III-V semiconductor devices with selective oxidation
View Patent ↗Embodiments of the present invention provide methods for fabricating a semiconductor device with selective oxidation. One method may include providing a semiconductor substrate including a stack of two semiconductor layers; depositing an insulating material on the semiconductor substrate; forming a set of fins; selectively oxidizing one of the semiconductor layers; forming a dummy gate structure and a set of spacers along the sides of the dummy gate structure; forming a source drain region adjacent to the dummy gate structure; removing the dummy gate structure; and releasing the selectively oxidized semiconductor layer.
1. A method for fabricating a semiconductor device with selective oxidation, the method comprising:
depositing a stack of two crystalline semiconductor layers over a base layer, wherein the base layer comprises a semiconductor substrate and a first insulator layer;
forming a selectively oxidized crystalline semiconductor layer by selectively oxidizing a first of the two crystalline semiconductor layers to yield a selectively oxidized layer that serves as an insulator for a second of the two crystalline semiconductor layers, wherein the stack of two crystalline semiconductor layers maintain a layered configuration after oxidation of the first of the two crystalline semiconductor layers;
forming a dummy gate and a set of sidewall spacers positioned adjacent to the dummy gate structure, in direct contact with sidewalls of the dummy gate;
forming source and drain regions in contact with each side of the selectively oxidized layer and the second of the two crystalline semiconductor layers;
etching the selectively oxidized crystalline semiconductor layer;
removing the dummy gate; and
forming a replacement gate layer between a plurality of walls within the set of sidewall spacers.
2. The method of claim 1 , further comprising the step of:
depositing a high-K insulator around the replacement gate layer.
3. The method of claim 1 , wherein selectively oxidizing one of the two crystalline semiconductor layers comprises exposing the semiconductor substrate in water vapor at a temperature greater than or equal to 350° and less than or equal to 550° C.
4. The method of claim 1 , wherein the base layer comprises a layer of germanium (Ge).
5. The method of claim 4 , wherein the Ge is approximately 100 nm to 1 micrometer in thickness.
6. The method of claim 1 , wherein the wherein the stack of two crystalline semiconductor layers comprises a semiconducting material selected from the group consisting of indium gallium arsenide (InGaAs), and gallium arsenide (GaAs).
7. The method of claim 1 , further comprising the steps of:
performing shallow trench isolation within the base layer to form a plurality of trenches, exposing the selectively oxidized layer and the second of the two crystalline semiconductor layers; and
depositing a second insulator into the plurality of trenches of the base layer.
8. The method of claim 7 , wherein the plurality of trenches of the base layer are filled with silicon dioxide (SiO 2 ).
9. The method of claim 1 , wherein the selectively oxidized crystalline semiconductor layer comprises aluminum oxide (Al 2 O 3 ).
10. The method of claim 1 , wherein the step of forming the dummy gate comprises:
depositing a dielectric layer over the base layer;
depositing a polysilicon layer over the dielectric layer; and
applying a lithography/gate etch process, leaving the dummy gate comprising a gate oxide and a polysilicon layer.
11. The method of claim 1 , wherein the set of sidewall spacers are composed of a dielectric selected from the group consisting of a nitride, oxide, oxynitride and a combination thereof.
12. The method of claim 11 , wherein the set of sidewall spacers are composed of silicon nitride.
13. The method of claim 1 , wherein the set of sidewall spacers have a width ranging from 2 nm to 15 nm.
14. The method of claim 1 , wherein the set of sidewall spacers is a singular spacer formed around the dummy gate.
15. The method of claim 1 , wherein the source region and the drain region are formed using an ion implantation process or epitaxy.
16. The method of claim 1 , wherein the etchant of the etching step is selected from the group consisting of a wet chemical etch, reactive-ion etching (RIE), ion beam etching, plasma etching and laser ablation.
17. The method of claim 2 , wherein the high-K insulator is selected from the group consisting of HfO, ZrO and TiO.