Metrology method and apparatus, computer program and lithographic system
Disclosed is a method of mitigating for a process dependent stray light artifact on a measurement a structure. The method comprises obtaining a calibration scaling factor for the process dependent stray light artifact based on a reference angle resolved measurement and target angle resolved measurement, and a correction of an image with the obtained calibration scaling factor.
1. A method of mitigating for a process dependent stray light artifact on a measurement of a structure, the method comprising:
obtaining a calibration scaling factor for the process dependent stray light artifact based on a reference angle resolved measurement and target angle resolved measurement,
wherein the reference angle resolved measurement is obtained from a reference substrate and the target angle resolved measurement is obtained from a target.
2. The method of claim 1 , wherein the calibration scaling factor is determined from a ratio of the reference angle resolved measurement and target angle resolved measurement.
3. The method of claim 2 , wherein the calibration scaling factor is determined as the ratio of the reference angle resolved measurement and target angle resolved measurement for each pixel of the process dependent stray light artifact.
4. The method of claim 1 , wherein the reference angle resolved measurement comprises at least the zeroth order and the target angle resolved measurement comprises at least the zeroth order.
5. The method of claim 4 , wherein the reference angle resolved measurement is obtained from a zeroth order angle resolved spectrum obtained from measurement of the reference substrate and the target angle resolved measurement is obtained from a zeroth order angle resolved spectrum obtained from measurement of the target.
6. The method of claim 1 , comprising:
obtaining a reference artifact image of the process dependent stray light artifact using the reference substrate; and
applying the calibration scaling factor to the reference artifact image to obtain a modeled artifact image.
7. The method according to claim 6 , comprising subtracting the modeled artifact image from a corresponding stray light artifact detected in one or more subsequent measurements.
8. The method of claim 6 , wherein the measurement of the structure comprises detecting an image of the structure at an image plane, the image comprising the process dependent stray light artifact.
9. The method of claim 8 , comprising a pattern recognition step to identify all process dependent stray light artifacts in the reference artifact image.
10. The method of claim 8 , wherein an illumination mode used during the reference angle resolved measurement and target angle resolved measurement separates the zeroth order from higher diffraction orders in the image plane.
11. The method of claim 8 , wherein the modeled artifact image is further scaled by the ratio of an energy level corresponding to the reference artifact image and an energy level corresponding to a measurement for which the process dependent stray light artifact is being mitigated.
12. The method of claim 6 , wherein the measurement of the structure comprises detecting an angularly resolved image of the structure at a pupil plane, the angularly resolved image comprising the process dependent stray light artifact.
13. The method of claim 12 , wherein the reference angle resolved measurement and target angle resolved measurement are each performed using an illumination mode for which the area within the pupil plane comprising the artifact being mitigated for is blocked.
14. The method of claim 12 , wherein the reference artifact image of the process dependent stray light artifact is obtained using an illumination mode applicable to a parameter of interest being determined.
15. The method of claim 1 , wherein the measurement of the structure comprises detecting an image of the structure at an image plane separate from a pupil plane, the image comprising the process dependent stray light artifact.
16. The method of claim 1 , comprising determining a parameter of interest from the measurement of the structure.
17. The method of claim 16 , wherein the parameter of interest is focus or overlay.
18. An inspection apparatus for measuring a parameter of interest of a lithographic process, the inspection apparatus being operable to perform the method of claim 1 .
19. A non-transitory computer program product comprising machine-readable instructions for causing a processor to cause performance of an operation for mitigating for a process dependent stray light artifact on a measurement of a structure, the operations comprising:
obtaining a calibration scaling factor for the process dependent stray light artifact based on a reference angle resolved measurement and target angle resolved measurement,
wherein the reference angle resolved measurement is obtained from a reference substrate and the target angle resolved measurement is obtained from a target.
20. A system comprising:
an inspection apparatus configured to provide a beam of measurement radiation on a target on a substrate and to detect radiation scattered by the target to determine a parameter of interest of a patterning process; and
the non-transitory computer program product of claim 19 .