparatus and Method for Securing Substrates with Varying Coefficients of Thermal Expansion
Application: 16/029,207 →
Publication: US US20190027460A1
Apparatus and Method for Securing Substrates with Varying Coefficients of Thermal Expansion
Application: 16/583,725 →
Publication: US US20200020659A1
Apparatus and Method for Securing Substrates with Varying Coefficients of Thermal Expansion
Application: 16/860,985 →
Publication: US US20200258860A1
Apparatus and Method for Securing Substrates with Varying Coefficients of Thermal Expansion
Application: 17/114,287 →
Publication: US US20210091035A1
Apparatus and Method for Securing Components of an Integrated Circuit
Application: 16/056,792 →
Publication: US US20190067052A1
Apparatus and Method for Securing Components of an Integrated Circuit
Application: 16/267,644 →
Publication: US US20190172736A1
Apparatus and Method for Securing Components of an Integrated Circuit
Application: 16/567,097 →
Publication: US US20200006097A1
Apparatus and Method for Securing Components of an Integrated Circuit
Application: 16/994,248 →
Publication: US US20200381274A1
Systems and Methods for Precision Fabrication of an Orifice Within an Integrated Circuit
Application: 16/593,831 →
Publication: US US20200118826A1
Systems and Methods for Precision Fabrication of an Orifice Within an Integrated Circuit
Application: 16/593,838 →
Publication: US US20200118877A1
System and Method for Alignment of an Integrated Circuit
Application: 17/093,283 →
Publication: US US20210143041A1
Systems and Methods for Hierarchical Exposure of an Integrated Circuit Having Multiple Interconnected Die
Application: 16/717,848 →
Publication: US US20200203308A1
Systems and Methods for Powering an Integrated Circuit Having Multiple Interconnected Die
Application: 16/810,520 →
Publication: US US20200286858A1
Systems and Methods for Powering an Integrated Circuit Having Multiple Interconnected Die
Application: 17/013,292 →
Publication: US US20200402957A1
Apparatuses and Methods for Implementing a Sliding Thermal Interface Between Substrates with Varying Coefficients of Thermal Expansion
Application: 16/537,933 →
Publication: US US20200051890A1
Apparatuses and Methods for Implementing a Sliding Thermal Interface Between Substrates with Varying Coefficients of Thermal Expansion
Application: 17/144,839 →
Publication: US US20210134700A1
Neuron Smearing for Accelerated Deep Learning
Application: 16/500,357 →
Publication: US US20200380344A1
Dataflow Triggered Tasks for Accelerated Deep Learning
Application: 16/463,091 →
Publication: US US20190286987A1
Wavelet Representation for Accelerated Deep Learning
Application: 16/088,035 →
Publication: US US20190258919A1
Control Wavelet for Accelerated Deep Learning
Application: 16/090,049 →
Publication: US US20190258921A1
Control Wavelet for Accelerated Deep Learning
Application: 17/005,140 →
Publication: US US20210224639A1
Accelerated Deep Learning
Application: 15/903,340 →
Publication: US US20180314941A1
Accelerated Deep Learning
Application: 16/911,203 →
Publication: US US20210142167A1
Accelerated Deep Learning
Application: 16/481,016 →
Publication: US US20200005142A1
Task Synchronization for Accelerated Deep Learning
Application: 16/603,647 →
Publication: US US20200133741A1
Task Synchronization for Accelerated Deep Learning
Application: 17/367,879 →
Publication: US US20220172031A1
Basic Wavelet Filtering for Accelerated Deep Learning
Application: 17/764,691 →
Publication: US US20230162012A1
Advanced Wavelet Filtering for Accelerated Deep Learning
Application: 17/764,453 →
Publication: US US20220343136A1
Dynamic Routing for Accelerated Deep Learning
Application: 17/764,894 →
Publication: US US20230069536A1
Microthreading for Accelerated Deep Learning
Application: 16/603,950 →
Publication: US US20200125934A1
Processor Element Redundancy for Accelerated Deep Learning
Application: 17/272,141 →
Publication: US US20210256362A1
Floating-Point Unit Stochastic Rounding for Accelerated Deep Learning
Application: 16/603,789 →
Publication: US US20200380370A1
Data Structure Descriptors for Deep Learning Acceleration
Application: 16/089,261 →
Publication: US US20190258920A1
Data Structure Descriptors for Deep Learning Acceleration
Application: 16/929,453 →
Publication: US US20210166109A1
Data Structure Descriptors for Deep Learning Acceleration
Application: 17/582,904 →
Publication: US US20220398443A1
Fabric Vectors for Deep Learning Acceleration
Application: 16/603,184 →
Publication: US US20200380341A1
Placement of Compute and Memory for Accelerated Deep Learning
Application: 17/771,410 →
Publication: US US20230071424A1
Numerical Representation for Neural Networks
Application: 17/262,717 →
Publication: US US20210142155A1
Backpressure for Accelerated Deep Learning
Application: 16/088,706 →
Publication: US US20190332926A1
Task Activating for Accelerated Deep Learning
Application: 16/604,108 →
Publication: US US20210004674A1
Task Activating for Accelerated Deep Learning
Application: 17/504,784 →
Publication: US US20220284275A1
Scaled Compute Fabric for Accelerated Deep Learning
Application: 17/271,801 →
Publication: US US20210248453A1
Isa Enhancements for Accelerated Deep Learning
Application: 17/271,532 →
Publication: US US20210255860A1
Related Assignments (20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 22, 2018
From: FRICKER, JEAN-PHILIPPE; FEROLITO, PHILIP
To: CEREBRAS SYSTEMS INC.
