Semiconductor device

1. A semiconductor device comprising:

a substrate;

a gate structure on the substrate, the gate structure including a gate spacer and a gate electrode, the gate electrode extending in a first direction and having a first portion on an active region of the substrate and a second portion on a field region of the substrate; and

a first conductive connection group on the first portion of the gate electrode of the gate structure, the first conductive connection group including a ferroelectric material layer,

wherein at least a part of the ferroelectric material layer is disposed above an upper surface of the gate spacer, and the ferroelectric material layer is configured to form a ferroelectric capacitor having a negative capacitance in the first conductive connection group,

wherein the first conductive connection group includes a gate contact plug being in contact with the gate electrode, and

wherein a first width of the gate contact plug in the first direction is smaller than a width of the first portion of the gate electrode in the first direction.

2. The semiconductor device of claim 1 ,

wherein the first conductive connection group is in contact with the gate electrode.

3. The semiconductor device of claim 2 , further comprising:

a source/drain region disposed on a region adjacent to at least one side of the gate structure; and

a source/drain contact plug connected to the source/drain region,

wherein the first conductive connection group includes a gate contact plug, and

an upper surface of the source/drain contact plug is positioned at substantially the same height as an upper surface of the gate contact plug from an upper surface of the substrate.

4. The semiconductor device of claim 1 ,

wherein the gate contact plug includes the ferroelectric material layer.

5. The semiconductor device of claim 4 ,

wherein the gate contact plug further includes a barrier conductive layer and a filling conductive layer, and

the ferroelectric material layer is disposed between the barrier conductive layer and the filling conductive layer.

6. The semiconductor device of claim 1 ,

wherein the first conductive connection group further includes a first via plug and a first interlayer wiring,

the first via plug is in contact with the gate contact plug, and

the first via plug includes the ferroelectric material layer.

7. The semiconductor device of claim 6 ,

wherein the first conductive connection group further includes a second via plug and a second interlayer wiring above the first interlayer wiring.

8. The semiconductor device of claim 1 ,

wherein the first conductive connection group further includes a via plug and an interlayer wiring on the gate contact plug, the via plug being in contact with the gate contact plug,

the via plug includes a first filling conductive layer and the ferroelectric material layer, and

the interlayer wiring includes a second filling conductive layer connected to the first filling conductive layer.

9. The semiconductor device of claim 1 , further comprising:

a source/drain region disposed in a region of the substrate adjacent to at least one side of the gate structure; and

a second conductive connection group connected to the source/drain region,

wherein the second conductive connection group does not contain a ferroelectric material layer.

10. A semiconductor device comprising:

a substrate with an active region and a field region defining the active region;

a gate structure including a gate electrode, the gate electrode having a first portion on the active region of the substrate and a second portion on the field region of the substrate;

a source/drain region disposed in a region of the substrate directly adjacent to at least one side of the gate structure;

a first conductive connection group on the first portion of the gate electrode, the first conductive connection group being connected to the first portion of the gate electrode and including a ferroelectric material layer; and

a second conductive connection group, without connection to the first conductive connection group, connected to the source/drain region and disposed on the source/drain region,

wherein the first conductive connection group includes a gate contact plug being in contact with the gate electrode,

the second conductive connection group includes a source/drain contact plug being in contact with the source/drain region,

an upper surface of the gate contact plug is positioned at substantially the same height as an upper surface of the source/drain contact plug from an upper surface of the substrate, and

a height from an upper surface of the gate structure to an uppermost surface of the ferroelectric material layer is equal to or greater than a height from the upper surface of the gate structure to the upper surface of the source/drain contact plug.

11. The semiconductor device of claim 10 ,

wherein the second conductive connection group does not include a ferroelectric material layer.

12. The semiconductor device of claim 10 ,

wherein the gate contact plug includes the ferroelectric material layer.

13. The semiconductor device of claim 10 ,

wherein the first conductive connection group includes a via plug and an interlayer wiring connected to the gate contact plug, and

the ferroelectric material layer is included in at least one of the via plug and the interlayer wiring.

14. A semiconductor device comprising:

a substrate including an active region and a field region;

a first gate electrode on the substrate, the first gate electrode extending over the active region and the field region in a first direction and including a first portion on the active region and a second portion on the field region; and

a first gate contact plug on the first portion of the first gate electrode, the first gate contact plug being connected to the first gate electrode and including a ferroelectric material layer,

wherein a first width of the first gate contact plug in the first direction is smaller than a width of the first portion of the first gate electrode in the first direction.

15. The semiconductor device of claim 14 ,

wherein a second width that the first gate contact plug has in a second direction crossing the first direction is smaller than the first width that the first gate contact plug has in the first direction.

16. The semiconductor device of claim 14 ,

wherein a second width that the first gate contact plug has in a second direction crossing the first direction is greater than the first width that the first gate contact plug has in the first direction.

17. The semiconductor device of claim 14 ,

wherein the first gate contact plug is in contact with the first gate electrode.

18. The semiconductor device of claim 14 , further comprising:

a via plug on the first gate contact plug; and

an insertion wiring disposed between the first gate contact plug and the via plug.

19. The semiconductor device of claim 18 , further comprising:

a second gate electrode extending over the active region and the field region in the first direction; and

a second gate contact plug on the second gate electrode,

wherein the insertion wiring is further disposed between the second gate contact plug and the via plug and connects the second gate contact plug to the first gate contact plug.