IP Library › Granted Patent US 10,720,467
Granted Patent B2
US 10,720,467 · App. 16/339,438 · Granted Jul 21, 2020

Optical sensor and signal readout method therefor, and solid-state image pickup device and signal readout method therefor

Inventors: Shigetoshi Sugawa (Miyagi, JP); Rihito Kuroda (Miyagi, JP); Shunichi Wakashima (Miyagi, JP)
Assignee: Tohoku University
H01L27/14643H01L29/7833H04N5/378H04N5/37455H04N5/37457
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Quick Facts
Patent No.
US 10,720,467
App. No.
16/339,438
Granted
Jul 21, 2020
Kind
B2
Abstract

One of the problems addressed by the present invention is to provide an optical sensor, a solid-state imaging device, and a signal readout method therefor that greatly contribute to a further development of industry and to the realization of a more secure and safe society. One of the solutions provided by the present invention is an optical sensor comprising a light reception element, a storage capacitor for storing charges, and a transfer switch for transferring, to the storage capacitor, a charge generated by light input into the light reception element. The storage capacitor includes a floating diffusion capacitor and a lateral overflow integration capacitor. The transfer switch is an LDD-MOS transistor of which a drain area has a specific impurity concentration.

Claims (96)

1. An optical sensor, comprising:

a light receiving element;

a storage capacitor configured to store a charge;

a transfer switch configured to transfer, to the storage capacitor, a charge generated by light input to the light receiving element; and

a pixel signal output line,

wherein the pixel signal output line has a signal readout path connected thereto,

wherein the storage capacitor includes a floating diffusion capacitor (C FD ) and a lateral overflow integration capacitor (C LOFIC ),

wherein the transfer switch includes an LDD-MOS transistor,

wherein a concentration (N D ) of semiconductor impurities in a drain region of the LDD-MOS transistor and a concentration (N) of semiconductor impurities in a diffusion region provided adjacent to the drain region satisfy the following relationships:

1 <N/N D ≤100  (1); and

0< N≤ 1.0×10 20 cm −3   (2),

wherein a first pixel output signal subjected to charge-to-voltage conversion by the floating diffusion capacitor (C FD ) and a second pixel output signal subjected to charge-to-voltage conversion by a combination of the floating diffusion capacitor (C FD ) and the lateral overflow integration capacitor (C LOFIC ) are input to the signal readout path, and

wherein the first pixel output signal is amplified by an amplification factor larger than 1 when the first pixel output signal is an ultra-high sensitive signal.

2. A multi-pixel optical sensor, comprising:

a row of plurality of two-dimensionally arranged pixel units, each including:

a light receiving element;

a storage capacitor configured to store a charge; and

a transfer switch configured to transfer, to the storage capacitor, a charge generated by light input to the light receiving element,

the storage capacitor including a floating diffusion capacitor (C FD ) and a lateral overflow integration capacitor (C LOFIC ),

the transfer switch including an LDD-MOS transistor,

a concentration (N D ) of semiconductor impurities in a drain region of the LDD-MOS transistor and a concentration (N) of semiconductor impurities in a diffusion region provided adjacent to the drain region satisfying the following relationships:

1 <N/N D ≤100  (1); and

0< N≤ 1.0×10 20 cm −3   (2),

a pixel signal output line, to which each of the plurality of two-dimensionally arranged pixel units is sequentially connected; and

a signal readout path unit configured to execute amplification by using an amplification factor larger than 1 and another amplification factor different from the amplification factor in a different manner, the signal readout path unit being connected to the pixel signal output line at a position downstream of a position at which a last pixel unit in the row of plurality of two-dimensionally arranged pixel units is connected to the pixel signal output line,

wherein a first pixel output signal subjected to charge-to-voltage conversion by the floating diffusion capacitor (C FD ) and a second pixel output signal subjected to charge-to-voltage conversion by a combination of the floating diffusion capacitor (C FD ) and the lateral overflow integration capacitor (C LOFIC ) are input to the signal readout path.

3. A signal readout method to be executed by an optical sensor, the optical sensor including, for each pixel unit:

a light receiving element;

a storage capacitor configured to store a charge; and

a transfer switch configured to transfer, to the storage capacitor, a charge generated by light input to the light receiving element,

the storage capacitor including a floating diffusion capacitor and a lateral overflow integration capacitor,

the transfer switch including an LDD-MOS transistor,

a concentration (N D ) of semiconductor impurities in a drain region of the LDD-MOS transistor and a concentration (N) of semiconductor impurities in a diffusion region provided adjacent to the drain region satisfying the following relationships:

1 <N/N D ≤100  (1); and

0< N≤ 1.0×10 20 cm −3   (2),

the optical sensor further including:

a pixel signal output line, to which each pixel unit is connected; and

a signal readout path connected to the pixel signal output line,

the signal readout method comprising:

subjecting, by the floating diffusion capacitor, an amount of charges that contribute to readout to charge-to-voltage conversion so as to form a first pixel output signal;

subjecting, by a combination of the floating diffusion capacitor and the lateral overflow integration capacitor, the amount of charges that contribute to readout to charge-to-voltage conversion so as to form a second pixel output signal;

inputting the first pixel output signal and the second pixel output signal to the signal readout path; and

amplifying the first pixel output signal in the signal readout path by a plurality of amplifiers including at least one amplifier having an amplification factor larger than 1.

