Silicon carbide epitaxial substrate and method for manufacturing a silicon carbide semiconductor device
A silicon carbide epitaxial substrate includes a silicon carbide single-crystal substrate having a diameter of 100 mm or larger and including a principal surface inclined at an angle of more than 0 degrees and not less than 8 degrees with respect to a {0001} plane, a silicon carbide epitaxial layer formed on the principal surface and having a thickness of 20 μm or thicker, and a basal plane dislocation contained in the silicon carbide epitaxial layer and having one end coupled to a threading screw dislocation contained in the silicon carbide epitaxial layer and the other end present in a surface of the silicon carbide epitaxial layer. The basal plane dislocation extends in a direction having a slope of 20 degrees or more and 80 degrees or less with respect to a <11-20> direction in a {0001} basal plane. Density of the basal plane dislocation is 0.05/cm 2 or less.
1. A silicon carbide epitaxial substrate comprising:
a silicon carbide single-crystal substrate having a diameter of 100 mm or larger and including a principal surface inclined at an angle of more than 0 degrees and not less than 8 degrees with respect to a {0001} plane;
a silicon carbide epitaxial layer formed on the principal surface and having a thickness of 20 μm or thicker;
a first basal plane dislocation contained in the silicon carbide epitaxial layer and having one end coupled to a threading screw dislocation contained in the silicon carbide epitaxial layer and the other end present in a surface of the silicon carbide epitaxial layer, the first basal plane dislocation extending in a direction having a slope of 20 degrees or more and 80 degrees or less with respect to a <11-20> direction in a {0001} basal plane; and
a second basal plane dislocation extending in the <11-20> direction coupled to the other end of the first basal plane dislocation,
wherein density of the first basal plane dislocation is 0.05/cm 2 or less.
2. The silicon carbide epitaxial substrate as claimed in claim 1 , wherein a diameter of the silicon carbide single-crystal substrate is set at 150 mm or larger.
3. A method for manufacturing a silicon carbide semiconductor device, comprising:
a step of preparing a silicon carbide epitaxial substrate as claimed claim 1 , and
a step of processing a silicon carbide epitaxial substrate.