Electronic device comprising interposer surrounding circuit elements disposed on printed circuit board
An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.
1. An electronic device comprising:
a housing;
a first printed circuit board (PCB) and a second PCB disposed in the housing; and
an interposer disposed between the first PCB and the second PCB to define an interior space therebetween, at least one electronic component on the first PCB and at least one electronic component on the second PCB being disposed in the interior space,
wherein the interposer includes a first side wall having a first conductive surface and a first non-conductive surface and a second side wall having a second conductive surface and a second non-conductive surface,
wherein the first non-conductive surface faces at least a portion of the second conductive surface, and
wherein the second non-conductive surface faces at least a portion of the first conductive surface.
2. An electronic device comprising:
a first printed circuit board (PCB) and a second PCB; and
an interposer disposed between the first PCB and the second PCB, wherein the first PCB, the second PCB, and the interposer form a space,
wherein at least a portion of the interposer is connected to the first PCB and at least another portion of the interposer is connected to the second PCB,
wherein the interposer includes a first side wall having an inner surface towards the space and an outer surface,
wherein the inner surface includes a first conductive surface and a first non-conductive surface and the outer surface includes a second conductive surface and a second non-conductive surface, and
wherein at least portion of an inner surface of the second non-conductive surface of the first side wall includes a conductive surface.
3. The electronic device of claim 2 , wherein at least portion of an inner surface of the second conductive surface includes a non-conductive surface.
4. The electronic device of claim 2 , wherein at least portion of an outer surface of the first non-conductive surface includes a conductive surface.
5. The electronic device of claim 2 , wherein at least portion of an outer surface of the first conductive surface includes a non-conductive surface.
6. The electronic device of claim 2 , further comprising at least one electronic component disposed on at least one of a first surface of the first PCB or a second surface of the second PCB, wherein the first surface of the first PCB and the second surface of the second PCB face each other.
7. The electronic device of claim 6 , wherein the at least one electronic component is disposed in the space.
8. The electronic device of claim 2 , wherein the interposer includes a plurality of conductive vias comprising:
a first conductive via electrically connected to at least one of a ground of the first PCB or a ground of the second PCB; and
a second conductive via electrically connected to at least one of the ground of the first PCB or the ground of the second PCB.
9. The electronic device of claim 8 , wherein the first conductive via is electrically connected to the first conductive surface.
10. The electronic device of claim 8 , wherein the second conductive via is electrically connected to the second conductive surface.
11. The electronic device of claim 2 , wherein the interposer includes a conductive via electrically connecting a signal line of the first PCB and a signal line of the second PCB.
12. The electronic device of claim 2 , wherein the interposer includes:
a plurality of first conductive vias, each of the first conductive vias being electrically connected to at least one of a ground of the first PCB or a ground of the second PCB; and
a plurality of second conductive vias, each of the second conductive vias being electrically connected to one of first signal lines of the first PCB or one of second signal lines of the second PCB,
wherein a first ratio of a number of the first conductive vias to a number of the second conductive vias in a portion of the interposer where the first conductive surface and the second conductive surface face each other is smaller than a second ratio of a number of the first conductive vias to a number of the second conductive vias in a portion of the interposer where the first conductive surface and the second non-conductive surface face each other or where the second conductive surface and the first non-conductive surface face each other.
13. The electronic device of claim 2 , wherein the interposer extends to surround the space,
wherein, when viewed in a first direction perpendicular to the extending direction of the interposer, the first conductive surface and the second conductive surface at least partially overlap.
14. The electronic device of claim 13 , wherein, when viewed in the first direction, the first conductive surface and the second non-conductive surface at least partially overlap.
15. The electronic device of claim 13 , wherein, when viewed in the first direction, the second conductive surface and the first non-conductive surface at least partially overlap.
16. The electronic device of claim 13 , wherein the first conductive surface extends along the extending direction by a first length, and the second non-conductive surface extends along the extending direction by a second length shorter than the first length.
17. The electronic device of claim 13 , wherein the second conductive surface extends along the extending direction by a third length, and the first non-conductive surface extends along the extending direction by a fourth length shorter than the third length.