Method for coating a substrate

1. A method for subjecting a surface of a substrate to successive surface reactions of at least a first precursor, a second precursor and a first subsequent precursor according to the principles of atomic layer deposition for forming on the surface of the substrate a coating comprising two or more different coating layers, the method being carried out with a nozzle head comprising one or more first precursor nozzles for forming a first precursor zone and one or more second precursor nozzles for forming a second precursor zone, wherein the method comprises:

a primary deposition step comprising subjecting the surface of the substrate to the first precursor in the first precursor zone and subjecting the surface of the substrate to the second precursor in the second precursor zone for forming a first coating layer on the surface of the substrate;

a first changing step comprising changing the first precursor in the first precursor zone to a first subsequent precursor which is different than the first and second precursors;

an alternate deposition step comprising subjecting the surface of the substrate to the first subsequent precursor in the first precursor zone and subjecting the surface of the substrate to the second precursor in the second precursor zone for forming a subsequent coating layer on the surface of the substrate; and

transporting the substrate and simultaneously moving the nozzle head in a reciprocating manner over the surface of the substrate for carrying out the primary deposition step and the alternate deposition step.

2. The method according to claim 1 , wherein the method further comprises one of:

transporting the substrate in constant velocity; or

transporting the substrate linearly in constant velocity.

3. The method according to claim 2 , wherein the method further comprises one of:

transporting the substrate past the nozzle head; or

transporting the substrate inside a reaction chamber, the nozzle head being arranged inside the reaction chamber; or

transporting the substrate through a reaction chamber, the nozzle head being arranged inside the reaction chamber.

4. The method according to claim 1 , wherein the method further comprises one of:

transporting the substrate past the nozzle head; or

transporting the substrate inside a reaction chamber, the nozzle head being arranged inside the reaction chamber; or

transporting the substrate through a reaction chamber, the nozzle head being arranged inside the reaction chamber.

5. The method according to claim 1 , wherein the method further comprises one of:

transporting the substrate from a first roll to a second roll; or

transporting the substrate from a first roll to a second roll in a reaction chamber or through the reaction chamber, the nozzle head being arranged inside the reaction chamber.

6. The method according to claim 1 , wherein the method further comprises one of:

moving the nozzle head in a reciprocating manner between a first end position and a second end position; or

moving the nozzle head in a reciprocating manner between a first end position and a second end position in relation to the substrate; or

moving the nozzle head in a reciprocating manner along a curved or loop path; or

moving the nozzle head in a reciprocating manner along a curved or loop path in relation to the substrate.

7. The method according to claim 1 , wherein the primary deposition step comprises:

A) forming the first coating layer on the surface of the substrate, the forming of the first coating layer comprising sub-steps:

a) subjecting the surface of the substrate to the first precursor in the first precursor zone;

b) subjecting the surface of the substrate to the second precursor in the second precursor zone after sub-step a); and

performing sub-steps a) and b) one or more times successively until the first coating layer is formed on the surface of the substrate,

the first changing step comprising:

B) replacing the first precursor in the first precursor zone to the first subsequent precursor which is different than the first and second precursors, and

the alternate deposition step comprising:

C) forming the subsequent coating layer on the surface of the substrate, the forming of the subsequent coating layer comprising sub-steps:

d) subjecting the surface of the substrate to the first subsequent precursor in the first precursor zone;

e) subjecting the surface of the substrate to the second precursor in the second precursor zone after sub-step d); and

f) performing sub-steps d) and e) one or more times successively until the subsequent coating layer is formed, the subsequent coating layer being different than the first coating layer.

8. The method according to claim 7 , wherein the method further comprises:

carrying out the step A) by supplying the first precursor to the first coating zone for subjecting the surface of the substrate to the first precursor in the first precursor zone and by supplying the second precursor to the second precursor zone for subjecting the surface of the substrate to the second precursor in the second precursor zone; and one of

carrying out the step C) by supplying the first subsequent precursor to the first coating zone for subjecting the surface of the substrate to the first subsequent precursor in the first precursor zone and by supplying the second precursor to the second precursor zone for subjecting the surface of the substrate to the second precursor in the second precursor zone; or

carrying out the step C) by supplying the first subsequent precursor to the first coating zone for subjecting the surface of the substrate to the first subsequent precursor zone for subjecting the surface of the substrate to the second subsequent precursor in the second precursor zone.

9. The method according to claim 1 , wherein the method further comprises a second changing step comprising:

D) replacing the first subsequent precursor in the first precursor zone to the first precursor.

