Method for improved transfer of semiconductor die
A system to effectuate improved transfer of semiconductor die. A first frame secures a first substrate having the semiconductor die. A second frame secures a second substrate adjacent the first substrate. A needle is disposed adjacent to the first frame. The needle includes: a longitudinal surface extending in a direction toward the second frame, and a base end having a cross-sectional dimension being based, at least in part, on a cross-sectional dimension of the semiconductor die. A needle actuator is operably connected to the needle and is configured to actuate the needle such that, during the transfer operation, when the first substrate is secured in the first frame and the second substrate is secured in the second frame, the needle presses the semiconductor die into contact with the second substrate so as to transfer the semiconductor die onto the second substrate.
1. A method of effectuating improved transfer of a semiconductor die from a wafer tape, the method comprising:
positioning the wafer tape having the semiconductor die thereon, the semiconductor die being disposed on a first side of the wafer tape;
positioning a substrate adjacent to the wafer tape;
selecting, based, at least in part, on one or more characteristics of the semiconductor die, a needle to transfer the semiconductor die;
selecting, based, at least in part, on the one or more characteristics of the semiconductor die, a gap distance between the substrate and a bottom surface of the semiconductor die, and the bottom surface of the semiconductor die being opposite a top surface of the semiconductor die adhered to the wafer tape;
positioning, based, at least in part, on the gap distance, an end of the needle adjacent to a second surface of the wafer tape; and
transferring, via actuation of the needle, the semiconductor die onto the substrate.
2. The method of claim 1 , wherein the end of the needle includes:
a longitudinal surface extending in a direction toward the wafer tape;
a tip; and
a tapered portion interposed between the longitudinal surface and the tip, and
wherein a height of the tapered portion is based, at least in part, on a height of the semiconductor die.
3. The method of claim 1 , wherein selecting the gap distance is further based, at least in part, on an adhesion force between the semiconductor die and the wafer tape.
4. The method of claim 1 , wherein transferring the semiconductor die occurs at a predetermined rate of transfer that is based, at least in part, on an amount of adhesion force adhering the semiconductor die to the wafer tape.
5. The method of claim 1 , wherein the needle has a resting position and a transfer position,
wherein a cycle of the needle includes starting at the resting position, transitioning to the transfer position, and returning to the resting position, and
wherein a stroke rate of the cycle occurs at predetermined amount of time.
6. The method of claim 1 , wherein in the resting position, a distance between the end of the needle and the second surface of the wafer tape is about 1 mm.
7. The method of claim 1 , wherein the one or more characteristics include:
a height of the semiconductor die;
a cross-sectional dimension of the semiconductor die; or
a type of the semiconductor die.
8. The method of claim 1 , wherein the needle is configured to press the semiconductor die into contact with a conductive trace of the substrate.