Deposition method
A method of selectively depositing a material on a substrate with a first and second surface, the first surface being different than the second surface. The depositing of the material on the substrate comprises: supplying a bulk precursor comprising metal atoms, halogen atoms and at least one additional atom not being a metal or halogen atom to the substrate; and supplying a reactant to the substrate. The bulk precursor and the reactant have a reaction with the first surface relative to the second surface to form more material on the first surface than on the second surface.
1. A method of selectively depositing a material on a substrate,
comprising:
providing a substrate with a first and second surface, the first surface being different than the second surface;
depositing the material on the substrate by:
supplying a bulk precursor comprising metal atoms, halogen atoms and at least one additional atom not being a metal or halogen atom; and
supplying a reactant to the substrate, whereby the bulk precursor and the reactant have a reaction with the first surface relative to the second surface to form more material on the first surface than on the second surface,
wherein the bulk precursor comprises molybdenum(VI)dichloride dioxide (MoO 2 Cl 2 ).
2. The method according to claim 1 , wherein the bulk precursor and the reactant have a reaction with the first surface relative to the second surface to form more than 2 times more material on the first surface than on the second surface.
3. The method according to claim 1 , wherein the bulk precursor comprises a transition metal atom.
4. The method according to claim 3 , wherein the transition metal atom is molybdenum.
5. The method according to claim 1 , wherein the halogen atom is chloride.
6. The method according to claim 1 , wherein the at least one additional atom is selected from the chalcogenides.
7. The method according to claim 6 , wherein the at least one additional atom selected from the chalcogenides is oxygen.
8. The method according to claim 1 , wherein the reactant comprises hydrogen atoms.
9. A method of selectively depositing a material on a substrate, comprising:
providing a substrate with a first and second surface, the first surface being different than the second surface;
depositing the material on the substrate by:
supplying a bulk precursor comprising metal atoms, halogen atoms and at least one additional atom not being a metal or halogen atom; and
supplying a reactant to the substrate, whereby the bulk precursor and the reactant have a reaction with the first surface relative to the second surface to form more material on the first surface than on the second surface,
wherein the bulk precursor and the reactant have a reaction with the first surface relative to the second surface to form more than 2 times more material on the first surface than on the second surface, and
wherein the reactant comprises hydrogen (H 2 ).
10. The method according to claim 1 , wherein the first surface comprises a metal.
11. The method according to claim 10 , wherein the metal comprises a transition metal.
12. A method of selectively depositing a material on a substrate, comprising:
providing a substrate with a first and second surface, the first surface being different than the second surface;
depositing the material on the substrate by:
supplying a bulk precursor comprising metal atoms, halogen atoms and at least one additional atom not being a metal or halogen atom; and
supplying a reactant to the substrate, whereby the bulk precursor and the reactant have a reaction with the first surface relative to the second surface to form more material on the first surface than on the second surface,
wherein the transition metal is selected form the group of titanium (Ti), tantalum (Ta), manganese (Mn), tungsten (W), Ruthenium (Ru), Cobalt (Co), and Copper (Cu).
13. A method of selectively depositing a material on a substrate, comprising:
providing a substrate with a first and second surface, the first surface being different than the second surface;
depositing the material on the substrate by:
supplying a bulk precursor comprising metal atoms, halogen atoms and at least one additional atom not being a metal or halogen atom; and
supplying a reactant to the substrate, whereby the bulk precursor and the reactant have a reaction with the first surface relative to the second surface to form more material on the first surface than on the second surface,
wherein the first surface comprises a transition metal nitride.
14. The method according to claim 1 , wherein the second surface comprises an oxide, nitride or combination thereof.
15. The method according to claim 1 , wherein the second surface comprises is selected from the group of AlO x , SiO x , SiN, HfO 2 , ZrO 2 and SiON.
16. The method according to claim 1 , wherein the second surface is a dielectric surface.
17. The method according to claim 1 , wherein the deposited material has an electrical resistivity of less than 3000 μΩ-cm.
18. The method according to claim 1 , wherein before supplying the bulk precursor the method comprises supplying a preparation precursor to the substrate.
19. The method according to claim 18 , wherein the preparation precursor comprises metal and halogen atoms.
20. The method according to claim 19 , wherein the preparation precursor comprise the same metal atom as the bulk precursor.
21. The method according to claim 19 , wherein the preparation precursor comprise the same halogen atoms as the bulk precursor.
22. The method according to claim 19 , wherein the preparation precursor works as an etchant.
23. A method of selectively depositing a material on a substrate, comprising:
providing a substrate with a first and second surface, the first surface being different than the second surface;
depositing the material on the substrate by:
supplying a bulk precursor comprising metal atoms, halogen atoms and at least one additional atom not being a metal or halogen atom; and
supplying a reactant to the substrate, whereby the bulk precursor and the reactant have a reaction with the first surface relative to the second surface to form more material on the first surface than on the second surface,
wherein before supplying the bulk precursor the method comprises supplying a preparation precursor to the substrate, and
wherein the preparation precursor comprises molybdenum pentachloride (MoCl 5 ).
24. The method according to claim 19 , wherein the metal is selected from the group of transition metals comprising tungsten (W), Ruthenium (Ru), Cobalt (Co), and Copper (Cu).
25. The method according to claim 1 , wherein the first surface comprises a metal, metal oxide, metal nitride or silicon nitride.