10. The method according to claim 9 , wherein the method further comprises:

repeating step A) after step D) for forming two first coating layers; or

repeating steps A), B), C) and D) one or more times for forming two or more first coating layers and two or more subsequent coating layers; or

repeating steps B) and C) one or more times using different subsequent precursors (C, D) in successive repeated steps B) and C) for forming two or more different subsequent coating layers, and repeating steps B) and C) after steps A) and D); or

repeating steps B) and C) one or more times using different subsequent precursors (C, D) in successive repeated steps B) and C) for forming two or more different subsequent coating layers, and repeating steps B) and C) successively without repeating steps A) and D) between successive repeated steps B) and C).

11. The method according to claim 10 , wherein the method further comprises:

using a third precursor as the first subsequent precursor in all of the repeated steps B) and C) for forming the subsequent coating layer in step C); or

using two or more different precursors as the first subsequent precursor in the repeated steps B) and C) for forming two or more different subsequent coating layers in repeated steps C); or

using a third precursor as the first subsequent precursor in all of the repeated steps B) and C) and using a fourth precursor as the second subsequent precursor in all of the repeated steps B) and C) for forming the subsequent coating layer in step C); or

using two or more different precursors as the first subsequent precursor in the repeated steps B) and C) and using two or more different precursors as the second subsequent precursor in the repeated steps B) and C) for forming two or more different subsequent coating layers in repeated steps C).

12. The method according to claim 1 , wherein:

the first changing step further comprises changing the second precursor in the second precursor zone to a second subsequent precursor which is different than the first precursor, the second precursors and the first subsequent precursor (A, B, C); and

the alternate deposition step further comprises subjecting the surface of the substrate to the first subsequent precursor in the first precursor zone and subjecting the surface of the substrate to the second subsequent precursor in the second precursor zone for forming the subsequent coating layer on the surface of the substrate.

13. The method according to claim 12 , wherein the primary deposition step comprises:

A) forming the first coating layer on the surface of the substrate, the forming of the first coating layer comprising sub-steps:

a) subjecting the surface of the substrate to the first precursor in the first precursor zone;

b) subjecting the surface of the substrate to the second precursor in the second precursor zone after sub-step a); and

c) performing sub-steps a) and b) one or more times successively until the first coating layer is formed on the surface of the substrate,

the alternate deposition step comprising:

B) replacing the first precursor in the first precursor zone to the first subsequent precursor which is different than the first and second precursors and replacing the second precursor in the second precursor zone to the second subsequent precursor which is different than the first precursor, second precursors and the first subsequent precursor (A, B, C); and

C) forming the subsequent coating layer on the surface of the substrate, the forming of the subsequent coating layer comprising sub-steps:

d) subjecting the surface of the substrate to the first subsequent precursor in the first precursor zone;

e) subjecting the surface of the substrate to the second subsequent precursor in the second precursor zone after sub-step d); and

f) performing sub-steps d) and e) one or more times successively until the subsequent coating layer is formed, the subsequent coating layer being different than the first coating layer.

14. The method according to claim 13 , wherein the second changing step comprises:

D) replacing the first subsequent precursor in the first precursor zone to the first precursor and replacing the second subsequent precursor in the second precursor zone to the second precursor.

15. The method according to claim 14 , wherein the method further comprises:

repeating step A) after step D) for forming two first coating layers; or

repeating steps A), B), C) and D) one or more times for forming two or more first coating layers and two or more subsequent coating layers; or

repeating steps B) and C) one or more times using different subsequent precursors (C, D) in successive repeated steps B) and C) for forming two or more different subsequent coating layers, and repeating steps B) and C) after steps A) and D); or

repeating steps B) and C) one or more times using different subsequent precursors (C, D) in successive repeated steps B) and C) for forming two or more different subsequent coating layers, and repeating steps B) and C) successively without repeating steps A) and D) between successive repeated steps B) and C).

16. The method according to claim 1 , wherein one of:

the first precursor and the second precursor are supplied continuously to the first precursor zone and the second precursor zone, respectively, in step A), and the first subsequent precursor and the second precursor is supplied continuously to the first precursor zone and the second precursor zone, respectively, in step C); or

the first precursor and the second precursor are supplied continuously to the first precursor zone and the second precursor zone, respectively, in step A), and the first subsequent precursor and the second subsequent precursor is supplied continuously to the first precursor zone and the second precursor zone, respectively, in step C).

17. The method according to claim 1 , wherein the method further comprises:

supplying the first precursor in step A) or the first subsequent precursor in step C) via the one or more first precursor nozzles;

supplying the second precursor or the second subsequent precursor in step A) and C) via the one or more second precursor nozzles; and

moving the nozzle head over the surface of the substrate in relation to the substrate for subjecting the surface of the first precursor or the first subsequent precursor in the first precursor zone and to the second precursor or the second subsequent precursor in the second precursor zone.