PCB laminated structure and mobile terminal having the same
The present disclosure relates to a PCB laminated structure, including a first substrate; a second substrate disposed to overlap with the first substrate on the top and bottom; and an interposer assembly provided between the first substrate and the second substrate to allow electromagnetic connection between the first and second substrates, wherein the interposer assembly includes a housing configured to form a closed region along a top surface circumference of the first substrate and a bottom surface circumference of the second substrate to support the first and second substrates; a signal via connected to the first and second substrates, respectively, to transmit electromagnetic signals between the first substrate and the second substrate; and a ground via connected to the housing to serve as a ground, and spaced a set distance from the signal via at one side of the signal via.
1. A printed circuit board (PCB) laminated structure, comprising:
a first substrate;
a second substrate disposed to overlap with the first substrate; and
an interposer assembly disposed between the first substrate and the second substrate and configured to allow signal communication between the first and second substrates,
wherein the interposer assembly comprises:
a housing configured to form a closed region between a top surface of the first substrate and a bottom surface of the second substrate;
a signal via electrically coupling the first substrate and the second substrate and configured to transmit signals between the first substrate and the second substrate; and
a ground via electrically coupled to the housing and configured to serve as a ground, wherein the ground via is positioned apart from the signal via by a predetermined distance, and
a metal coating layer disposed at side surfaces of the housing and configured to shield signals,
wherein a sidewall portion forms an outer surface of the interposer assembly, and
wherein the metal coating layer is formed on an outer side surface of the sidewall portion and an inner side surface of the sidewall portion.
2. The PCB laminated structure of claim 1 , further comprising a plurality of signal vias and a plurality of ground vias which are arranged at predetermined intervals along a circumference of the closed region.
3. The PCB laminated structure of claim 1 , wherein the metal coating layer is selectively disposed along the side surface of the housing to be adjacent to signal emission devices mounted on the first and second substrates such that portions of the side surface of the housing are exposed between gaps of the selectively disposed metal coating layer.
4. The PCB laminated structure of claim 2 , wherein two or more signal vias are consecutively arranged with ground vias on both sides of the two or more signal vias.
5. The PCB laminated structure of claim 2 , wherein signal vias are arranged on both sides of each ground via.
6. The PCB laminated structure of claim 1 , wherein the signal via comprises:
a signal via hole configured to transmit signals therethrough; and
a signal via pad portion coupled to portions surrounding both ends of the signal via hole.
7. The PCB laminated structure of claim 6 , wherein a central portion of the signal via hole overlaps with a center of the signal via pad portion.
8. The PCB laminated structure of claim 1 , wherein the ground via comprises ground via pad portions at both ends of the ground via and configured to contact the housing.
9. The PCB laminated structure of claim 1 , wherein the housing comprises:
support portions coupled to the top surface of the first substrate and the bottom surface of the second substrate; and
one or more sidewall portions connecting the support portions.
10. The PCB laminated structure of claim 2 , wherein the ground vias adjacent to the metal coating layer are spaced apart such that a distance between the centers of each ground via is 0.6 mm or less.
11. The PCB laminated structure of claim 5 , wherein groupings of two consecutive signal vias are arranged with a ground via interposed between each grouping, and wherein each grouping of signal vias is configured to have a phase difference of 180 degrees between electromagnetic signals transmitted by each signal via of the grouping.