Circuit module
A circuit module 2 comprises: a wiring structure 4 ; at least one electronic component 6 a, 6 b arranged on the upper surface of the wiring structure 4 ; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6 a, 6 b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8 . The surface roughness of the portion S 1 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R 1 . The surface roughness of the portion S 2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R 2 . At least one R 1 satisfies the condition: R 1 >R 2.
1. A circuit module comprising; a wiring structure; at least one electronic component arranged on an upper surface of the wiring structure; an insulating resin layer provided on the upper surface of the wiring structure and in which the at least one electronic component is embedded; and a metal layer provided on an upper surface of the insulating resin layer, wherein when a surface roughness of a portion directly above the at least one electronic component on the upper surface of the insulating resin layer is expressed as R 1 , and a surface roughness of a portion other than the portion directly above the at least one electronic component on the upper surface of the insulating resin layer is expressed as R 2 , at least one R 1 satisfies the condition: R 1 >R 2 , when a surface roughness of a portion directly above the at least one electronic component on an upper surface of the metal layer is expressed as R 3 , at least one R 1 and R 3 satisfy the condition: R 1 >R 3 , the upper surface of the insulating resin layer above the at least one electronic component and the upper surface of the at least one electronic component have a same shape, the at least one electronic component is an inductor, resistor, or surface acoustic wave (SAW) filter, and at least a part of an upper surface of the at least one electronic component has a concave or a convex configuration.
2. The circuit module according to claim 1 , wherein R 1 /R 2 ranges from 1.01 to 8.00.
3. The circuit module according to claim 1 , wherein the at least one electronic component is an inductor.
4. The circuit module according to claim 1 , wherein the portion directly above the at least one electronic component on the upper surface of the metal layer is flat.