Reduced sugar wafer

1. A sugar reduced wafer composition comprising:

60-80 wt. % of flour;

10-20 wt. % of sucrose;

0.5-8.0 wt. % of oil or fat; and

5-20 wt. % of non-digestible fiber selected from the group consisting of inulin, resistant dextrin, and a combination thereof, wherein a total amount of mono and disaccharides is 10-25 wt. %, all wt. % being in weight percentage of the sugar reduced wafer composition dry mass.

2. The sugar reduced wafer composition according to claim 1 comprising 0.2-3.0 wt. % emulsifier.

3. The sugar reduced wafer composition according to claim 1 comprising 0.5-6 wt. % whey or milk.

4. The sugar reduced wafer composition according to claim 1 comprising 0.5-3 wt. % oil or fat.

5. The sugar reduced wafer composition according to claim 4 , wherein the oil is selected from the group consisting of coconut oil, rapeseed oil, sunflower oil, soy oil, nut oil, and a combination, blend or fractions thereof.

6. The sugar reduced wafer composition according to claim 1 comprising 0.1-1.0 wt. % of sodium chloride.

7. The sugar reduced wafer composition according to claim 1 , wherein the sugar reduced wafer composition does not contain any polyols or high intensity sweeteners.

8. The sugar reduced wafer composition according to claim 1 , wherein the total amount of mono and disaccharides is 13-21 wt. %.

9. The sugar reduced wafer composition according to claim 1 , wherein a total amount of sucrose is 12-20 wt. %.

10. The sugar reduced wafer composition according to claim 1 comprising 35-45 wt. % water.

11. The sugar reduced wafer composition according to claim 1 , wherein the sugar reduced wafer composition has a viscosity between 2500 cps and 5000 cps.

12. A baked wafer comprising a sugar reduced wafer composition comprising 60-80 wt. % of flour, 10-20 wt. % of sucrose, 0.5-8.0 wt. % of oil or fat, and 5-20 wt. % of non-digestible fibers selected from the group consisting of inulin, resistant dextrin, and a combination thereof, wherein a total amount of mono and disaccharides is 10-25 wt. %, all wt. % being in weight percentage of the sugar reduced wafer composition dry mass, and the baked wafer having a water content after baking of 1.0-6.5 wt. % and a water content after storage of 2.5-6.0 wt. %.

13. A process for manufacturing a sugar reduced wafer, the process comprising:

providing a composition comprising 60-80 wt. % of flour, 10-20 wt. % of sucrose, 0.5-8.0 wt. % of oil or fat, and 5-20 wt. % of non-digestible fibers selected from the group consisting of inulin, resistant dextrin, and a combination thereof, wherein a total amount of mono and disaccharides is 10-25 wt. %, all wt. % being in weight percentage of the composition dry mass;

adding the composition into a baking plate or iron;

baking the composition in an oven at a temperature between 180° C. and 215° C. for 50 to 75 sec to obtain a baked wafer; and

shaping the baked wafer before the baked wafer becomes rigid.

14. The sugar reduced wafer composition according to claim 1 , wherein at least 60% in dry mass of the non-digestible fiber is non-digestible oligosaccharides.

15. The baked wafer according to claim 12 , wherein at least 60% in dry mass of the non-digestible fibers are non-digestible oligosaccharides.

16. The process according to claim 13 , wherein at least 60% in dry mass of the non-digestible fibers are non-digestible oligosaccharides.

17. The sugar reduced wafer composition according to claim 1 comprising 10-12 wt. % of the sucrose.

18. The baked wafer according to claim 12 comprising 10-12 wt. % of the sucrose.

19. The process according to claim 13 , wherein the composition comprises 10-12 wt. % of the sucrose.