Sensor with substrate including integrated electrical and chemical components and methods for fabricating the same
Analyte sensor devices and methods for fabricating analyte sensor devices are presented here. In accordance with certain embodiments, a device for detecting and/or measuring one or more analytes in fluid includes a substrate and one or more analyte sensors disposed on and/or in the substrate. Further, the device includes an integrated circuit disposed on and/or in the substrate. The integrated circuit is electrically integrated with the analyte sensors.
1 . A device for detecting and/or measuring one or more analytes in fluid, the device comprising:
a substrate comprising an integrated circuit region, an analyte sensor region, and an interconnecting region, wherein the analyte sensor region has a distal end, a proximal end contacting the interconnecting region, and a length dimension extending from the distal end to the proximal end, wherein the distal end and the length dimension are surrounded by a void in the substrate and are separated from the integrated circuit region by the void, wherein the void in the substrate extends along a straight direction along the substrate from the distal end to the proximal end of the analyte sensor region, wherein the proximal end is at a center axis of the substrate;
at least one analyte sensor disposed on and/or in the substrate in the analyte sensor region, wherein the at least one analyte sensor is configured to extend in the straight direction from the proximal end to the distal end along the length dimension in an unbent configuration and is configured to be bent or pivoted away from the straight direction; and
an integrated circuit disposed on and/or in the substrate in the integrated circuit region, wherein the integrated circuit is electrically integrated with the at least one analyte sensor.
2 . The device of claim 1 wherein the substrate has a top surface and a bottom surface opposite the top surface, wherein the integrated circuit is disposed on the top surface, and wherein the at least one analyte sensor is disposed on the bottom surface.
3 . The device of claim 1 wherein the substrate has a top surface and a bottom surface opposite the top surface, wherein the integrated circuit is disposed on the top surface, and wherein the at least one analyte sensor is disposed on the bottom surface and the top surface.
4 . The device of claim 1 wherein the substrate has a top surface and a bottom surface opposite the top surface, wherein at least a portion of the integrated circuit is located over the top surface, and wherein at least a portion of the at least one analyte sensor is located over the bottom surface.
5 . The device of claim 1 wherein the substrate has a top surface and a bottom surface opposite the top surface, wherein the integrated circuit is disposed on the top surface, and wherein the at least one analyte sensor includes a first sensor electrode disposed on the top surface and a second sensor electrode disposed on the bottom surface.
6 . The device of claim 1 wherein the substrate has a top surface and a bottom surface opposite the top surface, wherein the integrated circuit is disposed on the top surface, and wherein the at least one analyte sensor includes a first sensor electrode disposed on the top surface and on the bottom surface and wherein a second sensor electrode is disposed on the top surface and on the bottom surface.
7 . The device of claim 1 wherein the analyte sensor region is formed as a prong, wherein, in a first configuration of the substrate, the prong is co-planar with the integrated circuit region of the substrate and wherein, in a second configuration of the substrate, the prong is selectively positioned at the selected angle to the integrated circuit region of the substrate.
8 . The device of claim 1 wherein:
the interconnecting region of the substrate is partially surrounded by the void and contacts the integrated circuit region;
the interconnecting region is configured to be selectively bent such that the analyte sensor region of the substrate lies at a selected angle to the integrated circuit region of the substrate;
the device further comprises a conductive trace disposed on and/or in the substrate to electrically integrate the integrated circuit and the at least one analyte sensor; and
the conductive trace passes through the interconnecting region.
9 . The device of claim 1 wherein:
the substrate extends from a central region to the peripheral edge;
the void extends from the peripheral edge to the central region and separates a first edge of the integrated circuit region from a second edge of the integrated circuit region;
the analyte sensor region has a first edge and second edge each extending along the length dimension of the analyte sensor region;
the first edge of the analyte sensor region is spaced from the first edge of the interconnecting region by the void; and
the second edge of the analyte sensor region is spaced from the second edge of the interconnecting region by the void.
10 . The device of claim 9 wherein the peripheral edge forms the first edge of the integrated circuit region, the first edge of the analyte sensor region, the second edge of the analyte sensor region, and the second edge of the integrated circuit region.
11 . The device of claim 1 wherein:
the substrate comprises layers of flexible material including a bottom layer, a top layer, and intermediate layers between the bottom layer and the top layer,
the integrated circuit is disposed over and/or in the top layer;
the at least one analyte sensor is disposed over and/or in the bottom layer;
the bottom layer has an upper surface and a lower surface;
the at least one analyte sensor comprises a first sensor electrode disposed on and/or over the upper surface of the bottom layer and a second sensor electrode disposed on and/or over the lower surface of the bottom layer.
12 . The device of claim 1 wherein:
the substrate comprises layers of flexible material including a bottom layer, a top layer, and intermediate layers between the bottom layer and the top layer;
the integrated circuit is disposed over and/or in the top layer;
the at least one analyte sensor is disposed over and/or in the bottom layer; and
the intermediate layers contain conductive traces or conductive planes.
13 . The device of claim 1 wherein the substrate comprises a rigid layer and a flexible layer, wherein the integrated circuit is disposed over and/or in the rigid layer, and wherein the at least one analyte sensor is disposed over and/or in the flexible layer.