4. An image pickup device, comprising:

a plurality of pixel units each including:

a light receiving element (PD);

a switch for transfer (T);

a switch for overflow (S);

a switch for resetting (R);

the light receiving element (PD), the switch for transfer (T), the switch for overflow (S), and the switch for resetting (R) are connected in series in the stated order,

a floating diffusion capacitor (C FD ) and a source-follower switch (SF), which are connected to a line between the switch for transfer (T) and the switch for overflow ( 5 ); and

a lateral overflow integration capacitor (C LOFIC ), which is connected to a line between the switch for overflow (S) and the switch for resetting (R),

the source-follower switch (SF) including a MOS transistor,

a concentration (N D ) of semiconductor impurities in a drain region in the switch for transfer (T) and a concentration (N) of semiconductor impurities in a diffusion region provided adjacent to the drain region satisfying the following relationships:

1 <N/N D ≤100  (1); and

0< N≤ 1.0×10 20 cm −3   (2),

the light receiving elements (PD) of the plurality of pixel units forming an array of two-dimensionally arranged pixels;

a pixel row output signal line, to which the plurality of pixel units are sequentially connected; and

a reading unit connected to the pixel row output signal line,

wherein a first pixel output signal subjected to charge-to-voltage conversion by the floating diffusion capacitor (C FD ) and a second pixel output signal subjected to charge-to-voltage conversion by a combination of the floating diffusion capacitor (C FD ) and the lateral overflow integration capacitor (C LOFIC ) are input to the reading unit, and

wherein the first pixel output signal is amplified in a signal readout path by a plurality of amplifiers including at least one amplifier having an amplification factor larger than 1.

5. A signal readout method for an image pickup device, the signal readout method comprising:

preparing an image pickup device including:

a plurality of pixel units each including:

a light receiving element (PD);

a switch for transfer (T);

a switch for overflow (S);

a switch for resetting (R);

the light receiving element (PD), the switch for transfer (T), the switch for overflow (S), and the switch for resetting (R) are connected in series in the stated order,

a floating diffusion capacitor (C FD ) and a source-follower switch (SF), which are connected to a line between the switch for transfer (T) and the switch for overflow (S); and

a lateral overflow integration capacitor (C LOFIC ), which is connected to a line between the switch for overflow (S) and the switch for resetting (R),

the source-follower switch (SF) including a MOS transistor,

a concentration (N D ) of semiconductor impurities in a drain region in the switch for transfer (T) and a concentration (N) of semiconductor impurities in a diffusion region provided adjacent to the drain region satisfying the following relationships:

1 <N/N D ≤100  (1); and

0< N≤ 1.0×10 20 cm −3   (2),

the light receiving elements (PD) of the plurality of pixel units forming an array of two-dimensionally arranged pixels;

a pixel row output signal line, to which the plurality of pixel units are sequentially connected; and

a reading unit connected to the pixel row output signal line;

subjecting, by the floating diffusion capacitor (C FD ), an amount of charges that contribute to readout to charge-to-voltage conversion so as to form a first pixel output signal;

subjecting, by a combination of the floating diffusion capacitor (C FD ) and the lateral overflow integration capacitor (C LOFIC ), the amount of charges that contribute to readout to charge-to-voltage conversion so as to form a second pixel output signal;

inputting the first pixel output signal and the second pixel output signal to a signal readout path; and

amplifying the first pixel output signal in the signal readout path by a plurality of amplifiers including at least one amplifier having an amplification factor larger than 1.

6. An optical sensor, comprising:

(1) a pixel unit having a photoelectric conversion function,

the pixel unit including:

a storage capacitor configured to store a charge subjected to photoelectric conversion; and

a transfer switch configured to transfer the charge to the storage capacitor;

the storage capacitor including a floating diffusion capacitor (C FD ) and a lateral overflow integration capacitor (C LOFIC ),

the transfer switch including an LDD-MOS transistor,

a concentration (N D ) of semiconductor impurities in a drain region of the LDD-MOS transistor and a concentration (N) of semiconductor impurities in a diffusion region provided adjacent to the drain region satisfying the following relationships:

1 <N/N D ≤100  (1); and

0< N≤ 1.0×10 20 cm −3   (2),

(2) a pixel signal output line connected to the pixel unit; and

(3) a signal readout path connected to the pixel signal output line,

wherein a first pixel output signal subjected to charge-to-voltage conversion by the floating diffusion capacitor (C FD ) and a second pixel output signal subjected to charge-to-voltage conversion by a combination of the floating diffusion capacitor (C FD ) and the lateral overflow integration capacitor (C LOFIC ) are input to the signal readout path, and

wherein the first pixel output signal is amplified by an amplification factor larger than 1 when the first pixel output signal is an ultra-high sensitive signal.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 4, 2019
From: SUGAWA, SHIGETOSHI; KURODA, RIHITO; WAKASHIMA, SHUNICHI
To: TOHOKU UNIVERSITY
Reel/Frame 048794/0876 →
Continuity (1)
Related Publication 20200043971A1 · Feb 6, 2020
Cited By (3)
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