IP Library Granted Patent US 10,983,883
Granted Patent B2
US 10,983,883 · App. 16/367,058 · Granted Apr 20, 2021

Error recovery in magnetic random access memory after reflow soldering

Inventors: Michail Tzoufras (Fremont, CA); Marcin Gajek (Fremont, CA)
Assignee: SPIN MEMORY, INC.
G06F11/2069G06F11/1612G11C11/14G11C11/15G11C11/16G11C11/1673G11C11/1675G11C11/1677G11C27/022G11C2211/00G11C2211/56
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Quick Facts
Patent No.
US 10,983,883
App. No.
16/367,058
Granted
Apr 20, 2021
Kind
B2
Abstract

A method is performed at an electronic device that includes magnetic random access memory (MRAM). The method includes loading the MRAM with data including main data, first error correcting data, and second error correcting data. The MRAM comprises a plurality of MRAM cells characterized by a first magnetic anisotropy corresponding to a first error rate at a predefined temperature that exceeds a threshold for correcting errors using only the first error correcting data. The method further includes, after loading the MRAM with the data, heating the MRAM to the predefined temperature and correcting errors in the main data using both the first error correcting data and the second error correcting data. The method further includes after correcting the errors in the main data, erasing, from the MRAM, the second error correcting data and maintaining, on the MRAM, the first error correcting data.

Claims (34)

1. A method of manufacturing an electronic device that includes magnetic random access memory (MRAM), comprising:

loading the MRAM with data including main data, first error correcting data, and second error correcting data, wherein:

the MRAM comprises a plurality of MRAM cells characterized by a first magnetic anisotropy corresponding to a first error rate at a predefined temperature; and

the first error rate exceeds a threshold for correcting errors using only the first error correcting data;

after loading the MRAM with the data:

heating the MRAM to the predefined temperature;

correcting errors in the main data using both the first error correcting data and the second error correcting data;

after correcting the errors in the main data:

erasing, from the MRAM, the second error correcting data; and

maintaining, on the MRAM, the first error correcting data.

2. The method of claim 1 , further including:

after erasing, from the MRAM, the second error correcting data, operating the electronic device;

while operating the electronic device, detecting an error in the main data; and

correcting the error in the main data using the first error correcting data.

3. The method of claim 1 , wherein the MRAM is heated to the predefined temperature during a reflow soldering process.

4. The method of claim 1 , wherein the main data comprises firmware for the device.

5. The method of claim 1 , wherein:

the main data is redundantly-encoded in the first error correcting data and the second error correcting data; and

correcting errors in the main data using both the first error correcting data and the second error correcting data includes majority voting.

6. The method of claim 1 , wherein:

at least one of the first error correcting data and the second error correcting data comprise error correcting code data; and

correcting errors in the main data using both the first error correcting data and the second error correcting data includes using one of a Hamming code and a Bose-Chaudhuri-Hocquenghem (BCH) code.

7. The method of claim 1 , further including:

predicting the first error rate based on the predefined temperature; and

allocating an amount of second error correcting data based on the predicted first error rate.

8. The method of claim 1 , wherein each of the plurality of the MRAM cells comprises:

a magnetic storage layer; and

a magnetic reference layer;

wherein a datum is encoded in a relative alignment of a magnetization of the magnetic storage layer and the magnetic reference layer.

9. The method of claim 8 , wherein each of the plurality of the MRAM cells comprises a current-induced magnetic switching device.

10. The method of claim 8 , wherein the first error rate corresponds to a thermal stability of the relative alignment of the magnetization of the magnetic storage layer and the magnetic reference layer.

11. The method of claim 10 , wherein the thermal stability is proportional to the first magnetic anisotropy.

12. The method of claim 11 , wherein the first magnetic anisotropy is a perpendicular magnetic anisotropy.

13. The method of claim 10 , wherein the thermal stability is proportional to a size of the MRAM cell.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2021
From: SPIN (ASSIGNMENT FOR BENEFIT OF CREDITORS), LLC
To: INTEGRATED SILICON SOLUTION, (CAYMAN) INC.
Reel/Frame 057473/0319 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2021
From: SPIN MEMORY, INC.
To: SPIN (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 056927/0038 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2019
From: TZOUFRAS, MICHAIL; GAJEK, MARCIN
To: SPIN MEMORY, INC.
Reel/Frame 048726/0602 →
Continuity (1)
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