Programmable resistive memory element and a method of making the same
A programmable resistive memory element and a method of adjusting a resistance of a programmable resistive memory element are provided. The programmable resistive memory element includes at least one resistive memory element. Each resistive memory element includes an Indium-Gallium-Zinc-Oxide (IGZO) resistive layer, a first electrical contact and a second electrical contact. The first and second electrical contacts are disposed on the IGZO resistive layer in the same plane. The programmable resistive memory element includes a voltage generator coupled to the first and second electrical contacts, constructed and arranged to apply a thermal treatment to the resistive memory element to adjust a resistance of the resistive memory element.
1. A programmable resistive element with multiple resistance states, comprising:
an Indium-Gallium-Zinc-Oxide (IGZO) resistive layer;
a first electrical contact and a second electrical contact disposed on the IGZO resistive layer in a same plane; and
a voltage generator coupled to the first and second electrical contacts, constructed and arranged to apply a thermal treatment to the resistive memory element to adjust a resistance of the resistive memory element, wherein the thermal treatment is performed by applying one or more voltage sweeps to the IGZO resistive layer with an upper voltage limit.
2. The programmable resistive memory element of claim 1 , wherein the upper voltage limit is set within a range between a few volts to a few tens of volts.
3. The programmable resistive memory element of claim 1 , wherein an upper limit of the voltage sweep is set based on a desired resistance state for the IGZO resistor layer.
4. The programmable resistive memory element e of claim 1 , wherein the resistive memory element operates as a read-only programmable memory after the element resistance is adjusted from a lower resistance state to one or more higher resistance states by applying the on-chip thermal treatment of the resistive memory element, thereby making its resistance irreversible.
5. The programmable resistive memory element of claim 3 , wherein a current flowing through the IGZO layer biased with a low voltage is measured to read a resistance value associated with each of the plurality of higher resistance states of the resistive memory element.
6. The programmable resistive memory element of claim 1 , wherein the first electrical contact and the second electrical contact are apart from each other.
7. The programmable resistive memory element of claim 1 , wherein the first and second electrical contacts are made of at least one of Ti/Au, Al, Mo, indium tin oxide (ITO), aluminum zinc oxide (AZO), or any combination thereof.
8. The programmable resistive memory element of claim 1 , further comprising a dielectric layer disposed between the IGZO layer and the substrate.
9. The programmable resistive memory element of claim 8 , wherein the dielectric layer is made of at least one of SiO2, Al2O3, AlN, or any combination thereof.
10. A method of adjusting a resistance of a programmable resistive memory element, including an Indium-Gallium-Zinc-Oxide (IGZO) resistive layer and a first electrical contact and a second electrical contact on the IGZO resistive layer in the same plane, the method comprising:
applying an on-chip thermal treatment to the resistive memory element to adjust a resistance of the resistive memory element from a first resistance state to a second resistance state, the second resistive sate being higher than the first resistive state, wherein the thermal treatment is performed by applying one or more voltage sweeps to the IGZO resistive layer with an upper voltage limit.
11. The method of claim 10 , further comprising setting the one or more voltage sweeps within a range between a few volts to a few tens of volts.
12. The method of claim 10 , further comprising setting an upper limit of the voltage sweep based on a desired resistance state for the IGZO resistor layer.
13. The method of claim 10 , wherein the on-chip thermal treatment adjusts the resistive memory element from a lower resistance state to any of a plurality of higher resistance states, thereby making the element resistance irreversible.
14. The method of claim 12 , further comprising measuring a current flowing through the IGZO layer biased with a low voltage to read a resistance value associated with each of the plurality of higher states of the resistive memory element.
15. The method of claim 10 , wherein the first electrical contact and the second electrical contact are apart from each other.
16. The method of claim 10 , wherein the first and second electrical contacts are made of at least one of Ti/Au, Al, Mo, indium tin oxide (ITO), aluminum zinc oxide (AZO), or any combination thereof.
17. The method of claim 10 , further comprising providing a dielectric layer disposed between the IGZO layer and the substrate.
18. The method of claim 17 , wherein the dielectric layer is made of at least one of SiO2, Al2O3, AN, or any combination thereof.