Transistor and semiconductor device
A transistor with small parasitic capacitance can be provided. A transistor with high frequency characteristics can be provided. A semiconductor device including the transistor can be provided. Provided is a transistor including an oxide semiconductor, a first conductor, a second conductor, a third conductor, a first insulator, and a second insulator. The first conductor has a first region where the first conductor overlaps with the oxide semiconductor with the first insulator positioned therebetween; a second region where the first conductor overlaps with the second conductor with the first and second insulators positioned therebetween; and a third region where the first conductor overlaps with the third conductor with the first and second insulators positioned therebetween. The oxide semiconductor including a fourth region where the oxide semiconductor is in contact with the second conductor; and a fifth region where the oxide semiconductor is in contact with the third conductor.
1. A semiconductor device comprising:
a first insulating layer;
a first oxide semiconductor layer over the first insulating layer;
a second oxide semiconductor layer over the first oxide semiconductor layer;
a source electrode and a drain electrode in contact with the second oxide semiconductor layer;
a second insulating layer covering the source electrode and the drain electrode, the second insulating layer having an opening over the second oxide semiconductor layer;
a third oxide semiconductor layer provided in the opening of the second insulating layer;
a gate insulating layer covering the third oxide semiconductor layer; and
a gate electrode provided in the opening of the second insulating layer with the third oxide semiconductor layer and the gate insulating layer provided therebetween,
wherein in a section of a channel width direction, a bottom surface of the gate electrode has a region which does not overlap with the first oxide semiconductor layer and the second oxide semiconductor layer, and
wherein the region of the bottom surface of the gate electrode is located below a bottom surface of the first oxide semiconductor layer.
2. The semiconductor device according to claim 1 , wherein the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer overlap with a protruding portion of the first insulating layer.
3. The semiconductor device according to claim 1 , wherein each of the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer comprises In-M-Zn oxide.
4. The semiconductor device according to claim 3 , wherein M is selected from the group consisting of aluminum, gallium, yttrium, and tin.
5. A semiconductor device comprising:
a first insulating layer;
a first oxide semiconductor layer over the first insulating layer;
a second oxide semiconductor layer over the first oxide semiconductor layer;
a source electrode and a drain electrode in contact with the second oxide semiconductor layer;
a second insulating layer covering the source electrode and the drain electrode, the second insulating layer having an opening reaching the second oxide semiconductor layer;
a gate insulating layer provided in the opening of the second oxide semiconductor layer; and
a gate electrode provided in the opening in the second insulating layer with the gate insulating layer provided therebetween,
wherein in a section of a channel width direction, a bottom surface of the gate electrode has a region which does not overlap with the first oxide semiconductor layer and the second oxide semiconductor layer, and
wherein the region of the bottom surface of the gate electrode is located below a bottom surface of the first oxide semiconductor layer.
6. The semiconductor device according to claim 5 , wherein the first oxide semiconductor layer and the second oxide semiconductor layer overlap with a protruding portion of the first insulating layer.
7. The semiconductor device according to claim 5 , wherein each of the first oxide semiconductor layer and the second oxide semiconductor layer comprises In-M-Zn oxide.
8. The semiconductor device according to claim 7 , wherein M is selected from the group consisting of aluminum, gallium, yttrium, and tin.
9. A semiconductor device comprising:
a first insulating layer;
a first oxide semiconductor layer over the first insulating layer;
a source electrode and a drain electrode in contact with the first oxide semiconductor layer;
a second insulating layer covering the source electrode and the drain electrode, the second insulating layer having an opening;
a gate insulating layer provided in the opening of the second insulating layer; and
a gate electrode provided in the opening of the second insulating layer with the gate insulating layer provided therebetween,
wherein in a section of a channel width direction, a bottom surface of the gate electrode has a region which does not overlap with the first oxide semiconductor layer, and
wherein the region of the bottom surface of the gate electrode is located below a bottom surface of the first oxide semiconductor layer.
10. The semiconductor device according to claim 9 , wherein the first oxide semiconductor layer overlaps with a protruding portion of the first insulating layer.
11. The semiconductor device according to claim 9 , wherein the first oxide semiconductor layer comprises In-M-Zn oxide.
12. The semiconductor device according to claim 11 , wherein M is selected from the group consisting of aluminum, gallium, yttrium, and tin.