Semiconductor wafer handling and transport

1. A substrate processing system comprising:

at least two vertically stacked transport tunnels, each of the at least two vertically stacked transport tunnels having a first end and a second end and being separate and distinct from another of the at least two vertically stacked transport tunnels and each of the at least two vertically stacked transport tunnels including a plurality of openings arranged to form vertical stacks of openings configured for coupling to vertically stacked process modules, at least one of the at least two vertically stacked transport tunnels includes at least one transport chamber module arranged for coupling to at least one transport tunnel module to form the at least one of the at least two vertically stacked transport tunnels and another of the at least two stacked transport tunnels including at least another transport chamber module arranged for coupling to another at least one transport tunnel module to form the other of the at least two vertically stacked transport tunnels separate and distinct from the at least one of the at least two vertically stacked transport tunnels;

the at least two vertically stacked transport tunnels including a return system separate and distinct from another of the at least two vertically stacked transport tunnels;

at least one indexing load lock communicably coupling the at least two vertically stacked transport tunnels to each other, and including an elevator configured to transfer workpieces between each of the at least two vertically stacked transport tunnels and the return system.

2. The substrate processing system of claim 1 , further comprising an articulated transport robot arm disposed in each of the at least one of the at least two vertically stacked transport tunnels and the other of the at least two vertically stacked transport tunnels, where a joint of the articulated transport robot arm is locationally fixed along a tunnel path formed by the respective at least one of the at least two vertically stacked transport tunnels and the other of the at least two vertically stacked transport tunnels.

3. The substrate processing system of claim 2 , wherein the transport robot includes a two degree of freedom drive with Z axis movement.

4. The substrate processing system of claim 1 , wherein the at least one indexing load lock is disposed between adjacent transport chamber modules of the at least one of the vertically stacked transport tunnels.

5. The substrate processing system of claim 1 , wherein each of the transport chamber modules are sealable chambers.

6. The substrate processing system of claim 1 , wherein the at least one indexing load lock is coupled to each of the at least two vertically stacked transport tunnels so as to form a buffer station disposed between at least two of the transport chamber modules.

7. The substrate processing system of claim 1 , wherein transport robots of each of the at least two vertically stacked transport chambers include dual level transport robots that form vertically stacked substrate transfer planes within a respective one of the at least two vertically stacked transport tunnels.

8. The substrate processing system of claim 7 , wherein the vertically stacked substrate transfer planes allow for bidirectional substrate travel in each of the at least two vertically stacked transport tunnels.

9. The substrate processing system of claim 7 , wherein one of the vertically stacked substrate transfer planes is a return lane configured for substantially unobstructed transport of substrates.

10. The substrate processing system of claim 1 , wherein each of the at least two vertically stacked transport tunnels includes lateral sides, wherein the plurality of openings are disposed on but a single lateral side of a respective one of the at least two vertically stacked transport tunnels.

11. The substrate processing system of claim 1 , wherein each of the at least two vertically stacked transport tunnels includes lateral sides, wherein the plurality of openings are disposed on opposite lateral sides of a respective one of the at least two vertically stacked transport tunnels.

12. The substrate processing system of claim 1 , wherein one of the at least two vertically stacked transport tunnels provides substrate transport in a first direction and the other of the at least two vertically stacked transport tunnels provides substrate transport in a substantially opposite direction.

13. A substrate processing system comprising:

at least two vertically stacked transport tunnels, each of the at least two vertically stacked transport tunnels being separate and distinct from another of the at least two vertically stacked transport tunnels and including a plurality of openings arranged to form vertical stacks of side wall openings configured for coupling to vertically stacked process modules, at least one of the vertically stacked transport tunnels includes at least one transport chamber module arranged for coupling to another transport chamber module to form the at least one of the vertically stacked transport tunnels and another of the at least two stacked transport tunnels including at least one transport chamber module arranged for coupling to another transport chamber module to form the other of the at least two vertically stacked transport tunnels separate and distinct from the at least one vertically stacked transport tunnel; and

at least one load lock connecting the at least two vertically stacked transport tunnels so that the at least one load lock communicably couples to a common loading station, where the common loading station includes a substrate elevator for transferring substrates between elevations of each of the at least two vertically stacked transport tunnels.

14. The substrate processing system of claim 13 , further comprising a transport robot disposed in each of the transport chamber modules, where a joint of the transport robot is locationally fixed along a tunnel path formed by the respective vertically stacked transport tunnels.

15. The substrate processing system of claim 13 , wherein each of the vertically stacked transport tunnels includes a buffer station disposed between at least two of the transport chamber modules.

16. The substrate processing system of claim 15 , wherein the buffer station includes a substrate elevator configured to transfer substrates between each of the vertically stacked transport tunnels.

17. The substrate processing system of claim 13 , wherein transport robots of each of the at least two vertically stacked transport tunnels include dual level transport robots that form vertically stacked substrate transfer planes within a respective one of the at least two vertically stacked transport tunnels.

18. The substrate processing system of claim 17 , wherein the vertically stacked substrate transfer planes allow for bidirectional substrate travel at different elevations respective to each of the at least two vertically stacked transport tunnels.

19. The substrate processing system of claim 17 , wherein one of the vertically stacked substrate transfer planes is a return lane configured for substantially unobstructed transport of substrates.

20. The substrate processing system of claim 13 , wherein each of the at least two vertically stacked transport tunnels includes lateral sides, wherein the plurality of openings are disposed on but a single lateral side of a respective one of the at least two vertically stacked transport tunnels.

21. The substrate processing system of claim 13 , wherein each of the at least two vertically stacked transport tunnels includes lateral sides, wherein the plurality of openings are disposed on opposite lateral sides of a respective one of the at least two vertically stacked transport tunnels.

22. The substrate processing system of claim 13 , wherein one of the at least two vertically stacked transport tunnels provides substrate transport in a first direction and the other of the at least two vertically stacked transport tunnels provides substrate transport in a substantially opposite direction.