Apparatus and method for multi-die interconnection

1. A semiconductor wafer comprising:

a body, the body of the semiconductor wafer comprising a single, continuous substrate formed with semiconductor material;

a plurality of distinct die lithographically formed within the body of the semiconductor wafer, wherein each of the plurality of distinct die is integrally formed with the semiconductor material of the body of the semiconductor wafer and is not diced from the body; and

a plurality of inter-die circuit connections that each:

(i) extend across the semiconductor wafer and (ii) connect distinct pairs of die of the plurality of distinct die formed within the body of the semiconductor wafer, wherein a subset of the plurality of distinct die defines one or more peripheral regions of the semiconductor wafer, each of a second plurality of circuit connections having a first end connected to an active circuitry layer of each of one or more die of the subset and having a second end extending to one or more off-die devices.

2. The semiconductor wafer according to claim 1 , wherein

at a time of forming the plurality of inter-die circuit connections, each of the plurality of distinct die are maintained as continuous parts of the body of the semiconductor wafer.

3. The semiconductor according to claim 1 , further comprising:

a circuitry layer at each of the plurality of distinct die, wherein the plurality of inter-die circuit connections connect circuitry layers of the distinct pairs of die.

4. The semiconductor wafer according to claim 1 , further comprising:

a protective barrier that (1) is applied to peripheral regions of each of the plurality of distinct die and (2) encapsulates each respective die of the plurality of distinct die other than a circuitry layer of the respective die.

5. The semiconductor wafer according to claim 1 , wherein the plurality of distinct die of the semiconductor wafer include:

(i) a first subset of interior die of the plurality of distinct die defining an interior of the semiconductor wafer, and

(ii) a second subset of peripheral die of the plurality of distinct die defining a periphery of the semiconductor wafer, wherein fan-out circuit connections extend from the second subset of peripheral die.

6. The semiconductor wafer according to claim 1 , wherein

the semiconductor wafer comprises an un-partitioned substrate at a time when the plurality of inter-die circuit connections are fabricated along the semiconductor wafer.

7. The semiconductor wafer according to claim 1 , wherein:

each of the plurality of inter-die circuit connections comprises a single trace or a single wire that connects only two die of the plurality of distinct die formed within the body of the semiconductor wafer.

8. The semiconductor wafer according to claim 1 , wherein:

each of the plurality of inter-die circuit connections comprises a conductive material that enables a transmission of signals between circuit layers of pairs of die of the plurality of distinct die.

9. A method of fabricating the semiconductor wafer according to claim 1 comprising:

providing the semiconductor wafer.

10. A method of fabricating a semiconductor wafer comprising:

providing a semiconductor wafer having:

a body, the body of the semiconductor wafer comprising a single, continuous substrate formed with semiconductor material;

a plurality of distinct die lithographically formed within the body of the semiconductor wafer, wherein each of the plurality of distinct die is integrally formed with the semiconductor material of the body of the semiconductor wafer and is not diced from the body; and

a plurality of inter-die circuit connections that each:

(i) extend across the semiconductor wafer and (ii) connect distinct pairs of die of the plurality of distinct die formed within the body of the semiconductor wafer;

wherein a subset of the plurality of distinct die defines one or more peripheral regions of the semiconductor wafer, each of a second plurality of circuit connections having a first end connected to an active circuitry layer of each of one or more die of the subset and having a second end extending to one or more off-die devices.

11. The method according to claim 10 , further comprising:

providing a protective barrier at each of the plurality of distinct die that surrounds an active circuit region of each of the plurality of distinct die.

12. The method according to claim 10 , further comprising:

providing a protective barrier that:

(1) is applied to peripheral regions of each of the plurality of distinct die, and

(2) encapsulates each respective die of the plurality of distinct die other than a circuitry layer of the respective die.

13. The method according to claim 10 , further comprising:

identifying a largest usable geometry of the semiconductor wafer that includes an array of or a subset of the plurality of distinct die; and

fabricating a circuitry layer only at each of the plurality of distinct die within the identified largest usable geometry.

14. The method according to claim 10 , further comprising:

fabricating one or more circuitry layers on each of the plurality of distinct die formed within the body of the semiconductor wafer.

15. The method according to claim 10 , wherein:

each of the plurality of inter-die circuit connections extend from a first circuitry circuitry region of a first die of a pair of die formed within the body of the semiconductor wafer to a second circuitry region of a second die of the pair of die.

16. The method according to claim 10 , further comprising:

fabricating the plurality of inter-die circuit connections including:

setting a position of a die reticle overlapping a first circuitry region of a first die of each distinct pair of die of the plurality of distinct die and a second circuitry region of a second die of each distinct pair of die, wherein the die reticle comprises geometries for forming the plurality of inter-die circuit connections; and

upon setting the die reticle into position, exposing by a lithography system the die reticle thereby forming the plurality of inter-die circuit connections between each distinct pair of die.

17. The method according to claim 10 , further comprising:

fabricating the plurality of inter-die circuit connections including:

setting a position of a first die reticle over a first die of each distinct pair of die;

setting a position of a second die reticle over a second die of each distinct pair of die,

wherein the position of the second die reticle overlaps a portion of the first die reticle, and

wherein the first die reticle and the second die reticle comprise geometries for forming the plurality of inter-die circuit connections between each distinct pair of die;

upon setting the first die reticle into position, exposing by a lithography system the first die reticle thereby forming a first portion of each of the plurality of inter-die circuit connections between each distinct pair of die; and

upon setting the second die reticle into position, exposing by the lithography system the second die reticle thereby forming a second portion of each of the plurality of inter-die circuit connections between the pair of die.

18. The method according to claim 10 , wherein:

each of the plurality of inter-die circuit connections is defined by an overlap of a first layer of conductive material and a second layer of conductive material.

19. The method according to claim 10 , further comprising:

moving a photomask in an offset manner relative to a target die of the plurality of distinct die to create inter-die circuit connections between the target die and a plurality of die surrounding the target die.

20. A method of fabricating a semiconductor wafer comprising:

providing a semiconductor wafer having:

a body, the body of the semiconductor wafer comprising a single, continuous substrate formed with semiconductor material;

a plurality of distinct die lithographically formed within the body of the semiconductor wafer, comprising:

moving a photomask in an offset manner relative to a target die of the plurality of distinct die to create inter-die circuit connections between the target die and a plurality of die surrounding the target die,

wherein each of the plurality of distinct die is integrally formed with the semiconductor material of the body of the semiconductor wafer and is not diced from the body; and

a plurality of inter-die circuit connections that each:

(i) extend across the semiconductor wafer and (ii) connect distinct pairs of die of the plurality of distinct die formed within the body of the semiconductor wafer.