Solid-state imaging device and imaging apparatus
The present technique relates to a solid-state imaging device and an imaging apparatus that enable provision of a solid-state imaging device having superior color separation and high sensitivity. The solid-state imaging device includes a semiconductor layer in which a surface side becomes a circuit formation surface, photoelectric conversion units PD 1 and PD 2 of two layers or more that are stacked and formed in the semiconductor layer, and a longitudinal transistor Tr 1 in which a gate electrode is formed to be embedded in the semiconductor layer from a surface of the semiconductor layer. The photoelectric conversion unit PD 1 of one layer in the photoelectric conversion units of the two layers or more is formed over a portion of the gate electrode of the longitudinal transistor Tr 1 embedded in the semiconductor substrate and is connected to a channel formed by the longitudinal transistor Tr 1.
1. An imaging device comprising:
a first photoelectric conversion region disposed in a semiconductor substrate;
a first gate of a first transistor, a part of the first gate of the first transistor being disposed in the semiconductor substrate, wherein the part of the first gate of the first transistor comprises a first end at a first surface of the semiconductor substrate; and
a second gate of a second transistor, a part of the second gate of the second transistor being disposed in the semiconductor substrate, wherein the part of the second gate of the second transistor comprises a second end at the first surface of the semiconductor substrate,
wherein a first part of the first photoelectric conversion region is disposed between the part of the first gate of the first transistor and a second surface of the semiconductor substrate, the second surface of the semiconductor substrate being opposite the first surface of the semiconductor substrate, and
wherein the part of the first gate of the first transistor comprises a third end in the semiconductor substrate, the part of the second gate of the second transistor comprises a fourth end in the semiconductor substrate, and the third end of the part of the first gate of the first transistor and the fourth end of the part of the second gate of the second transistor are disposed at the same depth of the semiconductor substrate.
2. The imaging device according to claim 1 , wherein a second part of the first photoelectric conversion region is disposed between the part of the first gate of the first transistor and the part of the second gate of the second transistor in a plan view.
3. The imaging device according to claim 1 , wherein the second surface of the semiconductor substrate is a light incident side of the semiconductor substrate.
4. The imaging device according to claim 1 , wherein a first pixel comprises the first photoelectric conversion region, the first gate of the first transistor, and the second gate of the second transistor.
5. The imaging device according to claim 1 , wherein the part of the second gate of the second transistor is disposed adjacent to the first photoelectric conversion region.
6. The imaging device according to claim 1 , wherein any part of the first photoelectric conversion region is not disposed between the part of the second gate of the second transistor and the second surface of the semiconductor substrate.
7. The imaging device according to claim 1 , wherein the first transistor is a transfer transistor.
8. The imaging device according to claim 1 , wherein the second transistor is a transfer transistor.
9. An imaging device comprising:
a first photoelectric conversion region disposed in a semiconductor substrate;
a first gate of a first transistor, a part of the first gate of the first transistor being disposed in the semiconductor substrate, wherein the part of the first gate of the first transistor comprises a first end at a first surface of the semiconductor substrate; and
a second gate of a second transistor, a part of the second gate of the second transistor being disposed in the semiconductor substrate, wherein the part of the second gate of the second transistor comprises a second end at the first surface of the semiconductor substrate,
wherein a first part of the first photoelectric conversion region is disposed between the part of the first gate of the first transistor and a second surface of the semiconductor substrate, the second surface of the semiconductor substrate being opposite the first surface of the semiconductor substrate, and wherein the part of the first gate of the first transistor comprises a third end in the semiconductor substrate and wherein the third end is in contact with the first photoelectric conversion region.
10. The imaging device according to claim 1 , wherein a charge generated in the first photoelectric conversion region is configured to be read by the first gate of the first transistor.
11. The imaging device according to claim 1 , further comprising a first floating diffusion disposed at the first surface of the semiconductor substrate and disposed adjacent to the first end of the part of the first gate of the first transistor, wherein a charge generated in the first photoelectric conversion region is configured to be transferred to the first floating diffusion using the first gate of the first transistor.
12. The imaging device according to claim 1 , further comprising a read circuit, wherein the first surface of the semiconductor substrate is disposed between the read circuit and the second surface of the semiconductor substrate.
13. The imaging device according to claim 1 , wherein the first photoelectric conversion region is configured to be sensitive to blue light.
14. The imaging device according to claim 1 , further comprising a light shielding film, wherein the second surface of the semiconductor substrate is disposed between the light shielding film and the first surface of the semiconductor substrate.
15. The imaging device according to claim 1 , further comprising a second photoelectric conversion region disposed in the semiconductor substrate, the second photoelectric conversion region being disposed between the first photoelectric conversion region and the first surface of the semiconductor substrate.
16. The imaging device according to claim 15 , wherein the second photoelectric conversion region is disposed adjacent to the part of the first gate of the first transistor.
17. The imaging device according to claim 15 , wherein the second photoelectric conversion region is configured to be sensitive to red light.
18. The imaging device according to claim 15 , further comprising a third gate of a third transistor disposed on the first surface of the semiconductor substrate, wherein a charge generated in the second photoelectric conversion region is configured to be read by the third gate of the third transistor.
19. An electronic apparatus comprising:
an optical system;
a signal processing circuit; and
an imaging device comprising:
a first photoelectric conversion region disposed in a semiconductor substrate;
a first gate of a first transistor, a part of the first gate of the first transistor being disposed in the semiconductor substrate, wherein the part of the first gate of the first transistor comprises a first end at a first surface of the semiconductor substrate; and
a second gate of a second transistor, a part of the second gate of the second transistor being disposed in the semiconductor substrate, wherein the part of the second gate of the second transistor comprises a second end at the first surface of the semiconductor substrate,
wherein a first part of the first photoelectric conversion region is disposed between the part of the first gate of the first transistor and a second surface of the semiconductor substrate, the second surface of the semiconductor substrate being opposite the first surface of the semiconductor substrate, and
wherein the part of the first gate of the first transistor comprises a third end in the semiconductor substrate, the part of the second gate of the second transistor comprises a fourth end in the semiconductor substrate, and the third end of the part of the first gate of the first transistor and the fourth end of the part of the second gate of the second transistor are disposed at the same depth of the semiconductor substrate.