Semiconductor device having a bidirectional switch and a passive electrical network
A device includes a semiconductor body having an active region and a substrate region that is beneath the active region. A bidirectional switch is formed in the semiconductor body having first and second gate structures that are configured to block voltage across two polarities as between first and second input-output terminals that are in ohmic contact with the electrically conductive channel. First and second switching devices are configured to electrically connect the substrate region to the first and second input-output terminals, respectively. A passive electrical network includes a first capacitance connected between a control terminal of the first switching device and the second input-output terminal and a second capacitance connected between a control terminal of the second switching device and the first input-output terminal. The passive electrical network is configured temporarily electrically connect the substrate region to the first and second input-output terminal at different voltage conditions.
1. A semiconductor device, comprising:
a semiconductor body comprising an active region and a substrate region that is disposed beneath the active region,
a bidirectional switch formed in the semiconductor body and comprising first and second gate structures that are each configured to control a conductive state of an electrically conductive channel that is disposed in the active region, and first and second input-output terminals that are each in ohmic contact with the electrically conductive channel;
a first switching device configured to electrically connect the substrate region to the first input-output terminal;
a second switching device configured to electrically connect the substrate region to the second input-output terminal;
a passive electrical network comprising a first capacitance and a second capacitance, the first capacitance being connected between a control terminal of the second switching device and the first input-output terminal, the second capacitance being connected between a control terminal of the first switching device and the second input-output terminal.
2. The semiconductor device of claim 1 , wherein the first and second switching devices are current controlled switches.
3. The semiconductor device of claim 2 , wherein the semiconductor body comprises a type III semiconductor nitride, wherein the bidirectional switch is a high electron mobility transistor, and wherein the electrically conductive channel is a two-dimensional charge carrier gas.
4. The semiconductor device of claim 3 , wherein the first and second switching devices are high-electron-mobility transistors that are integrally formed in the semiconductor body.
5. The semiconductor device of claim 1 , wherein the first capacitance is exclusively connected between the control terminal of the second switching device and the first input-output terminal, and wherein the second capacitance is exclusively connected between the control terminal of the first switching device and the second input-output terminal.
6. The semiconductor device of claim 1 , wherein the passive electrical network further comprises:
a first voltage limiting element connected between the substrate region and an input of the first switching device; and
a second voltage limiting element connected between the substrate region and an input of the first switching device.
7. The semiconductor device of claim 1 , wherein the first and second switching devices are integrated within the semiconductor body.
8. The semiconductor device of claim 7 , wherein the passive electrical network is integrated within the semiconductor body and is exclusively connected to the first and second input-output terminals, the first and second switching devices and the substrate region.
9. A semiconductor device, comprising:
a type III semiconductor nitride body comprising an active region and a substrate region that is disposed beneath the active region,
a bidirectional switch formed in the type III semiconductor nitride body and comprising: first and second gate structures that are each configured to control a conductive state of an electrically conductive channel that is disposed in the active region, and first and second input-output terminals that are each in ohmic contact with the electrically conductive channel;
a first current controlled switch configured to electrically connect the substrate region to the first input-output terminal;
a second current controlled switch configured to electrically connect the substrate region to the second input-output terminal;
a passive electrical network comprising a first capacitance and a second capacitance, the first capacitance being connected between a control terminal of the second current controlled switch and the first input-output terminal, the second capacitance being connected between a control terminal of the first current controlled switch and the second input-output terminal.
10. The semiconductor device of claim 9 , wherein the bidirectional switch is a high electron mobility transistor, and wherein the electrically conductive channel is a two-dimensional charge carrier gas.
11. The semiconductor device of claim 10 , wherein the first and second current controlled switches are high-electron-mobility transistors that are integrally formed in the type III semiconductor nitride body.
12. The semiconductor device of claim 9 , wherein the first capacitance is exclusively connected between the control terminal of the second current controlled switch and the first input-output terminal, and wherein the second capacitance is exclusively connected between the control terminal of the first current controlled switch and the second input-output terminal.
13. The semiconductor device of claim 9 , wherein the passive electrical network further comprises:
a first voltage limiting element connected between the substrate region and an input of the first current controlled switch; and
a second voltage limiting element connected between the substrate region and an input of the first current controlled switch.
14. The semiconductor device of claim 9 , wherein the first and second current controlled switches are integrated within the type III semiconductor nitride body.
15. The semiconductor device of claim 14 , wherein the passive electrical network is integrated within the type III semiconductor nitride body and is exclusively connected to the first and second input-output terminals, the first and second current controlled switches and the substrate region.
16. A semiconductor device, comprising:
a semiconductor body comprising an active region and a substrate region beneath the active region;
a bidirectional switch formed in the semiconductor body and comprising first and second gate structures configured to block voltage across two polarities as between first and second input-output terminals that are in ohmic contact with an electrically conductive channel of the bidirectional switch;
first and second switching devices configured to electrically connect the substrate region to the first and second input-output terminals, respectively; and
a passive electrical network comprising a first capacitance connected between a control terminal of the first switching device and the second input-output terminal, and a second capacitance connected between a control terminal of the second switching device and the first input-output terminal,
wherein the passive electrical network is configured temporarily electrically connect the substrate region to the first and second input-output terminals at different voltage conditions.
17. The semiconductor device of claim 16 , wherein the first and second switching devices are current controlled switches.
18. The semiconductor device of claim 17 , wherein the semiconductor body comprises a type III semiconductor nitride, wherein the bidirectional switch is a high electron mobility transistor, and wherein the electrically conductive channel is a two-dimensional charge carrier gas.
19. The semiconductor device of claim 18 , wherein the first and second switching devices are high-electron-mobility transistors that are integrally formed in the semiconductor body.
20. The semiconductor device of claim 16 , wherein the first and second switching devices are integrated within the semiconductor body, and wherein the passive electrical network is integrated within the semiconductor body and is exclusively connected to the first and second input-output terminals, the first and second switching devices and the substrate region.