Apparatus and method for multi-die interconnection

1. An integrated circuit comprising:

a semiconductor substrate;

a plurality of die lithographically formed within the semiconductor substrate, the plurality of die comprising a first die defining a plurality of die edges; and

a circuit layer formed at the plurality of die, the circuit layer comprising a plurality of inter-die connections that communicatively connect die of the plurality of die, the plurality of inter-die connections comprising a first set of inter-die connections associated with the first die;

wherein the first set of inter-die connections comprises, for each die edge of the first die, a respective inter-die connection that crosses the die edge.

2. The integrated circuit of claim 1 , wherein each inter-die connection of the first set terminates at the first die.

3. The integrated circuit of claim 1 , wherein:

the plurality of die comprises a second die defining a second plurality of die edges;

the plurality of inter-die connections comprises a second set of inter-die connections associated with the second die;

the second set of inter-die connections comprises, for each die edge of the second die, a respective inter-die connection that crosses the die edge; and

the first and second die are each arranged along a diagonal of the semiconductor substrate.

4. The integrated circuit of claim 1 , wherein the plurality of die comprises a plurality of interior die, each interior die defining a respective plurality of die edges, wherein the plurality of inter-die connections comprises a respective inter-die connection crossing each die edge of each interior die, wherein each die edge of the first die is adjacent to an interior die.

5. The integrated circuit of claim 1 , wherein the plurality of inter-die connections communicatively connect pairs of adjacent die of the plurality of die.

6. The integrated circuit of claim 5 , the plurality of inter-die connections defining a first, second, and third trace, wherein the first, second, and third trace each communicatively couple the first die to a second die.

7. The integrated circuit of claim 6 , wherein:

the first trace defines a first die series from the first die to the second die, wherein:

the first die series consists of the first die, the second die, and a first series of intermediary die;

the first series of intermediary die consists of each intermediary die of a first set of intermediary die; and

each die of the first series of intermediary die is directly communicatively connected to a respective following die of the first die series via a respective inter-die connection;

the second trace defines a second die series from the first die to the second die, wherein:

the second die series consists of the first die, the second die, and a second series of intermediary die;

the second series of intermediary die consists of each intermediary die of a second set of intermediary die; and

each die of the second series of intermediary die is directly communicatively connected to a respective following die of the second die series via a respective inter-die connection;

the third trace defines a third die series from the first die to the second die, wherein:

the third die series consists of the first die, the second die, and a third series of intermediary die;

the third series of intermediary die consists of each intermediary die of a third set of intermediary die; and

each die of the third series of intermediary die is directly communicatively connected to a respective following die of the third die series via a respective inter-die connection; and

the first, second, and third sets of intermediary die are disjoint.

8. The integrated circuit of claim 7 , wherein either the first, second, or third set of intermediary die is an empty set.

9. The integrated circuit of claim 1 , wherein:

the plurality of die further comprises a second die;

the first set of inter-die connections comprises a first inter-die connection; and

the circuit layer further comprises a first off-die connection, the first die indirectly communicatively connected to the first off-die connection via the second die and the first inter-die connection.

10. The integrated circuit of claim 1 , wherein the first set of inter-die connections comprises, for each die edge of the first die, two inter-die connections that cross the die edge.

11. The integrated circuit of claim 1 , wherein each of the plurality of die is substantially coplanar with a broad face of the first die.

12. An integrated circuit comprising:

a semiconductor substrate;

a plurality of die lithographically fabricated within the semiconductor substrate;

a circuit layer formed at the plurality of die, the circuit layer comprising a plurality of inter-die connections that communicatively connect die of the plurality of die;

wherein the plurality of die comprises a first die associated with:

a first inter-die connection crossing a first edge of the first die; and

a second circuit connection crossing a second edge of the first die, the second edge opposing the first edge across the first die, wherein the second circuit connection is not an inter-die circuit connection,

wherein the first die further comprises a third inter-die connection crossing a third edge of the first die, the third edge adjacent to the second edge.

13. The integrated circuit of claim 12 , wherein the second circuit connection comprises:

a first end connected to the first die; and

a second end connected to an off-die device.

14. The integrated circuit of claim 12 , wherein the second circuit connection comprises a fan-out connection.

15. The integrated circuit of claim 12 , wherein the plurality of die further comprises a second die opposing the first die across a midplane of the substrate, the second die associated with:

a fourth inter-die connection crossing a fourth edge of the second die, the fourth edge proximal to the first die; and

a fifth circuit connection crossing a fifth edge of the second die, the fifth edge opposing the fourth edge across the second die, wherein the fifth circuit connection is not an inter-die circuit connection.

16. The integrated circuit of claim 12 , wherein the first die is arranged along an outer periphery of the semiconductor substrate.

17. The integrated circuit of claim 16 , wherein the second circuit connection is a peripheral connection.

18. The integrated circuit of claim 16 , wherein the first die is arranged along a first substrate edge of the semiconductor substrate; wherein a second die is arranged along a second substrate edge of the semiconductor substrate, the second substrate edge of the semiconductor substrate adjacent to the first substrate edge, the second die having a fourth inter-die connection adjacent to the second substrate edge.

19. The integrated circuit of claim 18 , wherein the fourth inter-die connection is inoperative.

20. The integrated circuit of claim 19 , wherein the fourth inter-die connection terminates at a partial die.