Reel/Frame 046666/0731 →
Assignment of Assignor's Interest Aug 23, 2018
From: FRICKER, JEAN-PHILIPPE
To: CEREBRAS SYSTEMS INC.
Reel/Frame 046687/0987 →
Assignment of Assignor's Interest Oct 29, 2018
From: FRICKER, JEAN-PHILIPPE; FEROLITO, PHILIP
To: CEREBRAS SYSTEMS INC.
Reel/Frame 047344/0700 →
Assignment of Assignor's Interest Nov 16, 2018
From: FRICKER, JEAN-PHILIPPE; FEROLITO, PHILIP
To: CEREBRAS SYSTEMS INC.
Reel/Frame 047531/0893 →
Assignment of Assignor's Interest Jan 18, 2019
From: FRICKER, JEAN-PHILIPPE; FEROLITO, PHILIP
To: CEREBRAS SYSTEMS INC.
Reel/Frame 048058/0092 →
Assignment of Assignor's Interest Sep 26, 2019
From: FRICKER, JEAN-PHILIPPE
To: CEREBRAS SYSTEMS INC.
Reel/Frame 050501/0288 →
Assignment of Assignor's Interest Jan 15, 2020
From: FRICKER, JEAN-PHILILLPE; FEROLITO, PHILIP
To: CEREBRAS SYSTEMS INC.
Reel/Frame 051524/0016 →
Assignment of Assignor's Interest Apr 28, 2020
From: FRICKER, JEAN-PHILIPPE
To: CEREBRAS SYSTEMS INC.
Reel/Frame 052516/0895 →
Assignment of Assignor's Interest Aug 14, 2020
From: FRICKER, JEAN-PHILIPPE; FEROLITO, PHILIP
To: CEREBRAS SYSTEMS INC.
Reel/Frame 053503/0526 →
Assignment of Assignor's Interest May 17, 2022
From: FRICKER, JEAN-PHILIPPE; FEROLITO, PHILIP
To: CEREBRAS SYSTEMS INC.
Reel/Frame 059937/0187 →
Assignment of Assignor's Interest Sep 9, 2022
From: KIBARDIN, VLADIMIR; JAMES, MICHAEL EDWIN; MORRISON, MICHAEL; LIE, SEAN
To: CEREBRAS SYSTEMS INC.
Reel/Frame 061044/0881 →
Assignment of Assignor's Interest Sep 14, 2022
From: KIBARDIN, VLADIMIR; JAMES, MICHAEL EDWIN; MORRISON, MICHAEL; LIE, SEAN
To: CEREBRAS SYSTEMS INC.
Reel/Frame 061097/0245 →
Confirmatory License Jan 25, 2024
From: CEREBRAS SYSTEMS INC
To: THE GOVERNMENT OF THE UNITED STATES AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE
Reel/Frame 066370/0193 →
Assignment of Assignor's Interest May 3, 2024
From: KIBARDIN, VLADIMIR V.; JAMES, MICHAEL E., MR.
To: CEREBRAS SYSTEMS INC.
Reel/Frame 067309/0403 →
Assignment of Assignor's Interest Nov 25, 2024
From: MORRISON, MICHAEL; JAMES, MICHAEL EDWIN; LIE, SEAN; AREKAPUDI, SRIKANTH
To: CEREBRAS SYSTEMS INC.
Reel/Frame 069396/0380 →
Assignment of Assignor's Interest Jan 15, 2025
From: KIBARDIN, VLADIMIR; JAMES, MICHAEL EDWIN; MORRISON, MICHAEL; LIE, SEAN
To: CEREBRAS SYSTEMS INC.
Reel/Frame 069872/0537 →
Assignment of Assignor's Interest Jun 2, 2025
From: LIE, SEAN; MORRISON, MICHAEL; AREKAPUDI, SRIKANTH; JAMES, MICHAEL EDWIN
To: CEREBRAS SYSTEMS INC.
Reel/Frame 071279/0784 →
Assignment of Assignor's Interest Oct 2, 2025
From: JAMES, MICHAEL EDWIN; LIE, SEAN; KIBARDIN, VLADIMIR
To: CEREBRAS SYSTEMS INC.
Reel/Frame 072447/0054 →
Assignment of Assignor's Interest Oct 28, 2025
From: MORRISON, MICHAEL; JAMES, MICHAEL EDWIN; LIE, SEAN; AREKAPUDI, SRIKANTH
To: CEREBRAS SYSTEMS INC.
Reel/Frame 072695/0446 →
Assignment of Assignor's Interest Jan 27, 2026
From: FRICKER, JEAN-PHILIPPE; FEROLITO, PHILIP
To: CEREBRAS SYSTEMS INC.
Reel/Frame 073595/0391 →