14 . The device of claim 1 wherein the at least one analyte sensor comprises a first analyte sensor and a second analyte sensor; wherein the substrate comprises an integrated circuit region wherein the integrated circuit is disposed, a first sensor region where the first analyte sensor is disposed, and a second sensor region where the second analyte sensor is disposed; and wherein the first sensor region and the second sensor region are selectively and independently positioned at selected angles to the integrated circuit region of the substrate such that the first analyte sensor faces a first direction and the second analyte sensor faces a second direction opposite the first direction.
15 . The device of claim 1 further comprising an annular antenna disposed on and/or in the substrate and electrically integrated with the integrated circuit, the annular antenna surrounding the at least one analyte sensor and the void.
16 . The device of claim 1 wherein the substrate has a disc-shaped sheet form, having a central region and the peripheral edge, and wherein the void extends from the central region toward the peripheral edge of the disc shape, and wherein the void has a greater width at the center relative to its width at the peripheral edge of the disc shape.
17 . The device of claim 1 wherein the void has a linear length and a width, the linear length of the void is greater than the width of the void, and the linear length of the void extends toward the peripheral edge of the disc shape.
18 . The device of claim 1 wherein the substrate comprises a sheet material and wherein the integrated circuit region, the analyte sensor region, and the interconnecting region are portions of the sheet material.
19 . The device of claim 1 wherein the substrate has a first configuration, in which the integrated circuit region, the analyte sensor region, and the interconnecting region are co-planar, and a second configuration, in which the analyte sensor region is selectively positioned at a selected angle to the integrated circuit region.
20 . The device of claim 1 wherein the analyte sensor region forms a prong extending at the interconnecting region from the integrated circuit region of the substrate, and wherein the distal end of the analyte sensor region is a free end of the prong that is separated from the integrated circuit region such that the prong may be pivoted relative to the integrated circuit region.
21 . The device of claim 1 , wherein the void in the substrate defines an edge of the substrate that extends along the entire length dimension from the distal end to the proximal end of the analyte sensor region.
22 . A method for fabricating an analyte sensor device, the method comprising:
forming conductive circuitry on and/or in a substrate that has an integrated circuit region, and an analyte sensor region;
forming at least one integrated circuit device on and/or in the integrated circuit region of the substrate, wherein the at least one integrated circuit device is selectively electrically connected to the conductive circuitry;
depositing chemistry layers on and/or in the analyte sensor region of the substrate to form at least one analyte sensor integrated into the conductive circuitry, wherein the integrated circuit device and the analyte sensor form the analyte sensor device, the analyte sensor region having a distal end, a proximal end, and a length dimension extending from the distal end to the proximal end; and
cutting the substrate to form a void in the substrate surrounding the distal end and extending along the length dimension from the distal end to the proximal end of the analyte sensor region, wherein the void extends along a straight direction along the substrate from the distal end to the proximal end of the analyte sensor region, wherein the void partially separates the at least one analyte sensor from the at least one integrated circuit device within the analyte sensor device, wherein the proximal end is at a center axis of the substrate wherein the at least one analyte sensor is configured to extend in the straight direction from the proximal end to the distal end along the length dimension in an unbent configuration and is configured to be bent or pivoted away from the straight direction.
23 . The method of claim 22 , further comprising forming an electrode on and/or in the substrate and selectively electrically connected to the conductive circuitry before forming the at least one analyte sensor, wherein the electrode electrically connects the at least one analyte sensor to the conductive circuitry.
24 . The method of claim 22 wherein cutting the substrate comprises forming a prong surrounded by the void in the substrate, wherein the at least one analyte sensor is located on or in the prong, and the prong is partially separated from integrated circuit region by the void.
25 . The method of claim 22 wherein:
the method further comprises selectively positioning the analyte sensor region of the substrate at a selected angle to the integrated circuit region of the substrate.
26 . The method of claim 22 wherein:
the method further comprises applying an adhesive to a bottom surface of the substrate over the integrated circuit region.
27 . The method of claim 22 further comprising enclosing the integrated circuit device with an overmold.
28 . The method of claim 22 further comprising:
enclosing a region of the substrate including the at least one integrated circuit device in a housing enclosure; and
forming a water-tight seal between the at least one analyte sensor and the enclosed region of the substrate.
29 . A method for fabricating analyte sensor devices, the method comprising:
providing a sheet of a substrate;
forming conductive circuitry on and/or in the substrate in selected locations;
forming at least one integrated circuit device on and/or in an integrated circuit region of the substrate in each location, wherein each integrated circuit device is selectively electrically connected to respective circuitry therein;
depositing electrochemical sensing layers on and/or in an analyte sensor region of the substrate to form an analyte sensor in each location, wherein each analyte sensor is integrated with a respective integrated circuit device to form a respective analyte sensor device, the analyte sensor region in each location having a distal end, a proximal end, and a length dimension extending from the distal end to the proximal end;
cutting the substrate to form a void in the substrate surrounding the distal end and extending along the length dimension from the distal end to the proximal end of the analyte sensor region in each location, wherein the void partially separates the analyte sensor from the rest of the substrate at each location, wherein the void extends along a straight direction along the substrate from the distal end to the proximal end of the analyte sensor region, wherein the proximal end is at a center axis of the substrate wherein the analyte sensor is configured to extend in the straight direction from the proximal end to the distal end along the length dimension in an unbent configuration and is configured to be bent or pivoted away from the straight direction, wherein within each analyte sensor device the analyte sensor is separated from the at least one integrated circuit device; and
cutting the sheet to separate each analyte sensor device.